Inventor · disambiguated record
Ruben Madrid
Also filed as: MADRID RUBEN · MADRID RUBEN P
18 granted patents·7 pending applications·707 citations·filing 1997–2011
95Inventor score
Technology areasH10W
Files withFAIRCHILD SEMICONDUCTOR12MADRID RUBEN P4TEXAS INSTRUMENTS INC4MADRID RUBEN2FAIRCHILD SEMICONDUCTOR INC1
Top patents by PatentIndex Score
25 records- 0198US6777800B2Semiconductor die package including drain clipFAIRCHILD SEMICONDUCTOR·Filed 2002·Granted Aug 17, 2004·264 cites·14 claims
- 0297US6893901B2Carrier with metal bumps for semiconductor die packagesFAIRCHILD SEMICONDUCTOR·Filed 2001·Granted May 17, 2005·125 cites·13 claims
- 0395US7663211B2Dual side cooling integrated power device package and module with a clip attached to a leadframe in the package and the module and methods of manufactureFAIRCHILD SEMICONDUCTOR·Filed 2007·Granted Feb 16, 2010·40 cites·20 claims
- 0495US7023077B2Carrier with metal bumps for semiconductor die packagesFAIRCHILD SEMICONDUCTOR·Filed 2004·Granted Apr 4, 2006·92 cites·17 claims
- 0592US6646329B2Power chip scale packageFAIRCHILD SEMICONDUCTOR INC·Filed 2001·Granted Nov 11, 2003·66 cites·8 claims
- 0688US8193622B2Thermally enhanced thin semiconductor packageMADRID RUBEN P·Filed 2010·Granted Jun 5, 2012·11 cites·25 claims
- 0787US8193618B2Semiconductor die package with clip interconnectionMADRID RUBEN P·Filed 2008·Granted Jun 5, 2012·18 cites·20 claims
- 0880US7821116B2Semiconductor die package including leadframe with die attach pad with folded edgeFAIRCHILD SEMICONDUCTOR·Filed 2007·Granted Oct 26, 2010·8 cites·17 claims
- 0978US7576429B2Packaged semiconductor device with dual exposed surfaces and method of manufacturingFAIRCHILD SEMICONDUCTOR·Filed 2006·Granted Aug 18, 2009·7 cites·7 claims
- 1078US6707135B2Semiconductor leadframe for staggered board attachTEXAS INSTRUMENTS INC·Filed 2001·Granted Mar 16, 2004·24 cites·9 claims
- 1175US6861286B2Method for making power chip scale packageFAIRCHILD SEMICONDUCTOR·Filed 2003·Granted Mar 1, 2005·18 cites·10 claims
- 1272US7402462B2Folded frame carrier for MOSFET BGAFAIRCHILD SEMICONDUCTOR·Filed 2005·Granted Jul 22, 2008·8 cites·26 claims
- 1367US7893548B2SiP substrateFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Feb 22, 2011·3 cites·12 claims
- 1460US7816178B2Packaged semiconductor device with dual exposed surfaces and method of manufacturingFAIRCHILD SEMICONDUCTOR·Filed 2009·Granted Oct 19, 2010·1 cites·7 claims
- 1559US7002240B2Semiconductor leadframe for staggered board attachTEXAS INSTRUMENTS INC·Filed 2004·Granted Feb 21, 2006·7 cites·8 claims
- 1651US2010164078A1Package assembly for semiconductor devicesMADRID RUBEN·Filed 2008·Application pending·0 cites
- 1747US8372690B2SiP substrateFAIRCHILD SEMICONDUCTOR·Filed 2011·Granted Feb 12, 2013·0 cites·12 claims
- 1847US2006131747A1Carrier with metal bumps for semiconductor die packagesMADRID RUBEN·Filed 2006·Application pending·0 cites
- 1947US2009057852A1Thermally enhanced thin semiconductor packageMADRID RUBEN P·Filed 2007·Application pending·0 cites
- 2045US6006981AWirefilm bonding for electronic component interconnectionTEXAS INSTRUMENTS INC·Filed 1997·Granted Dec 28, 1999·11 cites·14 claims
- 2145US2011244633A1Package assembly for semiconductor devicesMADRID RUBEN P·Filed 2011·Application pending·0 cites
- 2245US2011008935A1Semiconductor die package including leadframe with die attach pad with folded edgeFAIRCHILD SEMICONDUCTOR·Filed 2010·Application pending·0 cites
- 2342US2009057855A1Semiconductor die package including stand off structuresQUINONES MARIA CLEMENS·Filed 2007·Application pending·0 cites
- 2435US6857459B1Wirefilm bonding for electronic component interconnectionTEXAS INSTRUMENTS INC·Filed 1999·Granted Feb 22, 2005·4 cites·17 claims
- 2535US2002081772A1Method and system for manufacturing ball grid array ("BGA") packagesFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →