Inventor · disambiguated record
Seok Geun Ahn
Also filed as: AHN SEOK GEUN
8 granted patents·7 pending applications·9 citations·filing 2017–2024
78Inventor score
Top patents by PatentIndex Score
15 records- 0191US10340244B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Jul 2, 2019·7 cites·20 claims
- 0285US12500199B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Dec 16, 2025·0 cites·20 claims
- 0381US11018107B2Semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted May 25, 2021·2 cites·22 claims
- 0472US12033970B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jul 9, 2024·0 cites·20 claims
- 0560US2025306268A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0659US2024222299A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0757US11562965B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 24, 2023·0 cites·20 claims
- 0855US2024055337A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0955US2024128176A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1052US12418004B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 16, 2025·0 cites·20 claims
- 1151US11515262B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 29, 2022·0 cites·20 claims
- 1251US2024063129A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1350US11469133B2Bonding apparatus and semiconductor package fabrication equipment including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 11, 2022·0 cites·20 claims
- 1446US2024014117A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1546US2024264393A1Silicon photonics package, method of manufacturing the same, and switch packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →