Inventor · disambiguated record
Sai Vadlamani
Also filed as: VADLAMANI SAI
34 granted patents·13 pending applications·30 citations·filing 2016–2024
95Inventor score
Top patents by PatentIndex Score
47 records- 0196US11664290B2Package with underfill containment barrierINTEL CORP·Filed 2021·Granted May 30, 2023·3 cites·20 claims
- 0289US11158558B2Package with underfill containment barrierINTEL CORP·Filed 2016·Granted Oct 26, 2021·5 cites·16 claims
- 0388US10373951B1Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling sameINTEL CORP·Filed 2018·Granted Aug 6, 2019·4 cites·23 claims
- 0484US12327773B2Package with underfill containment barrierINTEL CORP·Filed 2024·Granted Jun 10, 2025·0 cites·20 claims
- 0584US10700021B2Coreless organic packages with embedded die and magnetic inductor structuresINTEL CORP·Filed 2018·Granted Jun 30, 2020·3 cites·11 claims
- 0683US11552008B2Asymmetric cored integrated circuit package supportsINTEL CORP·Filed 2018·Granted Jan 10, 2023·3 cites·24 claims
- 0782US10643994B2Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling sameINTEL CORP·Filed 2019·Granted May 5, 2020·2 cites·21 claims
- 0880US11935805B2Package with underfill containment barrierINTEL CORP·Filed 2023·Granted Mar 19, 2024·0 cites·20 claims
- 0977US11557489B2Cavity structures in integrated circuit package supportsINTEL CORP·Filed 2018·Granted Jan 17, 2023·2 cites·20 claims
- 1077US11251113B2Methods of embedding magnetic structures in substratesINTEL CORP·Filed 2017·Granted Feb 15, 2022·2 cites·16 claims
- 1177US11189409B2Electronic substrates having embedded dielectric magnetic material to form inductorsINTEL CORP·Filed 2017·Granted Nov 30, 2021·2 cites·16 claims
- 1273US10741947B2Plated through hole socketing coupled to a solder ball to engage with a pinINTEL CORP·Filed 2018·Granted Aug 11, 2020·2 cites·23 claims
- 1372US12154715B2Methods to selectively embed magnetic materials in substrate and corresponding structuresINTEL CORP·Filed 2022·Granted Nov 26, 2024·0 cites·25 claims
- 1472US11881463B2Coreless organic packages with embedded die and magnetic inductor structuresINTEL CORP·Filed 2021·Granted Jan 23, 2024·0 cites·13 claims
- 1572US11735537B2Methods to embed magnetic material as first layer on coreless substrates and corresponding structuresINTEL CORP·Filed 2022·Granted Aug 22, 2023·0 cites·23 claims
- 1671US11443892B2Substrate assembly with encapsulated magnetic featureINTEL CORP·Filed 2018·Granted Sep 13, 2022·1 cites·17 claims
- 1770US11862552B2Methods of embedding magnetic structures in substratesINTEL CORP·Filed 2022·Granted Jan 2, 2024·0 cites·7 claims
- 1870US11335632B2Magnetic inductor structures for package devicesINTEL CORP·Filed 2017·Granted May 17, 2022·1 cites·15 claims
- 1969US10971492B2Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling sameINTEL CORP·Filed 2020·Granted Apr 6, 2021·0 cites·21 claims
- 2068US11901115B2Substrate assembly with encapsulated magnetic featureINTEL CORP·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 2167US11205626B2Coreless organic packages with embedded die and magnetic inductor structuresINTEL CORP·Filed 2020·Granted Dec 21, 2021·0 cites·30 claims
- 2264US2022230951A1Magnetic inductor structures for package devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 2361US12057252B2Electronic substrates having embedded inductorsINTEL CORP·Filed 2020·Granted Aug 6, 2024·0 cites·11 claims
- 2461US2022013265A1Electronic substrates having embedded dielectric magnetic material to form inductorsINTEL CORP·Filed 2021·Application pending·0 cites
- 2558US12327814B2Electronic substrate core having an embedded laser stop to control depth of an ultra-deep cavityINTEL CORP·Filed 2021·Granted Jun 10, 2025·0 cites·20 claims
- 2656US12481108B2Faraday rotator interconnect as a through-via configuration in a patch architectureINTEL CORP·Filed 2020·Granted Nov 25, 2025·0 cites·19 claims
- 2756US11450471B2Methods to selectively embed magnetic materials in substrate and corresponding structuresINTEL CORP·Filed 2018·Granted Sep 20, 2022·0 cites·19 claims
- 2855US11417614B2Methods to embed magnetic material as first layer on coreless substrates and corresponding structuresINTEL CORP·Filed 2018·Granted Aug 16, 2022·0 cites·22 claims
- 2953US2025246519A1Integrated circuit die stack with a dual-sided bridge dieADVANCED MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 3052US2025167192A1Integrated circuit die stack with a bridge dieADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 3151US10672859B2Embedded magnetic inductorINTEL CORP·Filed 2018·Granted Jun 2, 2020·0 cites·12 claims
- 3250US10692965B23D conductive ink printing method and inductor formed thereofINTEL CORP·Filed 2018·Granted Jun 23, 2020·0 cites·11 claims
- 3350US2023101340A1Multichip package staircase cavitiesINTEL CORP·Filed 2021·Application pending·0 cites
- 3449US12327797B2Microelectronic structures including glass coresINTEL CORP·Filed 2020·Granted Jun 10, 2025·0 cites·6 claims
- 3549US2022375865A1Microelectronic assemblies with glass substrates and magnetic core inductorsINTEL CORP·Filed 2021·Application pending·0 cites
- 3648US2022413240A1Substrate cavity with alignment features to align an optical connectorINTEL CORP·Filed 2021·Application pending·0 cites
- 3747US11355459B2Embedding magnetic material, in a cored or coreless semiconductor packageINTEL CORP·Filed 2018·Granted Jun 7, 2022·0 cites·25 claims
- 3847US11289263B2Electronic substrates having embedded magnetic material using photo-imagable dielectric layersINTEL CORP·Filed 2017·Granted Mar 29, 2022·0 cites·20 claims
- 3947US11244912B2Semiconductor package having a coaxial first layer interconnectINTEL CORP·Filed 2017·Granted Feb 8, 2022·0 cites·20 claims
- 4047US2022196914A1Waveguide with self-aligned mirror in package for long range chip-to-chip communicationsINTEL CORP·Filed 2020·Application pending·0 cites
- 4147US2023420396A1Device-to-device communication system, packages, and package systemINTEL CORP·Filed 2020·Application pending·0 cites
- 4247US2024021522A1Wireless chip-to-chip high-speed data transportINTEL CORP·Filed 2020·Application pending·0 cites
- 4346US11610706B2Release layer-assisted selective embedding of magnetic material in cored and coreless organic substratesINTEL CORP·Filed 2018·Granted Mar 21, 2023·0 cites·12 claims
- 4446US2022085143A1Magnetic wires and their applicationsINTEL CORP·Filed 2020·Application pending·0 cites
- 4545US11651902B2Patterning of thin film capacitors in organic substrate packagesINTEL CORP·Filed 2018·Granted May 16, 2023·0 cites·17 claims
- 4638US2020006211A1Substrate assembly region with ceramic or boron fiberINTEL CORP·Filed 2018·Application pending·0 cites
- 4736US2019373736A1Creating a cavity using plasma gasJAIN RAHUL·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →