Inventor · disambiguated record
Sakae Koyata
Also filed as: KOYATA SAKAE
16 granted patents·11 pending applications·71 citations·filing 2004–2009
91Inventor score
Technology areasH10P
Top patents by PatentIndex Score
27 records- 0181US7488400B2Apparatus for etching wafer by single-wafer processSUMCO CORP·Filed 2006·Granted Feb 10, 2009·7 cites·7 claims
- 0280US7456106B2Method for producing a silicon waferSUMITOMO MITSUBISHI SILICON·Filed 2004·Granted Nov 25, 2008·23 cites·5 claims
- 0377US7601644B2Method for manufacturing silicon wafersSUMCO CORP·Filed 2005·Granted Oct 13, 2009·6 cites·4 claims
- 0476US7906438B2Single wafer etching methodSUMCO CORP·Filed 2007·Granted Mar 15, 2011·5 cites·5 claims
- 0574US7288207B2Etching liquid for controlling silicon wafer surface shape and method for manufacturing silicon wafer using the sameSUMCO CORP·Filed 2006·Granted Oct 30, 2007·4 cites·8 claims
- 0667US8466071B2Method for etching single waferKOYATA SAKAE·Filed 2007·Granted Jun 18, 2013·3 cites·2 claims
- 0763US8759229B2Method for manufacturing epitaxial waferKOYATA SAKAE·Filed 2007·Granted Jun 24, 2014·2 cites·7 claims
- 0861US7851375B2Alkaline etchant for controlling surface roughness of semiconductor waferSUMCO CORP·Filed 2005·Granted Dec 14, 2010·1 cites·4 claims
- 0961US7648890B2Process for producing silicon waferSUMCO CORP·Filed 2006·Granted Jan 19, 2010·1 cites·7 claims
- 1055US7338904B2Method for manufacturing single-side mirror surface waferSUMCO CORP·Filed 2004·Granted Mar 4, 2008·7 cites·3 claims
- 1155US7226864B2Method for producing a silicon waferSUMITOMO MITSUBISHI SILICON·Filed 2004·Granted Jun 5, 2007·6 cites·4 claims
- 1253US7645702B2Manufacturing method of silicon waferSUMCO CORP·Filed 2004·Granted Jan 12, 2010·4 cites·3 claims
- 1353US2009117749A1Etching Method of Single WaferSUMCO CORP·Filed 2008·Application pending·0 cites
- 1451US8066896B2Apparatus for etching wafer by single-wafer process and single wafer type method for etching waferKOYATA SAKAE·Filed 2007·Granted Nov 29, 2011·0 cites·4 claims
- 1548US7601642B2Method of processing silicon waferSUMCO CORP·Filed 2004·Granted Oct 13, 2009·2 cites·3 claims
- 1648US2009297755A1Semiconductor waferSUMCO CORP·Filed 2009·Application pending·0 cites
- 1748US2010021688A1Wafer manufacturing method and wafer obtained through the methodSUMCO CORP·Filed 2009·Application pending·0 cites
- 1847US2007161247A1Etching method of single waferKOYATA SAKAE·Filed 2006·Application pending·0 cites
- 1947US2007184658A1Etching Liquid for Controlling Silicon Wafer Surface ShapeKOYATA SAKAE·Filed 2007·Application pending·0 cites
- 2045US7955982B2Method for smoothing wafer surface and apparatus used thereforSUMCO CORP·Filed 2007·Granted Jun 7, 2011·0 cites·7 claims
- 2144US7717768B2Wafer polishing apparatus and method for polishing wafersSUMCO CORP·Filed 2006·Granted May 18, 2010·0 cites·3 claims
- 2243US2009042390A1Etchant for silicon wafer surface shape control and method for manufacturing silicon wafers using the sameKOYATA SAKAE·Filed 2007·Application pending·0 cites
- 2342US2006264158A1Apparatus for polishing wafer and process for polishing waferSUMCO CORP·Filed 2006·Application pending·0 cites
- 2441US2009181546A1Single-Wafer Etching Method for Wafer and Etching Apparatus ThereofKATOH TAKEO·Filed 2008·Application pending·0 cites
- 2540US2008214094A1Method for manufacturing silicon waferKATOH TAKEO·Filed 2008·Application pending·0 cites
- 2637US2007267387A1Processing Method of Silicon WaferKOYATA SAKAE·Filed 2004·Application pending·0 cites
- 2735US2006194441A1Method for etching a silicon wafer and method for performing differentiation between the obverse and the reverse of a silicon wafer using the same methodKOYATA SAKAE·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →