Inventor · disambiguated record
Seok Ho Na
Also filed as: NA SEOK-HO
6 granted patents·4 pending applications·15 citations·filing 1997–2023
75Inventor score
Files withAMKOR TECH SINGAPORE HOLDING PTE LTD5AMKOR TECHNOLOGY INC3ANAM IND CO LTD1LG DISPLAY CO LTD1
Top patents by PatentIndex Score
10 records- 0189US10141269B2Semiconductor device having conductive wire with increased attachment angle and methodAMKOR TECHNOLOGY INC·Filed 2016·Granted Nov 27, 2018·8 cites·17 claims
- 0268US7847398B2Semiconductor device having a stacked bump to reduce kirkendall voids and or cracks and method of manufacturingAMKOR TECHNOLOGY INC·Filed 2007·Granted Dec 7, 2010·4 cites·16 claims
- 0366US11804447B2Semiconductor device having conductive wire with increased attachment angle and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Oct 31, 2023·0 cites·18 claims
- 0460US2023411342A1Laser bonded devices, laser bonding tools, and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Application pending·0 cites
- 0558US2023189640A1Organic light emitting diode and organic light emitting device including the sameLG DISPLAY CO LTD·Filed 2022·Application pending·0 cites
- 0657US2023088061A1Laser bonded devices, laser bonding tools, and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Application pending·0 cites
- 0755US10943871B2Semiconductor device having conductive wire with increased attachment angle and methodAMKOR TECHNOLOGY INC·Filed 2018·Granted Mar 9, 2021·0 cites·20 claims
- 0839US11749637B2Hybrid bonding interconnection using laser and thermal compressionAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Sep 5, 2023·0 cites·21 claims
- 0938US2021398936A1Laser bonded devices, laser bonding tools, and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Application pending·0 cites
- 1025US5894008AMethod for manufacturing an alumina-silicon carbide nanocompositeANAM IND CO LTD·Filed 1997·Granted Apr 13, 1999·3 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →