Inventor · disambiguated record
Sang-Sick Park
Also filed as: PARK SANG-SICK
24 granted patents·15 pending applications·114 citations·filing 2009–2024
95Inventor score
Top patents by PatentIndex Score
39 records- 0196US11894346B2Semiconductor package having a high reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 6, 2024·2 cites·20 claims
- 0295US11018115B2Semiconductor package having a high reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 25, 2021·3 cites·19 claims
- 0395US10153255B2Semiconductor package having a high reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Dec 11, 2018·12 cites·19 claims
- 0494US11362068B2Semiconductor package including a fillet layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 14, 2022·3 cites·20 claims
- 0593US10930613B2Semiconductor package having recessed adhesive layer between stacked chipsSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 23, 2021·9 cites·17 claims
- 0693US8901727B2Semiconductor packages, methods of manufacturing semiconductor packages, and systems including semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Dec 2, 2014·30 cites·27 claims
- 0790US12074142B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 27, 2024·2 cites·20 claims
- 0890US11948903B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 2, 2024·2 cites·20 claims
- 0990US10622335B2Semiconductor package having a high reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Apr 14, 2020·4 cites·20 claims
- 1089US11901339B2Semiconductor package including a fillet layerSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 13, 2024·1 cites·19 claims
- 1188US8637989B2Semiconductor chip having via electrodes and stacked semiconductor chips interconnected by the via electrodesLEE HO-JIN·Filed 2012·Granted Jan 28, 2014·9 cites·5 claims
- 1286US12183718B2Semiconductor package having a high reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Dec 31, 2024·0 cites·20 claims
- 1386US11664352B2Semiconductor package having a high reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 30, 2023·1 cites·20 claims
- 1486US8637350B2Method of manufacturing chip-stacked semiconductor packageAHN JUNG-SEOK·Filed 2012·Granted Jan 28, 2014·9 cites·20 claims
- 1586US8513802B2Multi-chip package having semiconductor chips of different thicknesses from each other and related deviceMA KEUM-HEE·Filed 2011·Granted Aug 20, 2013·14 cites·22 claims
- 1678US8697494B2Method of manufacturing a flip chip package and apparatus to attach a semiconductor chip used in the methodJEON CHANG-SEONG·Filed 2011·Granted Apr 15, 2014·5 cites·13 claims
- 1776US2024429205A1Semiconductor package with increased thermal radiation efficiencySAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1874US9171825B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Oct 27, 2015·3 cites·22 claims
- 1973US8958011B2Bi-directional camera module and flip chip bonder including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Feb 17, 2015·2 cites·15 claims
- 2071US10651154B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 12, 2020·1 cites·20 claims
- 2171US2024371835A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2270US9136260B2Method of manufacturing chip-stacked semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 15, 2015·2 cites·20 claims
- 2365US12113050B2Semiconductor package with increased thermal radiation efficiencySAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 8, 2024·0 cites·17 claims
- 2461US12469810B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 11, 2025·0 cites·20 claims
- 2558US11616039B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 28, 2023·0 cites·20 claims
- 2658US2025062177A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2756US2025070072A1Semiconductor package comprising dam and multi-layered under-fill layerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2855US2025323216A1Semiconductor stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2955US2024162184A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3055US2025062210A1Semiconductor package comprising dummy structure at corner region thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3153US2024170449A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3251US2010105169A1Semiconductor chip having via electrodes and stacked semiconductor chips interconnected by the via electrodesLEE HO-JIN·Filed 2009·Application pending·0 cites
- 3351US2014196280A1Method of manufacturing a flip chip package and apparatus to attach a semiconductor chip used in the methodSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 3449US2024162193A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3542US10090278B2Semiconductor packagesPARK SANG SICK·Filed 2016·Granted Oct 2, 2018·0 cites·10 claims
- 3638US2013149817A1Fabricating methods of semiconductor devices and pick-up apparatuses of semiconductor devices thereinJEON CHANG-SEONG·Filed 2012·Application pending·0 cites
- 3736US2012326307A1Stacked semiconductor deviceJEONG SE-YOUNG·Filed 2012·Application pending·0 cites
- 3834US2013032947A1Semiconductor package and method of manufacturing the samePARK SANG-SICK·Filed 2012·Application pending·0 cites
- 3932US2012077314A1Method of fabricating semiconductor stack packagePARK SANG-SICK·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →