Inventor · disambiguated record
Ryuya Koizumi
Also filed as: KOIZUMI RYUYA
18 granted patents·8 pending applications·11 citations·filing 2011–2024
88Inventor score
Top patents by PatentIndex Score
26 records- 0188US11315812B2Semiconductor manufacturing apparatus, failure prediction method for semiconductor manufacturing apparatus, and failure prediction program for semiconductor manufacturing apparatusEBARA CORP·Filed 2018·Granted Apr 26, 2022·5 cites·11 claims
- 0278US9624594B2Plating apparatusEBARA CORP·Filed 2014·Granted Apr 18, 2017·1 cites·11 claims
- 0373US12221714B2Plating method and plating apparatusEBARA CORP·Filed 2022·Granted Feb 11, 2025·0 cites·5 claims
- 0471US8655472B2Scheduler, substrate processing apparatus, and method of transferring substrates in substrate processing apparatusKOIZUMI RYUYA·Filed 2011·Granted Feb 18, 2014·4 cites·14 claims
- 0569US10824135B2Scheduler, substrate processing apparatus, and substrate conveyance methodEBARA CORP·Filed 2018·Granted Nov 3, 2020·1 cites·11 claims
- 0668US11286577B2Plating method and plating apparatusEBARA CORP·Filed 2020·Granted Mar 29, 2022·0 cites·6 claims
- 0766US10077504B2Plating apparatusEBARA CORP·Filed 2017·Granted Sep 18, 2018·0 cites·6 claims
- 0864US12191178B2Semiconductor manufacturing apparatus, failure prediction method for semiconductor manufacturing apparatus, and failure prediction program for semiconductor manufacturing apparatusEBARA CORP·Filed 2022·Granted Jan 7, 2025·0 cites·10 claims
- 0964US2023356160A1Information processing device, inference device, machine learning device, substrate plating device, information processing method, inference method, and machine learning methodEBARA CORP·Filed 2023·Application pending·0 cites
- 1061US11099546B2Scheduler, substrate processing apparatus, and substrate conveyance methodEBARA CORP·Filed 2020·Granted Aug 24, 2021·0 cites·6 claims
- 1160US10648099B2Plating method and plating apparatusEBARA CORP·Filed 2018·Granted May 12, 2020·0 cites·9 claims
- 1260US2023203701A1Plating apparatus and plating methodEBARA CORP·Filed 2022·Application pending·0 cites
- 1359US2024192075A1Method of detecting leakageEBARA CORP·Filed 2023·Application pending·0 cites
- 1457US12054841B2Apparatus for plating and method of platingEBARA CORP·Filed 2022·Granted Aug 6, 2024·0 cites·7 claims
- 1557US2025207292A1Apparatus for processing substrate, method of controlling apparatus for processing substrate, and storage medium with program stored thereinEBARA CORP·Filed 2024·Application pending·0 cites
- 1656US11098414B2Plating system, a plating system control method, and a storage medium containing a program for causing a computer to execute the plating system control methodEBARA CORP·Filed 2019·Granted Aug 24, 2021·0 cites·12 claims
- 1755US2025225022A1Method for operating semiconductor manufacturing apparatusEBARA CORP·Filed 2024·Application pending·0 cites
- 1853US12271813B2Method for determining optimal number of submodules for use in semiconductor manufacturing apparatus including substrate processing module including plurality of submodules, and semiconductor manufacturing apparatusEBARA CORP·Filed 2021·Granted Apr 8, 2025·0 cites·12 claims
- 1953US2025198042A1Apparatus for processing substrate, method of controlling apparatus for processing substrate, and storage medium with program stored thereinEBARA CORP·Filed 2024·Application pending·0 cites
- 2051US10818527B2Substrate holding member, substrate processing device, method for controlling substrate processing device, and storage medium storing programsEBARA CORP·Filed 2019·Granted Oct 27, 2020·0 cites·22 claims
- 2151US2025183100A1Method for determining health index of substrate processing apparatus and substrate processing apparatusEBARA CORP·Filed 2024·Application pending·0 cites
- 2250US10501862B2Plating system, a plating system control method, and a storage medium containing a program for causing a computer to execute the plating system control methodEBARA CORP·Filed 2017·Granted Dec 10, 2019·0 cites·12 claims
- 2349US11461647B2Method of constructing prediction model that predicts number of plateable substrates, method of constructing selection model for predicting component that causes failure, and method of predicting number of plateable substratesEBARA CORP·Filed 2019·Granted Oct 4, 2022·0 cites·13 claims
- 2441US10824138B2Scheduler, substrate processing apparatus, and substrate conveyance methodEBARA CORP·Filed 2019·Granted Nov 3, 2020·0 cites·11 claims
- 2539US2015308010A1Substrate processing methodEBARA CORP·Filed 2015·Application pending·0 cites
- 2636US10446422B2Method of controlling display of operation of semiconductor manufacturing apparatus and non-transitory computer readable storage medium therefor, and system for performing display concerning operation of semiconductor manufacturing apparatusEBARA CORP·Filed 2018·Granted Oct 15, 2019·0 cites·12 claims
Join the waitlist — get patent alerts
Get an alert when Ryuya Koizumi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →