Inventor · disambiguated record
Ryan O. Jung
Also filed as: JUNG RYAN · JUNG RYAN O
32 granted patents·2 pending applications·354 citations·filing 2011–2021
97Inventor score
Top patents by PatentIndex Score
34 records- 0198US9362179B1Method to form dual channel semiconductor material finsIBM·Filed 2015·Granted Jun 7, 2016·41 cites·14 claims
- 0297USD868731SHeadphoneSKULLCANDY INC·Filed 2018·Granted Dec 3, 2019·79 cites·1 claims
- 0397US9659786B2Gate cut with high selectivity to preserve interlevel dielectric layerIBM·Filed 2015·Granted May 23, 2017·18 cites·20 claims
- 0495US9842739B2Method and structure for enabling high aspect ratio sacrificial gatesIBM·Filed 2016·Granted Dec 12, 2017·8 cites·16 claims
- 0595US9318574B2Method and structure for enabling high aspect ratio sacrificial gatesIBM·Filed 2014·Granted Apr 19, 2016·16 cites·15 claims
- 0693USD869432SHeadphoneSKULLCANDY INC·Filed 2018·Granted Dec 10, 2019·39 cites·1 claims
- 0793US9900680B2Wireless earbuds and related methodsSKULLCANDY INC·Filed 2016·Granted Feb 20, 2018·14 cites·20 claims
- 0893US9601335B2Trench formation for dielectric filled cut regionIBM·Filed 2016·Granted Mar 21, 2017·7 cites·13 claims
- 0992US8735296B2Method of simultaneously forming multiple structures having different critical dimensions using sidewall transferJUNG RYAN O·Filed 2012·Granted May 27, 2014·18 cites·25 claims
- 1091US9837276B2Gate cut with high selectivity to preserve interlevel dielectric layerIBM·Filed 2016·Granted Dec 5, 2017·5 cites·20 claims
- 1191US9601366B2Trench formation for dielectric filled cut regionIBM·Filed 2015·Granted Mar 21, 2017·6 cites·7 claims
- 1290US9786666B2Method to form dual channel semiconductor material finsIBM·Filed 2016·Granted Oct 10, 2017·5 cites·13 claims
- 1390US9659779B2Method and structure for enabling high aspect ratio sacrificial gatesIBM·Filed 2014·Granted May 23, 2017·7 cites·16 claims
- 1488USD908114SEarbud headsetSKULLCANDY INC·Filed 2019·Granted Jan 19, 2021·32 cites·1 claims
- 1586USD877721SPair of earbud headsetsSKULLCANDY INC·Filed 2018·Granted Mar 10, 2020·24 cites·1 claims
- 1686US9214360B2Methods of patterning features having differing widthsGLOBALFOUNDRIES INC·Filed 2013·Granted Dec 15, 2015·6 cites·17 claims
- 1784US8673165B2Sidewall image transfer process with multiple critical dimensionsRAGHUNATHAN SUDHARSHANAN·Filed 2011·Granted Mar 18, 2014·11 cites·20 claims
- 1877US10629698B2Method and structure for enabling high aspect ratio sacrificial gatesIBM·Filed 2017·Granted Apr 21, 2020·1 cites·15 claims
- 1971US9184042B1Wafer backside particle mitigationIBM·Filed 2014·Granted Nov 10, 2015·2 cites·17 claims
- 2064USD899399SEarbud headsetSKULLCANDY INC·Filed 2019·Granted Oct 20, 2020·9 cites·1 claims
- 2164US8637406B1Image transfer process employing a hard mask layerJUNG RYAN O·Filed 2012·Granted Jan 28, 2014·1 cites·24 claims
- 2263US10586706B2Gate cut with high selectivity to preserve interlevel dielectric layerIBM·Filed 2018·Granted Mar 10, 2020·0 cites·18 claims
- 2361US9530864B2Junction overlap control in a semiconductor device using a sacrificial spacer layerGLOBALFOUNDRIES INC·Filed 2014·Granted Dec 27, 2016·1 cites·20 claims
- 2460US10957544B2Gate cut with high selectivity to preserve interlevel dielectric layerIBM·Filed 2017·Granted Mar 23, 2021·0 cites·15 claims
- 2560US8716133B2Three photomask sidewall image transfer methodCHEN SHYNG-TSONG·Filed 2012·Granted May 6, 2014·1 cites·20 claims
- 2656USRE48968EWireless earbuds and related methodsSKULLCANDY INC·Filed 2019·Granted Mar 8, 2022·0 cites·38 claims
- 2756US10446452B2Method and structure for enabling controlled spacer RIEIBM·Filed 2017·Granted Oct 15, 2019·0 cites·14 claims
- 2853US12339521B2Eyeglasses with associated true wireless earbudsSKULLCANDY INC·Filed 2021·Granted Jun 24, 2025·0 cites·17 claims
- 2951US9627277B2Method and structure for enabling controlled spacer RIEIBM·Filed 2015·Granted Apr 18, 2017·0 cites·10 claims
- 3051US9466505B2Methods of patterning features having differing widthsGLOBALFOUNDRIES INC·Filed 2015·Granted Oct 11, 2016·0 cites·18 claims
- 3149US9318347B2Wafer backside particle mitigationIBM·Filed 2014·Granted Apr 19, 2016·0 cites·19 claims
- 3248US2014023834A1Image transfer process employing a hard mask layerJUNG RYAN O·Filed 2012·Application pending·0 cites
- 3344USD907597SEarbud headsetSKULLCANDY INC·Filed 2019·Granted Jan 12, 2021·3 cites·1 claims
- 3439US2018059402A1Tunable diffraction gratingHONEYWELL INT INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →