Inventor · disambiguated record
Ryosuke Usui
Also filed as: USUI RYOSUKE
72 granted patents·37 pending applications·681 citations·filing 2001–2024
99Inventor score
Files withSANYO ELECTRIC CO58PANASONIC IP MAN CO LTD17USUI RYOSUKE9NAGAMATSU MASAYUKI5KOHARA YASUHIRO4
Top patents by PatentIndex Score
109 records- 0198US7187060B2Semiconductor device with shieldSANYO ELECTRIC CO·Filed 2004·Granted Mar 6, 2007·178 cites·3 claims
- 0296US7405484B2Semiconductor device containing stacked semiconductor chips and manufacturing method thereofSANYO ELECTRIC CO·Filed 2004·Granted Jul 29, 2008·98 cites·13 claims
- 0395US7915737B2Packing board for electronic device, packing board manufacturing method, semiconductor module, semiconductor module manufacturing method, and mobile deviceSANYO ELECTRIC CO·Filed 2007·Granted Mar 29, 2011·40 cites·5 claims
- 0495US7615856B2Integrated antenna type circuit apparatusSANYO ELECTRIC CO·Filed 2005·Granted Nov 10, 2009·40 cites·6 claims
- 0594US7595553B2Packaging board and manufacturing method therefor, semiconductor module and mobile apparatusSANYO ELECTRIC CO·Filed 2007·Granted Sep 29, 2009·35 cites·8 claims
- 0689US10453776B2Semiconductor devicePANASONIC IP MAN CO LTD·Filed 2016·Granted Oct 22, 2019·6 cites·12 claims
- 0788US7612445B2Circuit apparatus and method of fabricating the apparatusSANYO ELECTRIC CO·Filed 2007·Granted Nov 3, 2009·14 cites·15 claims
- 0888US7315083B2Circuit device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2005·Granted Jan 1, 2008·16 cites·9 claims
- 0988US7221049B2Circuit device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2005·Granted May 22, 2007·17 cites·9 claims
- 1085US8269298B2Semiconductor module and camera module mounting said semiconductor moduleNAGAMATSU MASAYUKI·Filed 2010·Granted Sep 18, 2012·9 cites·13 claims
- 1185US7473853B2Circuit deviceSANYO ELECTRIC CO·Filed 2006·Granted Jan 6, 2009·13 cites·20 claims
- 1282US7622805B2Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereofSANYO ELECTRIC CO·Filed 2006·Granted Nov 24, 2009·9 cites·14 claims
- 1381US7420126B2Circuit board and circuit apparatus using the sameSANYO ELECTRIC CO·Filed 2006·Granted Sep 2, 2008·9 cites·12 claims
- 1480US7737368B2Circuit board and method of manufacturing circuit boardSANYO ELECTRIC CO·Filed 2006·Granted Jun 15, 2010·9 cites·7 claims
- 1579US11384892B2Heat insulation sheet, heat insulation body using same, and production method thereforPANASONIC IP MAN CO LTD·Filed 2018·Granted Jul 12, 2022·1 cites·6 claims
- 1679US9024446B2Element mounting substrate and semiconductor moduleUSUI RYOSUKE·Filed 2010·Granted May 5, 2015·6 cites·6 claims
- 1779US7495344B2Semiconductor apparatusSANYO ELECTRIC CO·Filed 2005·Granted Feb 24, 2009·8 cites·3 claims
- 1879US7492045B2Semiconductor module, method for manufacturing semiconductor modules and mobile deviceSANYO ELECTRIC CO·Filed 2007·Granted Feb 17, 2009·8 cites·13 claims
- 1978US10297516B2Semiconductor devicePANASONIC IP MAN CO LTD·Filed 2017·Granted May 21, 2019·3 cites·7 claims
- 2078US8304289B2Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereofUSUI RYOSUKE·Filed 2009·Granted Nov 6, 2012·7 cites·4 claims
- 2178US7301228B2Semiconductor device, method for manufacturing same and thin plate interconnect line memberSANYO ELECTRIC CO·Filed 2003·Granted Nov 27, 2007·21 cites·9 claims
- 2277US7796845B2Circuit board and method for manufacturing the sameSANYO ELECTRIC CO·Filed 2007·Granted Sep 14, 2010·6 cites·2 claims
- 2377US7364941B2Circuit device manufacturing methodSANYO ELECTRIC CO·Filed 2005·Granted Apr 29, 2008·6 cites·9 claims
- 2476US8258620B2Circuit device, method of manufacturing the circuit device, device mounting board and semiconductor moduleNAKASATO MAYUMI·Filed 2008·Granted Sep 4, 2012·6 cites·5 claims
- 2576US8166643B2Method of manufacturing the circuit apparatus, method of manufacturing the circuit board, and method of manufacturing the circuit deviceSHIBATA KIYOSHI·Filed 2010·Granted May 1, 2012·3 cites·9 claims
- 2674US8115316B2Packaging board, semiconductor module, and portable apparatusKOHARA YASUHIRO·Filed 2007·Granted Feb 14, 2012·6 cites·16 claims
- 2774US7855452B2Semiconductor module, method of manufacturing semiconductor module, and mobile deviceSANYO ELECTRIC CO·Filed 2008·Granted Dec 21, 2010·5 cites·3 claims
- 2874US7507658B2Semiconductor apparatus and method of fabricating the apparatusSANYO ELECTRIC CO·Filed 2005·Granted Mar 24, 2009·6 cites·9 claims
- 2974US7491895B2Wiring substrate and method of fabricating the sameSANYO ELECTRIC CO·Filed 2005·Granted Feb 17, 2009·5 cites·13 claims
- 3073US12308146B2Multilayer varistorPANASONIC IP MAN CO LTD·Filed 2022·Granted May 20, 2025·0 cites·6 claims
- 3173US8097946B2Device mounting board, semiconductor module, and mobile deviceSAITOU KOUICHI·Filed 2008·Granted Jan 17, 2012·5 cites·9 claims
- 3273US7649739B2Circuit deviceSANYO ELECTRIC CO·Filed 2006·Granted Jan 19, 2010·5 cites·10 claims
- 3372US10211144B2Semiconductor device having a plurality of top surface connection terminalsPANASONIC IP MAN CO LTD·Filed 2016·Granted Feb 19, 2019·2 cites·7 claims
- 3471US8338946B2Semiconductor module, method of manufacturing semiconductor module, and mobile deviceYANASE YASUYUKI·Filed 2010·Granted Dec 25, 2012·3 cites·5 claims
- 3571US2022310291A1Multilayer electronic component production methodPANASONIC IP MAN CO LTD·Filed 2022·Application pending·0 cites
- 3670US12334235B2Multilayer varistorPANASONIC IP MAN CO LTD·Filed 2022·Granted Jun 17, 2025·0 cites·13 claims
- 3770US7745938B2Circuit device, a method for manufacturing a circuit device, and a semiconductor moduleSANYO ELECTRIC CO·Filed 2008·Granted Jun 29, 2010·4 cites·11 claims
- 3868US9129933B2Semiconductor module and an inverter mounting said semiconductor moduleSANYO ELECTRIC CO·Filed 2013·Granted Sep 8, 2015·2 cites·9 claims
- 3968US8373281B2Semiconductor module and portable apparatus provided with semiconductor moduleSANYO ELECTRIC CO·Filed 2009·Granted Feb 12, 2013·3 cites·13 claims
- 4068US7683268B2Semiconductor module with high process accuracy, manufacturing method thereof, and semiconductor device therewithSANYO ELECTRIC CO·Filed 2005·Granted Mar 23, 2010·4 cites·11 claims
- 4167US8258409B2Circuit board and circuit deviceKOHARA YASUHIRO·Filed 2008·Granted Sep 4, 2012·4 cites·7 claims
- 4266US8022533B2Circuit apparatus provided with asperities on substrate surfaceSANYO ELECTRIC CO·Filed 2005·Granted Sep 20, 2011·3 cites·4 claims
- 4366US7683266B2Circuit board and circuit apparatus using the sameSANYO ELECTRIC CO·Filed 2006·Granted Mar 23, 2010·2 cites·15 claims
- 4465US8153186B2Packaging board and manufacturing method therefor, semiconductor module and mobile apparatusNAGAMATSU MASAYUKI·Filed 2009·Granted Apr 10, 2012·3 cites·6 claims
- 4565US8093699B2Circuit device with circuit board and semiconductor chip mounted thereonKOHARA YASUHIRO·Filed 2005·Granted Jan 10, 2012·3 cites·7 claims
- 4665US7907390B2Circuit deviceSANYO ELECTRIC CO·Filed 2007·Granted Mar 15, 2011·3 cites·19 claims
- 4765US7875980B2Semiconductor device having laminated structureSANYO ELECTRIC CO·Filed 2005·Granted Jan 25, 2011·3 cites·10 claims
- 4865US7724536B2Circuit deviceSANYO ELECTRIC CO·Filed 2006·Granted May 25, 2010·3 cites·2 claims
- 4964US7808114B2Circuit device and method of manufacturing thereofSANYO ELECTRIC CO·Filed 2006·Granted Oct 5, 2010·2 cites·14 claims
- 5064US7791120B2Circuit device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2005·Granted Sep 7, 2010·2 cites·4 claims
Showing the top 50 of 109 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →