Inventor · disambiguated record
Seiki Sakuyama
Also filed as: SAKUYAMA SEIKI
47 granted patents·12 pending applications·483 citations·filing 1994–2019
98Inventor score
Top patents by PatentIndex Score
59 records- 0194US6580169B2Method for forming bumps, semiconductor device, and solder pasteFUJITSU LTD·Filed 2002·Granted Jun 17, 2003·52 cites·9 claims
- 0290US6518163B2Method for forming bumps, semiconductor device, and solder pasteFUJITSU LTD·Filed 2000·Granted Feb 11, 2003·36 cites·34 claims
- 0388US7984841B2Member formed with coating film having tin as its main component, coating film forming method and soldering methodFUJITSU LTD·Filed 2005·Granted Jul 26, 2011·4 cites·5 claims
- 0487US5770835AProcess and apparatus and panel heater for soldering electronic components to printed circuit boardFUJITSU LTD·Filed 1997·Granted Jun 23, 1998·51 cites·17 claims
- 0586US5607609AProcess and apparatus for soldering electronic components to printed circuit board, and assembly of electronic components and printed circuit board obtained by way of solderingFUJITSU LTD·Filed 1994·Granted Mar 4, 1997·43 cites·53 claims
- 0685US9402313B2Conductive material, conductive paste, circuit board, and semiconductor deviceFUJITSU LTD·Filed 2014·Granted Jul 26, 2016·5 cites·6 claims
- 0784US6461953B1Solder bump forming method, electronic component mounting method, and electronic component mounting structureFUJITSU LTD·Filed 1999·Granted Oct 8, 2002·54 cites·11 claims
- 0882US6670264B2Method of making electrode-to-electrode bond structure and electrode-to-electrode bond structure made therebyFUJITSU LTD·Filed 2002·Granted Dec 30, 2003·26 cites·36 claims
- 0981US6630742B2Method for forming bumps, semiconductor device, and solder pasteFUJITSU LTD·Filed 2003·Granted Oct 7, 2003·18 cites·3 claims
- 1080US11057996B2Circuit board, method of manufacturing circuit board, and electronic deviceFUJITSU LTD·Filed 2019·Granted Jul 6, 2021·3 cites·11 claims
- 1180US7189927B2Electronic component with bump electrodes, and manufacturing method thereofFUJITSU LTD·Filed 2003·Granted Mar 13, 2007·29 cites·17 claims
- 1279US9137926B2Electronic device and method of manufacturing the sameFUJITSU LTD·Filed 2012·Granted Sep 15, 2015·5 cites·14 claims
- 1379US8673050B2Conductive material, conductive paste, circuit board, and semiconductor deviceSAKUYAMA SEIKI·Filed 2010·Granted Mar 18, 2014·4 cites·6 claims
- 1479US6689639B2Method of making semiconductor deviceFUJITSU LTD·Filed 2002·Granted Feb 10, 2004·30 cites·27 claims
- 1578US8713792B2Method of manufacturing a printed wiring boardSAKAI TAIJI·Filed 2010·Granted May 6, 2014·5 cites·4 claims
- 1676US6135344AReflow soldering method and a reflow soldering furnaceFUJITSU LTD·Filed 1998·Granted Oct 24, 2000·34 cites·5 claims
- 1774US7743966B2Soldering flux and method for bonding semiconductor elementFUJITSU LTD·Filed 2006·Granted Jun 29, 2010·3 cites·4 claims
- 1873US10283434B2Electronic device, method for manufacturing the electronic device, and electronic apparatusFUJITSU LTD·Filed 2016·Granted May 7, 2019·2 cites·9 claims
- 1973US9105600B2Sheet structure, method of manufacturing sheet structure, and electronic deviceFUJITSU LTD·Filed 2013·Granted Aug 11, 2015·3 cites·5 claims
- 2073US6345757B1Reflow soldering methodFUJITSU LTD·Filed 2000·Granted Feb 12, 2002·16 cites·2 claims
- 2172US6524943B1Method of forming metal bumpsFUJITSU LTD·Filed 2001·Granted Feb 25, 2003·16 cites·7 claims
- 2271US9412715B2Semiconductor device, electronic device, and semiconductor device manufacturing methodFUJITSU LTD·Filed 2014·Granted Aug 9, 2016·2 cites·10 claims
- 2371US8740047B2Method of manufacturing electronic apparatus, electronic component-mounting board, and method of manufacturing the sameFUJITSU LTD·Filed 2013·Granted Jun 3, 2014·2 cites·3 claims
- 2468US9462693B2Electronic device and method of manufacturing electronic deviceFUJITSU LTD·Filed 2014·Granted Oct 4, 2016·2 cites·14 claims
- 2566US8556157B2Method of manufacturing electronic apparatus, electronic component-mounting board, and method of manufacturing the sameSAKUYAMA SEIKI·Filed 2011·Granted Oct 15, 2013·2 cites·8 claims
- 2663US9305875B2Method of manufacturing semiconductor device capable of enhancing bonding strength between connection terminal and electrodeFUJITSU LTD·Filed 2013·Granted Apr 5, 2016·1 cites·11 claims
- 2762US7119000B2Method of manufacturing semiconductor deviceFUJITSU LTD·Filed 2004·Granted Oct 10, 2006·10 cites·8 claims
- 2862US2011244133A1Member formed with coating film having tin as its main component, coating film forming method and soldering methodFUJITSU LTD·Filed 2011·Application pending·0 cites
- 2962US2011244261A1Member formed with coating film having tin as its main component, coating film forming method and soldering methodFUJITSU LTD·Filed 2011·Application pending·0 cites
- 3059US9490232B2Electronic apparatus and method for fabricating the sameFUJITSU LTD·Filed 2014·Granted Nov 8, 2016·0 cites·9 claims
- 3157US9812418B2Electronic apparatus and method for fabricating the sameFUJITSU LTD·Filed 2016·Granted Nov 7, 2017·0 cites·2 claims
- 3257US9761552B2Electronic apparatus and method for fabricating the sameFUJITSU LTD·Filed 2016·Granted Sep 12, 2017·0 cites·6 claims
- 3357US7931760B2Whiskerless plated structure and plating methodFUJITSU LTD·Filed 2006·Granted Apr 26, 2011·0 cites·3 claims
- 3456US9530745B2Electronic apparatus and method for fabricating the sameFUJITSU LTD·Filed 2016·Granted Dec 27, 2016·0 cites·4 claims
- 3556US8952271B2Circuit board, semiconductor device, and method of manufacturing semiconductor deviceFUJITSU LTD·Filed 2013·Granted Feb 10, 2015·0 cites·6 claims
- 3653US8673762B2Solder, soldering method, and semiconductor deviceAKAMATSU TOSHIYA·Filed 2011·Granted Mar 18, 2014·1 cites·4 claims
- 3753US7926696B2CompositionFUJITSU LTD·Filed 2010·Granted Apr 19, 2011·0 cites·3 claims
- 3853US6275750B1Apparatus for setting heating condition in heating furnace and thermal analyzer for object to be heated in heating furnaceFUJITSU LTD·Filed 1998·Granted Aug 14, 2001·21 cites·9 claims
- 3953US2009090543A1Circuit board, semiconductor device, and method of manufacturing semiconductor deviceFUJITSU LTD·Filed 2008·Application pending·0 cites
- 4053US2011163261A1CompositionFUJITSU LTD·Filed 2011·Application pending·0 cites
- 4152US2014202739A1Printed wiring board having metal layers producing eutectic reactionFUJITSU LTD·Filed 2014·Application pending·0 cites
- 4251US6873056B2Electrode-to-electrode bond structureFUJITSU LTD·Filed 2003·Granted Mar 29, 2005·3 cites·3 claims
- 4351US2010218853A1Soldering flux and method for bonding semiconductor elementFUJITSU LTD·Filed 2010·Application pending·0 cites
- 4450US9620470B2Semiconductor device having connection terminal of solderFUJITSU LTD·Filed 2016·Granted Apr 11, 2017·0 cites·3 claims
- 4550US8901751B2Semiconductor device, electronic device, and semiconductor device manufacturing methodFUJITSU LTD·Filed 2012·Granted Dec 2, 2014·0 cites·10 claims
- 4649US10056342B2Electronic component and electronic deviceFUJITSU LTD·Filed 2012·Granted Aug 21, 2018·0 cites·8 claims
- 4748US9831210B2Electronic device and electronic apparatusFUJITSU LTD·Filed 2016·Granted Nov 28, 2017·0 cites·15 claims
- 4848US9831199B2Electronic device, electronic part, and solderFUJITSU LTD·Filed 2016·Granted Nov 28, 2017·0 cites·9 claims
- 4948US2007224444A1Plating film and forming method thereofFUJITSU LTD·Filed 2006·Application pending·0 cites
- 5047US10167537B2Electronic apparatus and method for manufacturing the sameFUJITSU LTD·Filed 2015·Granted Jan 1, 2019·0 cites·10 claims
Showing the top 50 of 59 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →