Inventor · disambiguated record
Setho Sing Fee
Also filed as: FEE SETHO S · FEE SETHO SING
30 granted patents·1 pending application·1,586 citations·filing 2000–2013
98Inventor score
Technology areasH10W
Files withMICRON TECHNOLOGY INC25FEE SETHO SING2ST ASSEMBLY TEST SERVICES PTE2ST ASSEMBLY TEST SERVICE LTD1ST ASSEMBLY TEST SERVICES LTD1
Top patents by PatentIndex Score
31 records- 0198US7573136B2Semiconductor device assemblies and packages including multiple semiconductor device componentsMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 11, 2009·128 cites·9 claims
- 0298US7198980B2Methods for assembling multiple semiconductor devicesMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 3, 2007·230 cites·22 claims
- 0398US6906415B2Semiconductor device assemblies and packages including multiple semiconductor devices and methodsMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 14, 2005·203 cites·55 claims
- 0497US6951982B2Packaged microelectronic component assembliesMICRON TECHNOLOGY INC·Filed 2002·Granted Oct 4, 2005·159 cites·37 claims
- 0597US6876066B2Packaged microelectronic devices and methods of forming sameMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 5, 2005·137 cites·31 claims
- 0696US7109572B2Quad flat no lead (QFN) grid array packageMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 19, 2006·78 cites·15 claims
- 0796US6967125B2Quad flat no lead (QFN) grid array package, method of making and memory module and computer system including sameMICRON TECHNOLOGY INC·Filed 2001·Granted Nov 22, 2005·94 cites·24 claims
- 0896US6746894B2Ball grid array interposer, packages and methodsMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 8, 2004·249 cites·56 claims
- 0995US6943450B2Packaged microelectronic devices and methods of forming sameMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 13, 2005·93 cites·15 claims
- 1093US7075816B2Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including sameMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 11, 2006·55 cites·20 claims
- 1188US7279780B2Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including sameMICRON TECHNOLOGY INC·Filed 2005·Granted Oct 9, 2007·12 cites·16 claims
- 1284US8703599B2Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contactsMICRON TECHNOLOGY INC·Filed 2012·Granted Apr 22, 2014·5 cites·20 claims
- 1381US7977157B2Methods of forming integrated circuit packages, and methods of assembling integrated circuit packagesMICRON TECHNOLOGY INC·Filed 2010·Granted Jul 12, 2011·4 cites·4 claims
- 1481US6773960B2Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrateMICRON TECHNOLOGY INC·Filed 2003·Granted Aug 10, 2004·21 cites·26 claims
- 1580US7745944B2Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contactsMICRON TECHNOLOGY INC·Filed 2005·Granted Jun 29, 2010·7 cites·13 claims
- 1674US6403401B1Heat spreader hole pin 1 identifierST ASSEMBLY TEST SERVICES PTE·Filed 2000·Granted Jun 11, 2002·22 cites·7 claims
- 1773US7528007B2Methods for assembling semiconductor devices and interposersMICRON TECHNOLOGY INC·Filed 2006·Granted May 5, 2009·5 cites·22 claims
- 1873US6537857B2Enhanced BGA grounded heatsinkST ASSEMBLY TEST SERVICE LTD·Filed 2001·Granted Mar 25, 2003·18 cites·11 claims
- 1971US7112876B2Interposers and other carriers including a slot with laterally recessed area at an end thereof and semiconductor device assemblies and packages including such carriersMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 26, 2006·3 cites·18 claims
- 2071US6870247B2Interposer with a lateral recess in a slot to facilitate connection of intermediate conductive elements to bond pads of a semiconductor die with which the interposer is assembledMICRON TECHNOLOGY INC·Filed 2001·Granted Mar 22, 2005·12 cites·18 claims
- 2170US7700406B2Methods of assembling integrated circuit packagesMICRON TECHNOLOGY INC·Filed 2007·Granted Apr 20, 2010·3 cites·7 claims
- 2268US7274095B2Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposersMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 25, 2007·12 cites·32 claims
- 2367US8709866B2Methods of forming integrated circuit packagesMICRON TECHNOLOGY INC·Filed 2013·Granted Apr 29, 2014·1 cites·9 claims
- 2464US7183134B2Ultrathin leadframe BGA circuit packageMICRON TECHNOLOGY INC·Filed 2004·Granted Feb 27, 2007·10 cites·26 claims
- 2563US6951777B2Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrateMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 4, 2005·7 cites·27 claims
- 2662US7294911B2Ultrathin leadframe BGA circuit packageMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 13, 2007·9 cites·47 claims
- 2753US6828671B2Enhanced BGA grounded heatsinkST ASSEMBLY TEST SERVICES PTE·Filed 2002·Granted Dec 7, 2004·5 cites·22 claims
- 2850US6750534B2Heat spreader hole pin 1 identifierST ASSEMBLY TEST SERVICES LTD·Filed 2002·Granted Jun 15, 2004·4 cites·4 claims
- 2947US8531031B2Integrated circuit packagesFEE SETHO SING·Filed 2011·Granted Sep 10, 2013·0 cites·9 claims
- 3046US8319332B2Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contactsFEE SETHO SING·Filed 2010·Granted Nov 27, 2012·0 cites·26 claims
- 3146US2007099344A1Ultrathin leadframe BGA circuit packageMICRON TECHNOLOGY INC·Filed 2006·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Setho Sing Fee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →