Inventor · disambiguated record
Sam Dong Lee
Also filed as: LEE SAM DONG
7 granted patents·1 pending application·4 citations·filing 2018–2022
73Inventor score
Files withDNF CO LTD8
Top patents by PatentIndex Score
8 records- 0187US11390635B2Composition for depositing silicon-containing thin film and method for producing silicon-containing thin film using the sameDNF CO LTD·Filed 2018·Granted Jul 19, 2022·3 cites·14 claims
- 0270US10894799B2Composition for depositing silicon-containing thin film including disilylamine compound and method for manufacturing silicon-containing thin film using the sameDNF CO LTD·Filed 2018·Granted Jan 19, 2021·1 cites·13 claims
- 0369US11749522B2Composition for depositing silicon-containing thin film containing bis(aminosilyl)alkylamine compound and method for manufacturing silicon-containing thin using the sameDNF CO LTD·Filed 2022·Granted Sep 5, 2023·0 cites·7 claims
- 0461US11319333B2Disilylamine compound, method for preparing the same, and composition for depositing silicon-containing thin film including the sameDNF CO LTD·Filed 2018·Granted May 3, 2022·0 cites·11 claims
- 0556US11358974B2Silylamine compound, composition for depositing silicon-containing thin film containing the same, and method for manufacturing silicon-containing thin film using the compositionDNF CO LTD·Filed 2018·Granted Jun 14, 2022·0 cites·11 claims
- 0653US11393676B2Composition for depositing silicon-containing thin film containing bis(aminosilyl)alkylamine compound and method for manufacturing silicon-containing thin film using the sameDNF CO LTD·Filed 2018·Granted Jul 19, 2022·0 cites·14 claims
- 0751US12398459B2Silicon metal oxide encapsulation film comprising metal or metal oxide in thin film, and manufacturing method thereforDNF CO LTD·Filed 2020·Granted Aug 26, 2025·0 cites·15 claims
- 0850US2020111665A1Composition for depositing silicon-containing thin film and method for manufacturing silicon-containing thin film using the sameDNF CO LTD·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →