Inventor · disambiguated record
Roey Shaviv
Also filed as: SHAVIV ROEY
52 granted patents·18 pending applications·405 citations·filing 2003–2024
98Inventor score
Files withAPPLIED MATERIALS INC52NOVELLUS SYSTEMS INC12SHAVIV ROEY3CHAN LANA1TOWER SEMICONDUCTOR LTD1
Top patents by PatentIndex Score
70 records- 0197US7576006B1Protective self-aligned buffer layers for damascene interconnectsNOVELLUS SYSTEMS INC·Filed 2007·Granted Aug 18, 2009·55 cites·19 claims
- 0296US9378976B2Method for forming interconnectsAPPLIED MATERIALS INC·Filed 2015·Granted Jun 28, 2016·14 cites·8 claims
- 0395US9034760B2Methods of forming tensile tungsten films and compressive tungsten filmsNOVELLUS SYSTEMS INC·Filed 2013·Granted May 19, 2015·25 cites·21 claims
- 0495US7396759B1Protection of Cu damascene interconnects by formation of a self-aligned buffer layerNOVELLUS SYSTEMS INC·Filed 2004·Granted Jul 8, 2008·105 cites·15 claims
- 0594US8021486B1Protective self-aligned buffer layers for damascene interconnectsNOVELLUS SYSTEMS INC·Filed 2010·Granted Sep 20, 2011·14 cites·18 claims
- 0694US7964504B1PVD-based metallization methods for fabrication of interconnections in semiconductor devicesNOVELLUS SYSTEMS INC·Filed 2008·Granted Jun 21, 2011·37 cites·42 claims
- 0793US7745332B1PVD-based metallization methods for fabrication of interconnections in semiconductor devicesNOVELLUS SYSTEMS INC·Filed 2008·Granted Jun 29, 2010·24 cites·62 claims
- 0892US9117884B1Conformal films on semiconductor substratesSHAVIV ROEY·Filed 2012·Granted Aug 25, 2015·20 cites·20 claims
- 0991US11692261B2Evaporator chamber for forming films on substratesAPPLIED MATERIALS INC·Filed 2020·Granted Jul 4, 2023·2 cites·17 claims
- 1091US11393703B2Apparatus and method for controlling a flow process material to a deposition chamberAPPLIED MATERIALS INC·Filed 2019·Granted Jul 19, 2022·6 cites·14 claims
- 1191US8030777B1Protection of Cu damascene interconnects by formation of a self-aligned buffer layerNOVELLUS SYSTEMS INC·Filed 2007·Granted Oct 4, 2011·18 cites·20 claims
- 1291US7704873B1Protective self-aligned buffer layers for damascene interconnectsNOVELLUS SYSTEMS INC·Filed 2007·Granted Apr 27, 2010·14 cites·27 claims
- 1390US8298933B2Conformal films on semiconductor substratesSHAVIV ROEY·Filed 2009·Granted Oct 30, 2012·19 cites·19 claims
- 1489US9425092B2Methods for producing interconnects in semiconductor devicesAPPLIED MATERIALS INC·Filed 2014·Granted Aug 23, 2016·8 cites·18 claims
- 1588US8053861B2Diffusion barrier layersNOVELLUS SYSTEMS INC·Filed 2009·Granted Nov 8, 2011·12 cites·24 claims
- 1686US9691660B2Method for forming interconnectsAPPLIED MATERIALS INC·Filed 2016·Granted Jun 27, 2017·4 cites·15 claims
- 1785US9805976B2Co or Ni and Cu integration for small and large features in integrated circuitsAPPLIED MATERIALS INC·Filed 2016·Granted Oct 31, 2017·3 cites·21 claims
- 1885US9768060B2Systems and methods for electrochemical deposition on a workpiece including removing contamination from seed layer surface prior to ECDAPPLIED MATERIALS INC·Filed 2014·Granted Sep 19, 2017·6 cites·18 claims
- 1984US11970775B2Showerhead for providing multiple materials to a process chamberAPPLIED MATERIALS INC·Filed 2019·Granted Apr 30, 2024·2 cites·17 claims
- 2083US12043895B2Methods of using a segmented showerhead for uniform delivery of multiple pre-cursorsAPPLIED MATERIALS INC·Filed 2022·Granted Jul 23, 2024·0 cites·20 claims
- 2178US11075165B2Methods and apparatus for forming dual metal interconnectsAPPLIED MATERIALS INC·Filed 2019·Granted Jul 27, 2021·2 cites·18 claims
- 2277US12473639B2Methods for forming films on substratesAPPLIED MATERIALS INC·Filed 2022·Granted Nov 18, 2025·0 cites·14 claims
- 2377US10062607B2Methods for producing interconnects in semiconductor devicesAPPLIED MATERIALS INC·Filed 2016·Granted Aug 28, 2018·2 cites·14 claims
- 2476US10163696B2Selective cobalt removal for bottom up gapfillAPPLIED MATERIALS INC·Filed 2016·Granted Dec 25, 2018·2 cites·18 claims
- 2575US9496145B2Electrochemical plating methodsAPPLIED MATERIALS INC·Filed 2014·Granted Nov 15, 2016·3 cites·12 claims
- 2675US2025029874A1Low Resistance and High Reliability Metallization ModuleAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2771US12438011B2Apparatus and method for controlling a flow process material to a deposition chamberAPPLIED MATERIALS INC·Filed 2022·Granted Oct 7, 2025·0 cites·20 claims
- 2870US8753978B2Metal and silicon containing capping layers for interconnectsYU JENGYI·Filed 2012·Granted Jun 17, 2014·2 cites·21 claims
- 2969US10081881B2Electroplating apparatus with membrane tube shieldAPPLIED MATERIALS INC·Filed 2016·Granted Sep 25, 2018·0 cites·13 claims
- 3067US11505863B2Methods for forming films on substratesAPPLIED MATERIALS INC·Filed 2020·Granted Nov 22, 2022·0 cites·14 claims
- 3166US10487410B2Enhanced plating bath and additive chemistries for cobalt platingAPPLIED MATERIALS INC·Filed 2017·Granted Nov 26, 2019·1 cites·19 claims
- 3266US7670931B2Methods for fabricating semiconductor structures with backside stress layersNOVELLUS SYSTEMS INC·Filed 2007·Granted Mar 2, 2010·3 cites·20 claims
- 3365US12148660B2Low resistance and high reliability metallization moduleAPPLIED MATERIALS INC·Filed 2021·Granted Nov 19, 2024·0 cites·10 claims
- 3465US9613825B2Photoresist strip processes for improved device integritySHAVIV ROEY·Filed 2012·Granted Apr 4, 2017·2 cites·18 claims
- 3565US9469911B2Electroplating apparatus with membrane tube shieldAPPLIED MATERIALS INC·Filed 2015·Granted Oct 18, 2016·0 cites·10 claims
- 3664US11948885B2Methods and apparatus for forming dual metal interconnectsAPPLIED MATERIALS INC·Filed 2021·Granted Apr 2, 2024·0 cites·20 claims
- 3764US11056277B2Magnetized substrate carrier apparatus with shadow mask for depositionAPPLIED MATERIALS INC·Filed 2019·Granted Jul 6, 2021·0 cites·20 claims
- 3862US11834743B2Segmented showerhead for uniform delivery of multiple precursorsAPPLIED MATERIALS INC·Filed 2019·Granted Dec 5, 2023·0 cites·16 claims
- 3958US9758896B2Forming cobalt interconnections on a substrateAPPLIED MATERIALS INC·Filed 2015·Granted Sep 12, 2017·0 cites·8 claims
- 4058US2020219720A1Apparatus and methods for asymmetric deposition of metal on high aspect ratio nanostructuresAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 4157US11118278B2Enhanced plating bath and additive chemistries for cobalt platingAPPLIED MATERIALS INC·Filed 2019·Granted Sep 14, 2021·0 cites·20 claims
- 4257US10770346B2Selective cobalt removal for bottom up gapfillAPPLIED MATERIALS INC·Filed 2018·Granted Sep 8, 2020·0 cites·20 claims
- 4357US2017159199A1Forming cobalt interconnections on a substrateAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
- 4456US10622252B2Co or Ni and Cu integration for small and large features in integrated circuitsAPPLIED MATERIALS INC·Filed 2017·Granted Apr 14, 2020·0 cites·22 claims
- 4555US10636655B2Methods for asymmetric deposition of metal on high aspect ratio nanostructuresAPPLIED MATERIALS INC·Filed 2018·Granted Apr 28, 2020·0 cites·14 claims
- 4655US2021069745A1Vapor delivery methods and apparatusAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 4754US11024537B2Methods and apparatus for hybrid feature metallizationAPPLIED MATERIALS INC·Filed 2019·Granted Jun 1, 2021·0 cites·20 claims
- 4853US2014216336A1Metal and silicon containing capping layers for interconnectsNOVELLUS SYSTEMS INC·Filed 2014·Application pending·0 cites
- 4952US11414740B2Processing system for forming layersAPPLIED MATERIALS INC·Filed 2020·Granted Aug 16, 2022·0 cites·22 claims
- 5051US11538706B2System and method for aligning a mask with a substrateAPPLIED MATERIALS INC·Filed 2020·Granted Dec 27, 2022·0 cites·20 claims
Showing the top 50 of 70 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →