Inventor · disambiguated record
Sesha Varadarajan
Also filed as: VARADARAJAN SESHA
12 granted patents·770 citations·filing 2001–2020
92Inventor score
Top patents by PatentIndex Score
12 records- 0197US9355886B2Conformal film deposition for gapfillNOVELLUS SYSTEMS INC·Filed 2013·Granted May 31, 2016·53 cites·14 claims
- 0296US10665429B2Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformityLAM RES CORP·Filed 2017·Granted May 26, 2020·6 cites·20 claims
- 0396US9793096B2Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformityLAM RES CORP·Filed 2015·Granted Oct 17, 2017·16 cites·18 claims
- 0496US7745346B2Method for improving process control and film conformality of PECVD filmNOVELLUS SYSTEMS INC·Filed 2008·Granted Jun 29, 2010·538 cites·23 claims
- 0594US6793796B2Electroplating process for avoiding defects in metal features of integrated circuit devicesNOVELLUS SYSTEMS INC·Filed 2001·Granted Sep 21, 2004·92 cites·22 claims
- 0693US8168540B1Methods and apparatus for depositing copper on tungstenREID JONATHAN·Filed 2009·Granted May 1, 2012·29 cites·30 claims
- 0777US6884335B2Electroplating using DC current interruption and variable rotation rateNOVELLUS SYSTEMS INC·Filed 2003·Granted Apr 26, 2005·23 cites·57 claims
- 0876US9460915B2Systems and methods for reducing backside deposition and mitigating thickness changes at substrate edgesLAM RES CORP·Filed 2014·Granted Oct 4, 2016·3 cites·8 claims
- 0974US8192806B1Plasma particle extraction process for PECVDVARADARAJAN SESHA·Filed 2008·Granted Jun 5, 2012·10 cites·12 claims
- 1069US11127567B2Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformityLAM RES CORP·Filed 2020·Granted Sep 21, 2021·0 cites·24 claims
- 1161US8377824B1Methods and apparatus for depositing copper on tungstenNOVELLUS SYSTEMS INC·Filed 2012·Granted Feb 19, 2013·0 cites·20 claims
- 1250US9852901B2Systems and methods for reducing backside deposition and mitigating thickness changes at substrate edgesLAM RES CORP·Filed 2016·Granted Dec 26, 2017·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →