Inventor · disambiguated record
Serafin P. Pedron, Jr.
Also filed as: PEDRON JR SERAFIN · PEDRON JR SERAFIN P · PEDRON JR SERAFIN PADILLA · PEDRON SERAFIN
13 granted patents·1 pending application·433 citations·filing 1996–2017
93Inventor score
Technology areasH10W
Top patents by PatentIndex Score
14 records- 0197US7358119B2Thin array plastic package without die attach pad and process for fabricating the sameASAT LTD·Filed 2005·Granted Apr 15, 2008·78 cites·24 claims
- 0294US6818980B1Stacked semiconductor package and method of manufacturing the sameASAT LTD·Filed 2003·Granted Nov 16, 2004·113 cites·14 claims
- 0392US6940154B2Integrated circuit package and method of manufacturing the integrated circuit packageASAT LTD·Filed 2002·Granted Sep 6, 2005·110 cites·99 claims
- 0488US7858443B2Leadless integrated circuit package having standoff contacts and die attach padUTAC HONG KONG LTD·Filed 2009·Granted Dec 28, 2010·19 cites·9 claims
- 0583US6188130B1Exposed heat spreader with seal ringADVANCED TECHNOLOGY INTERCONNE·Filed 1999·Granted Feb 13, 2001·70 cites·8 claims
- 0681US8736037B2Leadless integrated circuit package having standoff contacts and die attach padPOWELL KIRK·Filed 2010·Granted May 27, 2014·8 cites·20 claims
- 0773US10381280B2Semiconductor packages and methods for forming semiconductor packageUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Aug 13, 2019·2 cites·23 claims
- 0873US9613877B2Semiconductor packages and methods for forming semiconductor packageUNITED TEST AND ASSEMBLY CENTER LTD·Filed 2013·Granted Apr 4, 2017·4 cites·18 claims
- 0973US9305889B2Leadless integrated circuit package having standoff contacts and die attach padUTAC HONG KONG LTD·Filed 2014·Granted Apr 5, 2016·3 cites·10 claims
- 1066US8828801B2Leadless array plastic package with various IC packaging configurationsUTAC HONG KONG LTD·Filed 2013·Granted Sep 9, 2014·2 cites·20 claims
- 1153US5877551ASemiconductor package having a ground or power ring and a metal substrateOLIN CORP·Filed 1996·Granted Mar 2, 1999·23 cites·9 claims
- 1252US9196504B2Thermal leadless array package with die attach pad locking featureLOH ALBERT·Filed 2012·Granted Nov 24, 2015·1 cites·11 claims
- 1336US8486762B2Leadless array plastic package with various IC packaging configurationsMCMILLAN JOHN·Filed 2010·Granted Jul 16, 2013·0 cites·32 claims
- 1433US2003143776A1Method of manufacturing an encapsulated integrated circuit packageFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →