Inventor · disambiguated record
Ryoichi Kajiwara
Also filed as: KAJIWARA RYOICHI
33 granted patents·6 pending applications·822 citations·filing 1981–2015
98Inventor score
Top patents by PatentIndex Score
39 records- 0198US6774466B1Semiconductor deviceRENESAS TECH CORP·Filed 2000·Granted Aug 10, 2004·162 cites·2 claims
- 0296US6798072B2Flip chip assembly structure for semiconductor device and method of assembling thereforHITACHI LTD·Filed 2001·Granted Sep 28, 2004·144 cites·12 claims
- 0394US7985991B2MOSFET packageRENESAS ELECTRONICS CORP·Filed 2008·Granted Jul 26, 2011·16 cites·30 claims
- 0491US8183607B2Semiconductor deviceKAJIWARA RYOICHI·Filed 2011·Granted May 22, 2012·8 cites·4 claims
- 0590US7400002B2MOSFET packageRENESAS TECH CORP·Filed 2006·Granted Jul 15, 2008·11 cites·20 claims
- 0690US7332757B2MOSFET packageRENESAS TECH CORP·Filed 2006·Granted Feb 19, 2008·11 cites·8 claims
- 0789US7342267B2MOSFET packageRENESAS TECH CORP·Filed 2006·Granted Mar 11, 2008·10 cites·48 claims
- 0889US6784554B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2002·Granted Aug 31, 2004·49 cites·10 claims
- 0987US8314484B2Semiconductor device and method of manufacturing the sameKAJIWARA RYOICHI·Filed 2010·Granted Nov 20, 2012·9 cites·10 claims
- 1086US8455986B2Mosfet packageKAJIWARA RYOICHI·Filed 2012·Granted Jun 4, 2013·4 cites·12 claims
- 1186US7608917B2Power semiconductor moduleHITACHI LTD·Filed 2007·Granted Oct 27, 2009·15 cites·15 claims
- 1285US7879455B2High-temperature solder, high-temperature solder paste and power semiconductor using sameHITACHI LTD·Filed 2006·Granted Feb 1, 2011·14 cites·8 claims
- 1385US6569764B1Method of manufacturing a semiconductor package by attaching a lead frame to a semiconductor chip via projecting electrodes and an insulating sheet of resin materialHITACHI LTD·Filed 2000·Granted May 27, 2003·43 cites·5 claims
- 1484US7816780B2Semiconductor apparatus and manufacturing method of semiconductor apparatusRENESAS ELECTRONICS CORP·Filed 2007·Granted Oct 19, 2010·12 cites·10 claims
- 1583US8643185B2Semiconductor apparatus, manufacturing method of semiconductor apparatus, and joint materialKAJIWARA RYOICHI·Filed 2008·Granted Feb 4, 2014·13 cites·11 claims
- 1683US8629352B2Enameled insulated wire and manufacturing method thereofANDO YOSHIYUKI·Filed 2010·Granted Jan 14, 2014·4 cites·10 claims
- 1782US8816411B2Mosfet packageRENESAS ELECTRONICS CORP·Filed 2013·Granted Aug 26, 2014·3 cites·8 claims
- 1881US5884835AUltrasonic bonding method and ultrasonic bonding apparatusHITACHI LTD·Filed 1996·Granted Mar 23, 1999·60 cites·8 claims
- 1978US7394146B2MOSFET packageRENESAS TEHCNOLOGY CORP·Filed 2006·Granted Jul 1, 2008·5 cites·30 claims
- 2078US5431324AUltrasonic bonding apparatus and quality monitoring methodHITACHI LTD·Filed 1993·Granted Jul 11, 1995·69 cites·12 claims
- 2176US4740866ASealed-type liquid cooling device with expandable bellow for semiconductor chipsHITACHI LTD·Filed 1986·Granted Apr 26, 1988·52 cites·9 claims
- 2273US8303854B2Sintering silver paste material and method for bonding semiconductor chipKAJIWARA RYOICHI·Filed 2011·Granted Nov 6, 2012·4 cites·4 claims
- 2370US9177833B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2013·Granted Nov 3, 2015·3 cites·4 claims
- 2467US9736952B2Vehicle-mounted electronic moduleHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2014·Granted Aug 15, 2017·5 cites·6 claims
- 2564US4996589ASemiconductor module and cooling device of the sameHITACHI LTD·Filed 1988·Granted Feb 26, 1991·30 cites·11 claims
- 2662US8492202B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2012·Granted Jul 23, 2013·1 cites·10 claims
- 2762US5323952ABonding apparatus and testing apparatus of a bonded portionHITACHI LTD·Filed 1992·Granted Jun 28, 1994·37 cites·10 claims
- 2859US9209044B2Metal-resin composite, method for producing the same, busbar, module case, and resinous connector partKAJIWARA RYOICHI·Filed 2011·Granted Dec 8, 2015·1 cites·6 claims
- 2959US7964975B2Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for themHITACHI LTD·Filed 2009·Granted Jun 21, 2011·1 cites·6 claims
- 3053US4809058AIntegrated circuit deviceHITACHI LTD·Filed 1986·Granted Feb 28, 1989·20 cites·15 claims
- 3153US2007029540A1Semiconductor deviceKAJIWARA RYOICHI·Filed 2006·Application pending·0 cites
- 3246US8313983B2Fabrication method for resin-encapsulated semiconductor deviceKAJIWARA RYOICHI·Filed 2011·Granted Nov 20, 2012·0 cites·12 claims
- 3345US8975747B2Wiring material and semiconductor module using the sameANDO TAKASHI·Filed 2012·Granted Mar 10, 2015·0 cites·15 claims
- 3444US2004217474A1Semiconductor deviceFiled 2004·Application pending·0 cites
- 3543US4454408AMethod for controlling arc welding and apparatus thereforHITACHI LTD·Filed 1981·Granted Jun 12, 1984·6 cites·14 claims
- 3643US2004150082A1Semiconductor deviceFiled 2004·Application pending·0 cites
- 3743US2014264383A1Semiconductor device and manufacturing method of the sameRENESAS ELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 3843US2016010213A1Metal-resin composite, method for producing the same, busbar, module case, and resinous connector partHITACHI LTD·Filed 2015·Application pending·0 cites
- 3937US2003001286A1Semiconductor package and flip chip bonding method thereinFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →