Inventor · disambiguated record
Seung-Yong Choi
Also filed as: CHOI SEUNG YONG
16 granted patents·11 pending applications·306 citations·filing 2001–2017
94Inventor score
Technology areasH10W
Files withFAIRCHILD KR SEMICONDUCTOR LTD8SAMSUNG ELECTRO MECH8FAIRCHILD SEMICONDUCTOR3CHOI SEUNG-YONG2LIM SEUNG-WON2
Top patents by PatentIndex Score
27 records- 0191US6574107B2Stacked intelligent power module packageFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2001·Granted Jun 3, 2003·99 cites·18 claims
- 0290US7632719B2Wafer-level chip scale package and method for fabricating and using the sameFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2009·Granted Dec 15, 2009·21 cites·15 claims
- 0388US7268414B2Semiconductor package having solder joint of improved reliabilityFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2003·Granted Sep 11, 2007·53 cites·16 claims
- 0488US7154186B2Multi-flip chip on lead frame on over molded IC package and method of assemblyFAIRCHILD SEMICONDUCTOR·Filed 2004·Granted Dec 26, 2006·42 cites·13 claims
- 0587US7936054B2Multi-chip packageFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2008·Granted May 3, 2011·22 cites·19 claims
- 0685US7638861B2Flip chip MLP with conductive inkFAIRCHILD SEMICONDUCTOR·Filed 2006·Granted Dec 29, 2009·14 cites·8 claims
- 0782US9706661B2Electronic device module and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2015·Granted Jul 11, 2017·5 cites·9 claims
- 0882US7335532B2Method of assembly for multi-flip chip on lead frame on overmolded IC packageFAIRCHILD SEMICONDUCTOR·Filed 2006·Granted Feb 26, 2008·9 cites·2 claims
- 0978US9510461B2Electric component module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Nov 29, 2016·6 cites·14 claims
- 1078US7786570B2Heat sink packageFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2009·Granted Aug 31, 2010·6 cites·7 claims
- 1178US7492043B2Power module flip chip packageFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2004·Granted Feb 17, 2009·27 cites·10 claims
- 1267US8604606B2Heat sink packageEOM JOO-YANG·Filed 2010·Granted Dec 10, 2013·2 cites·16 claims
- 1351US9929116B2Electronic device module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Mar 27, 2018·0 cites·6 claims
- 1451US2014217572A1Heat Sink PackageFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2013·Application pending·0 cites
- 1549US9673123B2Electronic device module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Jun 6, 2017·0 cites·10 claims
- 1647US9147627B2Flip chip MLP with conductive inkCHOI SEUNG-YONG·Filed 2009·Granted Sep 29, 2015·0 cites·8 claims
- 1744US2009146284A1Molded Leadless Packages and Assemblies Having Stacked Molded Leadless PackagesKIM JI-HWAN·Filed 2008·Application pending·0 cites
- 1843US2010140786A1Semiconductor power module package having external bonding areaFAIRCHILD KR SEMICONDUCTOR LTD·Filed 2009·Application pending·0 cites
- 1942US2009189272A1Wafer Level Chip Scale Packages Including Redistribution Substrates and Methods of Fabricating the SamePARK MIN-HYO·Filed 2009·Application pending·0 cites
- 2042US2015062854A1Electronic component module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2141US2014145348A1Rf (radio frequency) module and method of maufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2240US2005012225A1Wafer-level chip scale package and method for fabricating and using the sameFiled 2004·Application pending·0 cites
- 2340US2009243079A1Semiconductor device packageLIM SEUNG-WON·Filed 2009·Application pending·0 cites
- 2439US2009244848A1Power Device Substrates and Power Device Packages Including the SameLIM SEUNG-WON·Filed 2008·Application pending·0 cites
- 2538US8168475B2Semiconductor package formed within an encapsulationCHOI SEUNG-YONG·Filed 2010·Granted May 1, 2012·0 cites·10 claims
- 2631US2016029486A1Solder joint structure and electronic component module including the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 2731US2017243833A1Package module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →