Inventor · disambiguated record
Sergey G. Belostotskiy
Also filed as: BELOSTOTSKIY SERGEY G · BELOSTOTSKIY SERGEY GEORGIYEVICH
13 granted patents·9 pending applications·517 citations·filing 2011–2023
92Inventor score
Top patents by PatentIndex Score
22 records- 0198US10923367B2Process chamber for etching low K and other dielectric filmsAPPLIED MATERIALS INC·Filed 2018·Granted Feb 16, 2021·41 cites·34 claims
- 0298US9093389B2Method of patterning a silicon nitride dielectric filmAPPLIED MATERIALS INC·Filed 2014·Granted Jul 28, 2015·104 cites·19 claims
- 0398US8802572B2Method of patterning a low-k dielectric filmAPPLIED MATERIALS INC·Filed 2013·Granted Aug 12, 2014·115 cites·20 claims
- 0497US9165783B2Method of patterning a low-k dielectric filmNEMANI SRINIVAS D·Filed 2013·Granted Oct 20, 2015·118 cites·17 claims
- 0597US8748322B1Silicon oxide recess etchAPPLIED MATERIALS INC·Filed 2013·Granted Jun 10, 2014·125 cites·19 claims
- 0692US9666414B2Process chamber for etching low k and other dielectric filmsAPPLIED MATERIALS INC·Filed 2012·Granted May 30, 2017·9 cites·34 claims
- 0776US10096496B2Process chamber for etching low K and other dielectric filmsAPPLIED MATERIALS INC·Filed 2017·Granted Oct 9, 2018·1 cites·18 claims
- 0874US11410860B2Process chamber for etching low k and other dielectric filmsAPPLIED MATERIALS INC·Filed 2021·Granted Aug 9, 2022·0 cites·20 claims
- 0968US11302519B2Method of patterning a low-k dielectric filmAPPLIED MATERIALS INC·Filed 2015·Granted Apr 12, 2022·1 cites·20 claims
- 1064US9601301B2Non-intrusive measurement of a wafer DC self-bias in semiconductor processing equipmentAPPLIED MATERIALS INC·Filed 2014·Granted Mar 21, 2017·1 cites·20 claims
- 1164US9368370B2Temperature ramping using gas distribution plate heatAPPLIED MATERIALS INC·Filed 2015·Granted Jun 14, 2016·1 cites·20 claims
- 1264US8932959B2Method and system for etching plural layers on a workpiece including a lower layer containing an advanced memory materialAPPLIED MATERIALS INC·Filed 2013·Granted Jan 13, 2015·1 cites·17 claims
- 1355US2023073259A1High temperature substrate support with heat spreaderLAM RES CORP·Filed 2021·Application pending·0 cites
- 1453US2025054736A1A wafer chuck assembly with thermal insulation for rf connectionsLAM RES CORP·Filed 2023·Application pending·0 cites
- 1551US2025038034A1Method and apparatus for radio frequency grid design in an esc to reduce film asymmetryLAM RES CORP·Filed 2023·Application pending·0 cites
- 1650US2025022740A1System for monitoring performance of electrostatic chucks in substrate processing systemsLAM RES CORP·Filed 2022·Application pending·0 cites
- 1745US2015040829A1Multizone hollow cathode discharge system with coaxial and azimuthal symmetry and with consistent central triggerAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 1844US8580693B2Temperature enhanced electrostatic chucking in plasma processing apparatusBELOSTOTSKIY SERGEY G·Filed 2011·Granted Nov 12, 2013·0 cites·19 claims
- 1942US2015064921A1Low temperature plasma anneal process for sublimative etch processesAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 2042US2014342569A1Near surface etch selectivity enhancementAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 2136US2014311581A1Pressure controller configuration for semiconductor processing applicationsAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 2233US2014262031A1Multi-mode etch chamber source assemblyBELOSTOTSKIY SERGEY G·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →