Inventor · disambiguated record
Se Woong Cha
Also filed as: CHA SE WOONG
25 granted patents·4 pending applications·142 citations·filing 2008–2025
95Inventor score
Top patents by PatentIndex Score
29 records- 0195US9831282B2Electronic device package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Nov 28, 2017·9 cites·20 claims
- 0294US9431447B2Package of finger print sensor and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Aug 30, 2016·8 cites·20 claims
- 0394US8946883B2Wafer level fan-out package with a fiducial dieAMKOR TECHNOLOGY INC·Filed 2013·Granted Feb 3, 2015·23 cites·20 claims
- 0494US8058726B1Semiconductor device having redistribution layerJIN JUNG GI·Filed 2008·Granted Nov 15, 2011·52 cites·1 claims
- 0593US9129873B2Package of finger print sensor and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2013·Granted Sep 8, 2015·10 cites·20 claims
- 0692US10304890B2Electronic device package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted May 28, 2019·5 cites·22 claims
- 0791US10784178B2Wafer-level stack chip package and method of manufacturing the sameAMKOR TECHNOLOGY INC·Filed 2015·Granted Sep 22, 2020·7 cites·18 claims
- 0890US12033910B2Wafer-level stack chip package and method of manufacturing the sameAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jul 9, 2024·2 cites·20 claims
- 0990US10692918B2Electronic device package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2019·Granted Jun 23, 2020·3 cites·20 claims
- 1089US12230661B2Electronic device package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Feb 18, 2025·0 cites·20 claims
- 1188US9818685B2Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layersAMKOR TECHNOLOGY INC·Filed 2016·Granted Nov 14, 2017·4 cites·20 claims
- 1287US9741701B2Method of manufacturing a package-on-package type semiconductor packageAMKOR TECHNOLOGY INC·Filed 2015·Granted Aug 22, 2017·4 cites·20 claims
- 1384US9123543B1Semiconductor device and manufacturing method thereofJIN JUNG GI·Filed 2011·Granted Sep 1, 2015·8 cites·18 claims
- 1482US10290621B2Method of manufacturing a package-on-package type semiconductor packageAMKOR TECHNOLOGY INC·Filed 2017·Granted May 14, 2019·2 cites·20 claims
- 1581US11961867B2Electronic device package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Apr 16, 2024·0 cites·20 claims
- 1680US12255197B2Package-on-package type semiconductor packageAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Mar 18, 2025·0 cites·20 claims
- 1780US2025160031A1Electronic device package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 1879US2025158007A1Method of manufacturing a package-on-package type semiconductor packageAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 1979US2024363470A1Wafer-level stack chip package and method of manufacturing the sameAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 2078US2023057803A1Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layersAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Application pending·0 cites
- 2176US10199322B2Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layersAMKOR TECHNOLOGY INC·Filed 2017·Granted Feb 5, 2019·1 cites·20 claims
- 2274US11362128B2Electronic device package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jun 14, 2022·0 cites·20 claims
- 2373US11508712B2Method of manufacturing a package-on-package type semiconductor packageAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Nov 22, 2022·0 cites·20 claims
- 2472US11424180B2Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layersAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Aug 23, 2022·0 cites·20 claims
- 2570US9406639B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2013·Granted Aug 2, 2016·2 cites·29 claims
- 2664US10672699B2Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layersAMKOR TECHNOLOGY INC·Filed 2019·Granted Jun 2, 2020·0 cites·19 claims
- 2763US10867984B2Method of manufacturing a package-on-package type semiconductor packageAMKOR TECHNOLOGY INC·Filed 2019·Granted Dec 15, 2020·0 cites·6 claims
- 2860US7982316B1Semiconductor package having a land to absorb thermal and mechanical stress and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2008·Granted Jul 19, 2011·2 cites·16 claims
- 2950US10115705B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Oct 30, 2018·0 cites·18 claims
Join the waitlist — get patent alerts
Get an alert when Se Woong Cha files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →