Inventor · disambiguated record
Satoshi Oka
Also filed as: OKA SATOSHI
19 granted patents·3 pending applications·285 citations·filing 1973–2011
94Inventor score
Top patents by PatentIndex Score
22 records- 0197USD327868SCombined car-mount unit and power supply adapter for a digital audio tape recorderSHARP KK·Filed 1991·Granted Jul 14, 1992·89 cites·1 claims
- 0286US7029977B2Fabrication method of semiconductor waferSHINETSU HANDOTAI KK·Filed 2004·Granted Apr 18, 2006·37 cites·4 claims
- 0383US3930924AProcess for making identification cardsOKA SATOSHI·Filed 1973·Granted Jan 6, 1976·50 cites·8 claims
- 0475US8823130B2Silicon epitaxial wafer, method for manufacturing the same, bonded SOI wafer and method for manufacturing the sameKATO MASAHIRO·Filed 2011·Granted Sep 2, 2014·4 cites·8 claims
- 0574US6139625AMethod for producing a silicon single crystal wafer and a silicon single crystal waferSHINETSU HANDOTAI KK·Filed 1999·Granted Oct 31, 2000·27 cites·12 claims
- 0671US7838388B2Method for producing SOI substrateSHINETSU HANDOTAI KK·Filed 2009·Granted Nov 23, 2010·3 cites·12 claims
- 0771USD331385SCombined power supply adapter and converter for a digital audio tape recorderSHARP KK·Filed 1990·Granted Dec 1, 1992·15 cites·1 claims
- 0865US8691665B2Method for producing bonded waferOKA SATOSHI·Filed 2010·Granted Apr 8, 2014·2 cites·8 claims
- 0959US8728912B2Method for manufacturing SOI waferAGA HIROJI·Filed 2011·Granted May 20, 2014·1 cites·2 claims
- 1059US7008881B2Method for forming silicon epitaxial layerTOKYO ELECTRON LTD·Filed 2003·Granted Mar 7, 2006·4 cites·14 claims
- 1152USD318278SCombined radio and tape playerSHARP KK·Filed 1989·Granted Jul 16, 1991·6 cites·1 claims
- 1249US8497187B2Method for manufacturing SOI wafer and SOI waferOKA SATOSHI·Filed 2009·Granted Jul 30, 2013·0 cites·4 claims
- 1349US8389382B2Method for manufacturing bonded waferOKA SATOSHI·Filed 2009·Granted Mar 5, 2013·0 cites·17 claims
- 1448US6531416B1Method for heat treatment of silicon wafer and silicon wafer heat-treated by the methodSHINETSU HANDOTAI KK·Filed 1998·Granted Mar 11, 2003·15 cites·2 claims
- 1548US5759426AHeat treatment jig for semiconductor wafers and a method for treating a surface of the sameSHINETSU HANDOTAI KK·Filed 1995·Granted Jun 2, 1998·11 cites·2 claims
- 1646US2010003803A1Manufacturing method of strained si substrateSHINETSU HANDOTAI KK·Filed 2007·Application pending·0 cites
- 1745US8076223B2Method for producing semiconductor substrateOKA SATOSHI·Filed 2007·Granted Dec 13, 2011·0 cites·9 claims
- 1845US5763838AApparatus for weighing a grown crystalOKURA DENKI CO LTD·Filed 1996·Granted Jun 9, 1998·14 cites·18 claims
- 1938US6403502B1Heat treatment method for a silicon wafer and a silicon wafer heat-treated by the methodSHINETSU HANDOTAI KK·Filed 1998·Granted Jun 11, 2002·6 cites·4 claims
- 2036US2001022803A1Temperature-detecting elementFiled 2001·Application pending·0 cites
- 2134US2013102126A1Method for manufacturing bonded waferAGA HIROJI·Filed 2011·Application pending·0 cites
- 2232USD334190SDigital audio tape recorderSHARP KK·Filed 1990·Granted Mar 23, 1993·1 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →