Inventor · disambiguated record
Rodney Smedt
Also filed as: SMEDT RODNEY · SMEDT RODNEY C
31 granted patents·3 pending applications·558 citations·filing 1999–2024
97Inventor score
Top patents by PatentIndex Score
34 records- 0197US9588066B2Methods and systems for measuring periodic structures using multi-angle X-ray reflectance scatterometry (XRS)POIS HEATH A·Filed 2014·Granted Mar 7, 2017·44 cites·10 claims
- 0297US8179530B2Methods and systems for determining a critical dimension and overlay of a specimenLEVY ADY·Filed 2010·Granted May 15, 2012·143 cites·24 claims
- 0396US7751046B2Methods and systems for determining a critical dimension and overlay of a specimenKLA TENCOR TECH CORP·Filed 2003·Granted Jul 6, 2010·79 cites·13 claims
- 0496US6806951B2Methods and systems for determining at least one characteristic of defects on at least two sides of a specimenKLA TENCOR TECH CORP·Filed 2001·Granted Oct 19, 2004·65 cites·74 claims
- 0595US10119925B2Methods and systems for measuring periodic structures using multi-angle X-ray reflectance scatterometry (XRS)NOVA MEASURING INSTR INC·Filed 2017·Granted Nov 6, 2018·7 cites·25 claims
- 0695US8502979B2Methods and systems for determining a critical dimension and overlay of a specimenLEVY ADY·Filed 2012·Granted Aug 6, 2013·24 cites·8 claims
- 0793US6721052B2Systems for measuring periodic structuresKLA TECHNOLOGIES CORP·Filed 2000·Granted Apr 13, 2004·56 cites·101 claims
- 0892US10481112B2Methods and systems for measuring periodic structures using multi-angle X-ray reflectance scatterometry (XRS)NOVA MEASURING INSTR INC·Filed 2018·Granted Nov 19, 2019·4 cites·20 claims
- 0992US7193715B2Measurement of overlay using diffraction gratings when overlay exceeds the grating periodTOKYO ELECTRON LTD·Filed 2003·Granted Mar 20, 2007·46 cites·22 claims
- 1091US10859519B2Methods and systems for measuring periodic structures using multi-angle x-ray reflectance scatterometry (XRS)NOVA MEASURING INSTR INC·Filed 2019·Granted Dec 8, 2020·3 cites·25 claims
- 1191US10056242B2Systems and approaches for semiconductor metrology and surface analysis using secondary ion mass spectrometryNOVA MEASURING INSTR INC·Filed 2016·Granted Aug 21, 2018·5 cites·13 claims
- 1289US7209227B2Backside contamination inspection deviceKLA TENCOR CORP·Filed 2006·Granted Apr 24, 2007·9 cites·20 claims
- 1388US12360063B2System and method for measuring a sample by x-ray reflectance scatterometryNOVA MEASURING INSTR INC·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 1486US12165863B2Systems and approaches for semiconductor metrology and surface analysis using secondary ion mass spectrometryNOVA MEASURING INSTR INC·Filed 2023·Granted Dec 10, 2024·0 cites·18 claims
- 1584US7009696B2Method and apparatus for scanning, stitching, and damping measurements of a double-sided metrology inspection toolKLA TENCOR CORP·Filed 2004·Granted Mar 7, 2006·19 cites·21 claims
- 1682US11764050B2Systems and approaches for semiconductor metrology and surface analysis using secondary ion mass spectrometryNOVA MEASURING INSTR INC·Filed 2022·Granted Sep 19, 2023·0 cites·20 claims
- 1780US9240254B2System and method for characterizing a film by X-ray photoelectron and low-energy X-ray fluorescence spectroscopySCHUELER BRUNO W·Filed 2011·Granted Jan 19, 2016·5 cites·16 claims
- 1880US6414752B1Method and apparatus for scanning, stitching, and damping measurements of a double-sided metrology inspection toolKLA TENCOR TECH CORP·Filed 1999·Granted Jul 2, 2002·34 cites·16 claims
- 1976US11430647B2Systems and approaches for semiconductor metrology and surface analysis using Secondary Ion Mass SpectrometryNOVA MEASURING INSTR INC·Filed 2021·Granted Aug 30, 2022·0 cites·21 claims
- 2073US10910208B2Systems and approaches for semiconductor metrology and surface analysis using secondary ion mass spectrometryNOVA MEASURING INSTR INC·Filed 2020·Granted Feb 2, 2021·0 cites·20 claims
- 2172US11874237B2System and method for measuring a sample by x-ray reflectance scatterometryNOVA MEASURING INSTR INC·Filed 2020·Granted Jan 16, 2024·0 cites·19 claims
- 2269US10636644B2Systems and approaches for semiconductor metrology and surface analysis using secondary ion mass spectrometryNOVA MEASURING INSTR INC·Filed 2019·Granted Apr 28, 2020·0 cites·7 claims
- 2369US7433037B2System for measuring periodic structuresKLA TENCOR TECH CORP·Filed 2006·Granted Oct 7, 2008·1 cites·17 claims
- 2467US7724357B2Backside contamination inspection deviceKLA TENCOR CORP·Filed 2007·Granted May 25, 2010·1 cites·20 claims
- 2566US10403489B2Systems and approaches for semiconductor metrology and surface analysis using secondary ion mass spectrometryNOVA MEASURING INSTR INC·Filed 2018·Granted Sep 3, 2019·0 cites·22 claims
- 2665US6686996B2Method and apparatus for scanning, stitching, and damping measurements of a double-sided metrology inspection toolKLA TENCOR CORP·Filed 2002·Granted Feb 3, 2004·7 cites·40 claims
- 2757US2013314710A1Methods and Systems for Determining a Critical Dimension and Overlay of a SpecimenKLA TENCOR TECH CORP·Filed 2013·Application pending·0 cites
- 2856US7436506B2Method and apparatus for scanning, stitching, and damping measurements of a double-sided metrology inspection toolKLA TENCOR CORP·Filed 2006·Granted Oct 14, 2008·1 cites·20 claims
- 2953US2004141177A1System for measuring periodic structuresFiled 2003·Application pending·0 cites
- 3052US7663746B2Method and apparatus for scanning, stitching and damping measurements of a double sided metrology inspection toolKLA TENCOR TECHOLOGIES CORP·Filed 2008·Granted Feb 16, 2010·1 cites·20 claims
- 3150US6870617B2Accurate small-spot spectrometry systems and methodsTHERMA WAVE INC·Filed 2004·Granted Mar 22, 2005·2 cites·16 claims
- 3250US6738136B2Accurate small-spot spectrometry instrumentTHERMA WAVE INC·Filed 2002·Granted May 18, 2004·2 cites·12 claims
- 3348US9297771B2Methods and systems for fabricating platelets of a monochromator for X-ray photoelectron spectroscopyFANTON JEFFREY T·Filed 2013·Granted Mar 29, 2016·0 cites·18 claims
- 3441US2005099627A1System for measuring periodic structuresFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →