Inventor · disambiguated record
S. M. Reza Sadjadi
Also filed as: SADJADI S M R · SADJADI S M REZA
65 granted patents·10 pending applications·1,507 citations·filing 1992–2016
99Inventor score
Files withLAM RES CORP50SADJADI S M REZA5NAT SEMICONDUCTOR CORP4APPLIED MATERIALS INC3ROMANO ANDREW R3
Top patents by PatentIndex Score
75 records- 0197US7271107B2Reduction of feature critical dimensions using multiple masksLAM RES CORP·Filed 2005·Granted Sep 18, 2007·134 cites·21 claims
- 0297US6972524B1Plasma processing system controlLAM RES CORP·Filed 2004·Granted Dec 6, 2005·87 cites·41 claims
- 0396US8282847B2Photoresist double patterningROMANO ANDREW R·Filed 2008·Granted Oct 9, 2012·483 cites·10 claims
- 0495US7271108B2Multiple mask process with etch mask stackLAM RES CORP·Filed 2005·Granted Sep 18, 2007·38 cites·21 claims
- 0595US7241683B2Stabilized photoresist structure for etching processLAM RES CORP·Filed 2005·Granted Jul 10, 2007·36 cites·17 claims
- 0694US9412579B2Methods and apparatus for controlling substrate uniformityAPPLIED MATERIALS INC·Filed 2013·Granted Aug 9, 2016·16 cites·15 claims
- 0794US7390749B2Self-aligned pitch reductionLAM RES CORP·Filed 2006·Granted Jun 24, 2008·41 cites·19 claims
- 0893US7309646B1De-fluoridation processLAM RES CORP·Filed 2006·Granted Dec 18, 2007·25 cites·25 claims
- 0990US10410889B2Systems and methods for electrical and magnetic uniformity and skew tuning in plasma processing reactorsAPPLIED MATERIALS INC·Filed 2015·Granted Sep 10, 2019·7 cites·16 claims
- 1090US10177050B2Methods and apparatus for controlling substrate uniformityAPPLIED MATERIALS INC·Filed 2016·Granted Jan 8, 2019·5 cites·12 claims
- 1190US8343876B2Fast gas switching plasma processing apparatusLAM RES CORP·Filed 2011·Granted Jan 1, 2013·10 cites·9 claims
- 1290US7273815B2Etch features with reduced line edge roughnessLAM RES CORP·Filed 2005·Granted Sep 25, 2007·13 cites·18 claims
- 1389US7910489B2Infinitely selective photoresist mask etchLAM RES CORP·Filed 2006·Granted Mar 22, 2011·16 cites·10 claims
- 1489US6670278B2Method of plasma etching of silicon carbideLAM RES CORP·Filed 2001·Granted Dec 30, 2003·54 cites·22 claims
- 1587US8268118B2Critical dimension reduction and roughness controlLEE SANGHEON·Filed 2010·Granted Sep 18, 2012·8 cites·5 claims
- 1687US7772122B2Sidewall forming processesLAM RES CORP·Filed 2008·Granted Aug 10, 2010·11 cites·22 claims
- 1786US7541291B2Reduction of feature critical dimensionsLAM RES CORP·Filed 2007·Granted Jun 2, 2009·11 cites·29 claims
- 1885US6962879B2Method of plasma etching silicon nitrideLAM RES CORP·Filed 2001·Granted Nov 8, 2005·43 cites·30 claims
- 1984US7405521B2Multiple frequency plasma processor method and apparatusLAM RES CORP·Filed 2003·Granted Jul 29, 2008·35 cites·45 claims
- 2083US8172948B2De-fluoridation processHEO DONGHO·Filed 2007·Granted May 8, 2012·9 cites·20 claims
- 2183US7465525B2Reticle alignment and overlay for multiple reticle processLAM RES CORP·Filed 2005·Granted Dec 16, 2008·8 cites·17 claims
- 2283US7347915B1Plasma in-situ treatment of chemically amplified resistLAM RES CORP·Filed 2006·Granted Mar 25, 2008·8 cites·9 claims
- 2383US7250371B2Reduction of feature critical dimensionsLAM RES CORP·Filed 2003·Granted Jul 31, 2007·27 cites·11 claims
- 2481US7629259B2Method of aligning a reticle for formation of semiconductor devicesLAM RES CORP·Filed 2005·Granted Dec 8, 2009·6 cites·18 claims
- 2579US7785484B2Mask trimming with ARL etchLAM RES CORP·Filed 2007·Granted Aug 31, 2010·7 cites·14 claims
- 2679US7682516B2Vertical profile fixingLAM RES CORP·Filed 2005·Granted Mar 23, 2010·6 cites·20 claims
- 2779US7429533B2Pitch reductionLAM RES CORP·Filed 2006·Granted Sep 30, 2008·6 cites·20 claims
- 2877US8614149B2Critical dimension reduction and roughness controlLEE SANGHEON·Filed 2012·Granted Dec 24, 2013·3 cites·18 claims
- 2977US7560388B2Self-aligned pitch reductionLAM RES CORP·Filed 2005·Granted Jul 14, 2009·6 cites·17 claims
- 3077US7264743B2Fin structure formationLAM RES CORP·Filed 2006·Granted Sep 4, 2007·5 cites·19 claims
- 3176US7539969B2Computer readable mask shrink control processorLAM RES CORP·Filed 2005·Granted May 26, 2009·4 cites·5 claims
- 3275US8187412B2Apparatus for providing device with gaps for capacitance reductionSADJADI S M REZA·Filed 2008·Granted May 29, 2012·4 cites·15 claims
- 3375US6969685B1Etching a dielectric layer in an integrated circuit structure having a metal hard mask layerLAM RES CORP·Filed 2002·Granted Nov 29, 2005·18 cites·34 claims
- 3475US6909195B2Trench etch process for low-k dielectricsLAM RES CORP·Filed 2004·Granted Jun 21, 2005·16 cites·5 claims
- 3574US7977242B2Double mask self-aligned double patterning technology (SADPT) processLAM RES CORP·Filed 2009·Granted Jul 12, 2011·4 cites·18 claims
- 3674US5342801AControllable isotropic plasma etching technique for the suppression of stringers in memory cellsNAT SEMICONDUCTOR CORP·Filed 1993·Granted Aug 30, 1994·50 cites·8 claims
- 3773US7022611B1Plasma in-situ treatment of chemically amplified resistLAM RES CORP·Filed 2003·Granted Apr 4, 2006·14 cites·4 claims
- 3872US8138092B2Spacer formation for array double patterningSADJADI S M REZA·Filed 2009·Granted Mar 20, 2012·3 cites·16 claims
- 3972US7491647B2Etch with striation controlLAM RES CORP·Filed 2005·Granted Feb 17, 2009·3 cites·18 claims
- 4072US7485581B2Device with gaps for capacitance reductionLAM RES CORP·Filed 2005·Granted Feb 3, 2009·3 cites·20 claims
- 4172US7166535B2Plasma etching of silicon carbideLAM RES CORP·Filed 2003·Granted Jan 23, 2007·11 cites·26 claims
- 4272US6794293B2Trench etch process for low-k dielectricsLAM RES CORP·Filed 2001·Granted Sep 21, 2004·14 cites·19 claims
- 4371US8357434B1Apparatus for the deposition of a conformal film on a substrate and methods thereforLAM RES CORP·Filed 2005·Granted Jan 22, 2013·3 cites·20 claims
- 4471US6875699B1Method for patterning multilevel interconnectsLAM RES CORP·Filed 2002·Granted Apr 5, 2005·15 cites·13 claims
- 4571US5883436AContact and via fabrication technologiesINTEL CORP·Filed 1997·Granted Mar 16, 1999·37 cites·14 claims
- 4670US7682479B2Fin structure formationLAM RES CORP·Filed 2007·Granted Mar 23, 2010·3 cites·8 claims
- 4770US6919278B2Method for etching silicon carbideLAM RES CORP·Filed 2002·Granted Jul 19, 2005·10 cites·19 claims
- 4867US5383018AApparatus and method for calibration of patterned wafer scannersNAT SEMICONDUCTOR CORP·Filed 1992·Granted Jan 17, 1995·42 cites·12 claims
- 4966US8361564B2Protective layer for implant photoresistLAM RES CORP·Filed 2008·Granted Jan 29, 2013·2 cites·15 claims
- 5065US8172980B2Device with self aligned gaps for capacitance reductionSADJADI S M REZA·Filed 2008·Granted May 8, 2012·2 cites·12 claims
Showing the top 50 of 75 patent records by PatentIndex Score.
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