Inventor · disambiguated record
Sam Kao
Also filed as: KAO SAM
21 granted patents·8 pending applications·1,567 citations·filing 2000–2015
97Inventor score
Top patents by PatentIndex Score
29 records- 0199US7276724B2Series interconnected optoelectronic device module assemblyNANOSOLAR INC·Filed 2005·Granted Oct 2, 2007·116 cites·46 claims
- 0299US7060601B2Packaging substrates for integrated circuits and soldering methodsTRU SI TECHNOLOGIES INC·Filed 2003·Granted Jun 13, 2006·394 cites·23 claims
- 0399US7049170B2Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavitiesTRU SI TECHNOLOGIES INC·Filed 2003·Granted May 23, 2006·429 cites·58 claims
- 0498US7241641B2Attachment of integrated circuit structures and other substrates to substrates with viasTRU SI TECHNOLOGIES INC·Filed 2005·Granted Jul 10, 2007·78 cites·27 claims
- 0598US7186586B2Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavitiesTRU SI TECHNOLOGIES INC·Filed 2005·Granted Mar 6, 2007·61 cites·27 claims
- 0698US7034401B2Packaging substrates for integrated circuits and soldering methodsTRU SI TECHNOLOGIES INC·Filed 2005·Granted Apr 25, 2006·101 cites·10 claims
- 0795US7838868B2Optoelectronic architecture having compound conducting substrateNANOSOLAR INC·Filed 2005·Granted Nov 23, 2010·19 cites·81 claims
- 0895US7732229B2Formation of solar cells with conductive barrier layers and foil substratesNANOSOLAR INC·Filed 2006·Granted Jun 8, 2010·27 cites·20 claims
- 0994US8198117B2Photovoltaic devices with conductive barrier layers and foil substratesLEIDHOLM CRAIG R·Filed 2006·Granted Jun 12, 2012·37 cites·50 claims
- 1094US7241675B2Attachment of integrated circuit structures and other substrates to substrates with viasTRU SI TECHNOLOGIES INC·Filed 2004·Granted Jul 10, 2007·65 cites·29 claims
- 1194US6897148B2Electroplating and electroless plating of conductive materials into openings, and structures obtained therebyTRU SI TECHNOLOGIES INC·Filed 2003·Granted May 24, 2005·123 cites·80 claims
- 1292US7521360B2Electroplating and electroless plating of conductive materials into openings, and structures obtained therebyTRU SI TECHNOLOGIES INC·Filed 2006·Granted Apr 21, 2009·43 cites·8 claims
- 1390US6427991B1Non-contact workpiece holder using vortex chuck with central gas flowTRU SI TECHNOLOGIES INC·Filed 2000·Granted Aug 6, 2002·48 cites·19 claims
- 1482US7919337B2Optoelectronic architecture having compound conducting substrateNANOSOLAR INC·Filed 2007·Granted Apr 5, 2011·4 cites·19 claims
- 1580US8525152B2Formation of solar cells with conductive barrier layers and foil substratesLEIDHOLM CRAIG·Filed 2010·Granted Sep 3, 2013·2 cites·20 claims
- 1680US7968869B2Optoelectronic architecture having compound conducting substrateNANOSOLAR INC·Filed 2008·Granted Jun 28, 2011·3 cites·20 claims
- 1778US7732232B2Series interconnected optoelectronic device module assemblyNANOSOLAR INC·Filed 2007·Granted Jun 8, 2010·4 cites·14 claims
- 1871US8309949B2Optoelectronic architecture having compound conducting substrateSHEATS JAMES R·Filed 2010·Granted Nov 13, 2012·1 cites·20 claims
- 1970US8603575B1Thin-film absorber formation methodKAO SAM·Filed 2011·Granted Dec 10, 2013·1 cites·15 claims
- 2061US6899788B2Article holders that use gas vortices to hold an article in a desired positionTRU SI TECHNOLOGIES INC·Filed 2003·Granted May 31, 2005·6 cites·3 claims
- 2158US6749764B1Plasma processing comprising three rotational motions of an article being processedTRU SI TECHNOLOGIES INC·Filed 2000·Granted Jun 15, 2004·5 cites·39 claims
- 2255US2012052613A1Optoelectronic architecture having compound conducting substrateSHEATS JAMES R·Filed 2011·Application pending·0 cites
- 2353US2016273097A1Method for monitoring se vapor in vacuum reactor apparatusNUVOSUN INC·Filed 2014·Application pending·0 cites
- 2444US2005212127A1Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavitiesSAVASTIOUK SERGEY·Filed 2005·Application pending·0 cites
- 2541US2004016406A1Plasma processing comprising three rotational motions of an article being processedFiled 2003·Application pending·0 cites
- 2640US2002185230A1Article holders that use gas vortices to hold an article in a desired positionFiled 2001·Application pending·0 cites
- 2737US2012237816A1Low-cost high-power battery and enabling bipolar substrateROSCHEISEN MARTIN R·Filed 2011·Application pending·0 cites
- 2834US2005170647A1Electroplating and electroless plating of conductive materials into openings, and structures obtained therebyFiled 2005·Application pending·0 cites
- 2929US2017167028A1Selenization or sulfurization method of roll to roll metal substratesNUVOSUN INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →