Inventor · disambiguated record
Se Hwan Hong
Also filed as: HONG SE HWAN
9 granted patents·3 pending applications·23 citations·filing 2016–2024
84Inventor score
Top patents by PatentIndex Score
12 records- 0195US9728476B2Fingerprint sensor and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Aug 8, 2017·11 cites·7 claims
- 0294US9984947B2Fingerprint sensor and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted May 29, 2018·9 cites·13 claims
- 0386US11495505B2Semiconductor devices and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Nov 8, 2022·2 cites·19 claims
- 0486US2024321658A1Sensor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 0583US12002725B2Sensor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Jun 4, 2024·0 cites·31 claims
- 0676US11682598B2Sensor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jun 20, 2023·0 cites·11 claims
- 0772US11177187B2Sensor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Nov 16, 2021·0 cites·20 claims
- 0871US11961775B2Semiconductor devices and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Apr 16, 2024·0 cites·18 claims
- 0965US11398455B2Semiconductor devices and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Jul 26, 2022·1 cites·19 claims
- 1063US10672676B2Sensor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Jun 2, 2020·0 cites·20 claims
- 1158US2025364411A1Electronic devices and methods of manufacturing electronic devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 1254US2024250035A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →