Inventor · disambiguated record
Sean S. Kang
Also filed as: KANG SEAN · KANG SEAN S
57 granted patents·14 pending applications·1,610 citations·filing 2001–2025
99Inventor score
Top patents by PatentIndex Score
71 records- 0199US9269590B2Spacer formationAPPLIED MATERIALS INC·Filed 2014·Granted Feb 23, 2016·195 cites·15 claims
- 0298US9543163B2Methods for forming features in a material layer utilizing a combination of a main etching and a cyclical etching processAPPLIED MATERIALS INC·Filed 2013·Granted Jan 10, 2017·114 cites·19 claims
- 0398US9478433B1Cyclic spacer etching process with improved profile controlAPPLIED MATERIALS INC·Filed 2015·Granted Oct 25, 2016·109 cites·20 claims
- 0498US8980758B1Methods for etching an etching stop layer utilizing a cyclical etching processAPPLIED MATERIALS INC·Filed 2013·Granted Mar 17, 2015·192 cites·18 claims
- 0598US8895449B1Delicate dry cleanAPPLIED MATERIALS INC·Filed 2013·Granted Nov 25, 2014·182 cites·17 claims
- 0698US7084070B1Treatment for corrosion in substrate processingLAM RES CORP·Filed 2003·Granted Aug 1, 2006·247 cites·50 claims
- 0797US10720341B2Gas delivery system for high pressure processing chamberMICROMATERIALS LLC·Filed 2018·Granted Jul 21, 2020·20 cites·9 claims
- 0897US10622214B2Tungsten defluorination by high pressure treatmentAPPLIED MATERIALS INC·Filed 2017·Granted Apr 14, 2020·15 cites·20 claims
- 0997US10529603B2High pressure wafer processing systems and related methodsMICROMATERIALS LLC·Filed 2019·Granted Jan 7, 2020·20 cites·20 claims
- 1097US10269571B2Methods for fabricating nanowire for semiconductor applicationsAPPLIED MATERIALS INC·Filed 2017·Granted Apr 23, 2019·19 cites·20 claims
- 1197US10224224B2High pressure wafer processing systems and related methodsMICROMATERIALS LLC·Filed 2017·Granted Mar 5, 2019·19 cites·24 claims
- 1297US8748322B1Silicon oxide recess etchAPPLIED MATERIALS INC·Filed 2013·Granted Jun 10, 2014·125 cites·19 claims
- 1396US10636704B2Seam-healing method upon supra-atmospheric process in diffusion promoting ambientAPPLIED MATERIALS INC·Filed 2018·Granted Apr 28, 2020·14 cites·20 claims
- 1495US10847360B2High pressure treatment of silicon nitride filmAPPLIED MATERIALS INC·Filed 2017·Granted Nov 24, 2020·15 cites·17 claims
- 1595US10049927B2Seam-healing method upon supra-atmospheric process in diffusion promoting ambientAPPLIED MATERIALS INC·Filed 2016·Granted Aug 14, 2018·14 cites·20 claims
- 1694US10593518B1Methods and apparatus for etching semiconductor structuresAPPLIED MATERIALS INC·Filed 2019·Granted Mar 17, 2020·9 cites·20 claims
- 1794US9412579B2Methods and apparatus for controlling substrate uniformityAPPLIED MATERIALS INC·Filed 2013·Granted Aug 9, 2016·16 cites·15 claims
- 1894US8992792B2Method of fabricating an ultra low-k dielectric self-aligned viaAPPLIED MATERIALS INC·Filed 2012·Granted Mar 31, 2015·20 cites·8 claims
- 1993US7307025B1Lag controlLAM RES CORP·Filed 2005·Granted Dec 11, 2007·26 cites·15 claims
- 2091US11527421B2Gas delivery system for high pressure processing chamberMICROMATERIALS LLC·Filed 2020·Granted Dec 13, 2022·2 cites·17 claims
- 2191US7892445B1Wafer electrical discharge control using argon free dechucking gasLAM RES CORP·Filed 2007·Granted Feb 22, 2011·23 cites·20 claims
- 2290US10177050B2Methods and apparatus for controlling substrate uniformityAPPLIED MATERIALS INC·Filed 2016·Granted Jan 8, 2019·5 cites·12 claims
- 2387US11495470B1Method of enhancing etching selectivity using a pulsed plasmaAPPLIED MATERIALS INC·Filed 2021·Granted Nov 8, 2022·2 cites·17 claims
- 2487US9721807B2Cyclic spacer etching process with improved profile controlAPPLIED MATERIALS INC·Filed 2016·Granted Aug 1, 2017·4 cites·17 claims
- 2587US9006106B2Method of removing a metal hardmaskKAO CHIA-LING·Filed 2013·Granted Apr 14, 2015·9 cites·18 claims
- 2686US7541291B2Reduction of feature critical dimensionsLAM RES CORP·Filed 2007·Granted Jun 2, 2009·11 cites·29 claims
- 2784US6930048B1Etching a metal hard mask for an integrated circuit structureLAM RES CORP·Filed 2002·Granted Aug 16, 2005·43 cites·32 claims
- 2883US7250371B2Reduction of feature critical dimensionsLAM RES CORP·Filed 2003·Granted Jul 31, 2007·27 cites·11 claims
- 2981US10424487B2Atomic layer etching processesAPPLIED MATERIALS INC·Filed 2017·Granted Sep 24, 2019·3 cites·19 claims
- 3081US9520302B2Methods for controlling Fin recess loadingAPPLIED MATERIALS INC·Filed 2015·Granted Dec 13, 2016·3 cites·19 claims
- 3181US7782591B2Methods of and apparatus for reducing amounts of particles on a wafer during wafer de-chuckingLAM RES CORP·Filed 2007·Granted Aug 24, 2010·9 cites·18 claims
- 3279US11756803B2Gas delivery system for high pressure processing chamberMICROMATERIALS LLC·Filed 2022·Granted Sep 12, 2023·0 cites·20 claims
- 3379US11373877B2Methods and apparatus for in-situ protection liners for high aspect ratio reactive ion etchingAPPLIED MATERIALS INC·Filed 2020·Granted Jun 28, 2022·1 cites·20 claims
- 3478US8987139B2Method of patterning a low-k dielectric filmKAO CHIA-LING·Filed 2014·Granted Mar 24, 2015·4 cites·20 claims
- 3576US2025300095A1Stress and overlay management for semiconductor processingAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 3675US6969685B1Etching a dielectric layer in an integrated circuit structure having a metal hard mask layerLAM RES CORP·Filed 2002·Granted Nov 29, 2005·18 cites·34 claims
- 3775US6909195B2Trench etch process for low-k dielectricsLAM RES CORP·Filed 2004·Granted Jun 21, 2005·16 cites·5 claims
- 3874US12198951B2High pressure wafer processing systems and related methodsAPPLIED MATERIALS INC·Filed 2018·Granted Jan 14, 2025·1 cites·17 claims
- 3974US7789991B1Lag controlLAM RES CORP·Filed 2007·Granted Sep 7, 2010·4 cites·6 claims
- 4073US12354973B2Stress and overlay management for semiconductor processingAPPLIED MATERIALS INC·Filed 2022·Granted Jul 8, 2025·0 cites·13 claims
- 4172US6794293B2Trench etch process for low-k dielectricsLAM RES CORP·Filed 2001·Granted Sep 21, 2004·14 cites·19 claims
- 4271US11164723B2Methods and apparatus for etching semiconductor structuresAPPLIED MATERIALS INC·Filed 2021·Granted Nov 2, 2021·0 cites·20 claims
- 4371US9299577B2Methods for etching a dielectric barrier layer in a dual damascene structureAPPLIED MATERIALS INC·Filed 2014·Granted Mar 29, 2016·2 cites·18 claims
- 4471US8283255B2In-situ photoresist strip during plasma etching of active hard maskCHO SANGJUN·Filed 2007·Granted Oct 9, 2012·4 cites·18 claims
- 4571US7192531B1In-situ plug fillLAM RES CORP·Filed 2003·Granted Mar 20, 2007·14 cites·17 claims
- 4670US6919278B2Method for etching silicon carbideLAM RES CORP·Filed 2002·Granted Jul 19, 2005·10 cites·19 claims
- 4768US10930471B2Methods and apparatus for etching semiconductor structuresAPPLIED MATERIALS INC·Filed 2020·Granted Feb 23, 2021·0 cites·20 claims
- 4868US10062575B2Poly directional etch by oxidationAPPLIED MATERIALS INC·Filed 2016·Granted Aug 28, 2018·1 cites·20 claims
- 4965US9514953B2Methods for barrier layer removalAPPLIED MATERIALS INC·Filed 2014·Granted Dec 6, 2016·1 cites·20 claims
- 5064US11705337B2Tungsten defluorination by high pressure treatmentAPPLIED MATERIALS INC·Filed 2019·Granted Jul 18, 2023·0 cites·22 claims
Showing the top 50 of 71 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →