Inventor · disambiguated record
Sayeh Khalili
Also filed as: KHALILI SAYEH
12 granted patents·1 pending application·1,152 citations·filing 1999–2009
94Inventor score
Top patents by PatentIndex Score
13 records- 0199US6376904B1Redistributed bond pads in stacked integrated circuit die packageRAMBUS INC·Filed 2000·Granted Apr 23, 2002·339 cites·17 claims
- 0298US6621155B1Integrated circuit device having stacked dies and impedance balanced transmission linesRAMBUS INC·Filed 1999·Granted Sep 16, 2003·316 cites·18 claims
- 0397US6853557B1Multi-channel memory architectureRAMBUS INC·Filed 2000·Granted Feb 8, 2005·186 cites·26 claims
- 0496US6545875B1Multiple channel modules and bus systems using sameRAMBUS INC·Filed 2000·Granted Apr 8, 2003·75 cites·29 claims
- 0596US6514794B2Redistributed bond pads in stacked integrated circuit die packageRAMBUS INC·Filed 2002·Granted Feb 4, 2003·108 cites·18 claims
- 0695US6657871B2Multiple channel modules and bus systems using sameRAMBUS INC·Filed 2002·Granted Dec 2, 2003·53 cites·15 claims
- 0790US6720643B1Stacked semiconductor moduleRAMBUS INC·Filed 2001·Granted Apr 13, 2004·48 cites·28 claims
- 0885USRE43720EIntegrated circuit device having stacked dies and impedance balanced transmission linesPERINO DONALD V·Filed 2005·Granted Oct 9, 2012·13 cites·101 claims
- 0973US7285443B2Stacked semiconductor moduleRAMBUS INC·Filed 2006·Granted Oct 23, 2007·4 cites·5 claims
- 1068US7037757B2Stacked semiconductor moduleRAMBUS INC·Filed 2004·Granted May 2, 2006·10 cites·33 claims
- 1156USRE44019EStacked semiconductor moduleRAMBUS INC·Filed 2009·Granted Feb 19, 2013·0 cites·22 claims
- 1249US2008150123A1Semiconductor Package With Rigid And Flexible CircuitsLI MING·Filed 2008·Application pending·0 cites
- 1346US7705445B2Semiconductor package with low and high-speed signal pathsRAMBUS INC·Filed 2005·Granted Apr 27, 2010·0 cites·66 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →