Inventor · disambiguated record
Scott M. Hayes
Also filed as: HAYES SCOTT M
65 granted patents·16 pending applications·376 citations·filing 2005–2024
98Inventor score
Top patents by PatentIndex Score
81 records- 0197US8916421B2Semiconductor device packaging having pre-encapsulation through via formation using lead frames with attached signal conduitsGONG ZHIWEI·Filed 2011·Granted Dec 23, 2014·65 cites·17 claims
- 0295US11404288B1Semiconductor device packaging warpage controlNXP USA INC·Filed 2021·Granted Aug 2, 2022·3 cites·20 claims
- 0395US7145084B1Radiation shielded module and method of shielding microelectronic deviceFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Dec 5, 2006·45 cites·10 claims
- 0494US10651541B1Package integrated waveguideNXP USA INC·Filed 2019·Granted May 12, 2020·13 cites·20 claims
- 0594US9761565B2Microelectronic packages having embedded sidewall substrates and methods for the producing thereofNXP USA INC·Filed 2017·Granted Sep 12, 2017·10 cites·19 claims
- 0694US9673150B2EMI/RFI shielding for semiconductor device packagesGONG ZHIWEI·Filed 2014·Granted Jun 6, 2017·18 cites·18 claims
- 0794US8216918B2Method of forming a packaged semiconductor deviceGONG ZHIWEI·Filed 2010·Granted Jul 10, 2012·22 cites·5 claims
- 0893US11791283B2Semiconductor device packaging warpage controlNXP USA INC·Filed 2021·Granted Oct 17, 2023·2 cites·16 claims
- 0992US11557525B2Semiconductor package thermal spreader having integrated RF/EMI shielding and antenna elementsNXP USA INC·Filed 2021·Granted Jan 17, 2023·3 cites·11 claims
- 1092US9595485B2Microelectronic packages having embedded sidewall substrates and methods for the producing thereofVINCENT MICHAEL B·Filed 2014·Granted Mar 14, 2017·11 cites·17 claims
- 1191US11133273B2Semiconductor device with waveguide and method thereforNXP USA INC·Filed 2019·Granted Sep 28, 2021·7 cites·11 claims
- 1291US9355985B2Microelectronic packages having sidewall-deposited heat spreader structures and methods for the fabrication thereofVINCENT MICHAEL B·Filed 2014·Granted May 31, 2016·12 cites·20 claims
- 1391US8617935B2Back side alignment structure and manufacturing method for three-dimensional semiconductor device packagesXU JIANWEN·Filed 2011·Granted Dec 31, 2013·14 cites·20 claims
- 1490US10074614B2EMI/RFI shielding for semiconductor device packagesNXP USA INC·Filed 2017·Granted Sep 11, 2018·6 cites·19 claims
- 1590US9673162B2High power semiconductor package subsystemsVISWANATHAN LAKSHMINARAYAN·Filed 2012·Granted Jun 6, 2017·11 cites·10 claims
- 1688US11031681B2Package integrated waveguideNXP USA INC·Filed 2019·Granted Jun 8, 2021·6 cites·20 claims
- 1788US8597983B2Semiconductor device packaging having substrate with pre-encapsulation through via formationGONG ZHIWEI·Filed 2011·Granted Dec 3, 2013·10 cites·13 claims
- 1888US7981730B2Integrated conformal shielding method and process using redistributed chip packagingFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Jul 19, 2011·17 cites·17 claims
- 1987US12243842B2Semiconductor device with open cavity and method thereforNXP USA INC·Filed 2021·Granted Mar 4, 2025·1 cites·7 claims
- 2087US9093457B2Stacked microelectronic packages having patterned sidewall conductors and methods for the fabrication thereofGONG ZHIWEI·Filed 2012·Granted Jul 28, 2015·10 cites·13 claims
- 2186US9142502B2Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduitsGONG ZHIWEI·Filed 2011·Granted Sep 22, 2015·9 cites·13 claims
- 2285US8592241B2Method for packaging an electronic device assembly having a capped device interconnectHAYES SCOTT M·Filed 2011·Granted Nov 26, 2013·12 cites·19 claims
- 2384US7985659B1Semiconductor device with a controlled cavity and method of formationFREESCALE SEMICONDUCTOR INC·Filed 2010·Granted Jul 26, 2011·5 cites·20 claims
- 2483US9263420B2Devices and stacked microelectronic packages with package surface conductors and methods of their fabricationVINCENT MICHAEL B·Filed 2013·Granted Feb 16, 2016·5 cites·14 claims
- 2582US9107303B2Warp compensated electronic assembliesFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Aug 11, 2015·5 cites·15 claims
- 2682US8327532B2Method for releasing a microelectronic assembly from a carrier substrateXU JIANWEN·Filed 2009·Granted Dec 11, 2012·8 cites·18 claims
- 2781US9190390B2Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereofGONG ZHIWEI TONY·Filed 2012·Granted Nov 17, 2015·8 cites·20 claims
- 2880US8829661B2Warp compensated package and methodLYTLE WILLIAM H·Filed 2006·Granted Sep 9, 2014·11 cites·18 claims
- 2976US11760623B2No-gel pressure sensor packageNXP USA INC·Filed 2022·Granted Sep 19, 2023·0 cites·20 claims
- 3076US2025029947A1Semiconductor device with open cavity and method thereforNXP USA INC·Filed 2024·Application pending·0 cites
- 3176US2025006511A1Semiconductor device packaging warpage controlNXP USA INC·Filed 2024·Application pending·0 cites
- 3275US9799636B2Packaged devices with multiple planes of embedded electronic devicesFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Oct 24, 2017·2 cites·7 claims
- 3375US9502363B2Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layersVINCENT MICHAEL B·Filed 2014·Granted Nov 22, 2016·4 cites·16 claims
- 3474US9142434B2Method for singulating electronic components from a substrateGAO WEI·Filed 2008·Granted Sep 22, 2015·4 cites·7 claims
- 3572US9548280B2Solder pad for semiconductor device packageFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Jan 17, 2017·3 cites·15 claims
- 3671US10834817B2Plated opening with vent pathNXP USA INC·Filed 2018·Granted Nov 10, 2020·1 cites·9 claims
- 3771US2023369248A1Semiconductor device packaging warpage controlNXP USA INC·Filed 2023·Application pending·0 cites
- 3870US11935809B2Semiconductor package thermal spreader having integrated EF/EMI shielding and antenna elementsNXP USA INC·Filed 2022·Granted Mar 19, 2024·0 cites·20 claims
- 3969US11335652B2Method, system, and apparatus for forming three-dimensional semiconductor device package with waveguideNXP USA INC·Filed 2019·Granted May 17, 2022·1 cites·20 claims
- 4069US10211177B2High power semiconductor package subsystemsNXP USA INC·Filed 2017·Granted Feb 19, 2019·1 cites·10 claims
- 4168US12033950B2Semiconductor device with self-aligned waveguide and method thereforNXP USA INC·Filed 2021·Granted Jul 9, 2024·0 cites·13 claims
- 4268US10143084B2Plated opening with vent pathNXP USA INC·Filed 2016·Granted Nov 27, 2018·1 cites·14 claims
- 4367US12469773B2Semiconductor device with attached battery and method thereforNXP USA INC·Filed 2022·Granted Nov 11, 2025·0 cites·14 claims
- 4467US11837560B2Semiconductor device with waveguide and method thereforNXP USA INC·Filed 2021·Granted Dec 5, 2023·0 cites·20 claims
- 4567US9997492B2Optically-masked microelectronic packages and methods for the fabrication thereofYAP WENG F·Filed 2013·Granted Jun 12, 2018·2 cites·20 claims
- 4667US9520323B2Microelectronic packages having trench vias and methods for the manufacture thereofVINCENT MICHAEL B·Filed 2012·Granted Dec 13, 2016·2 cites·18 claims
- 4765US12125716B2Semiconductor device packaging warpage controlNXP USA INC·Filed 2021·Granted Oct 22, 2024·0 cites·16 claims
- 4864US11498829B2No-gel pressure sensor packageNXP USA INC·Filed 2020·Granted Nov 15, 2022·0 cites·15 claims
- 4964US9257415B2Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereofVINCENT MICHAEL B·Filed 2015·Granted Feb 9, 2016·1 cites·20 claims
- 5063US9570387B1Three-dimensional integrated circuit systems in a package and methods thereforFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Feb 14, 2017·1 cites·12 claims
Showing the top 50 of 81 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →