Inventor · disambiguated record
Seokmin Yun
Also filed as: YUN SEOKMIN
14 granted patents·11 pending applications·100 citations·filing 2004–2022
90Inventor score
Top patents by PatentIndex Score
25 records- 0190US8617993B2Method of reducing pattern collapse in high aspect ratio nanostructuresYASSERI AMIR A·Filed 2010·Granted Dec 31, 2013·22 cites·11 claims
- 0289US7329321B2Enhanced wafer cleaning methodLAM RES CORP·Filed 2005·Granted Feb 12, 2008·13 cites·13 claims
- 0386US7810513B1Substrate preparation using megasonic coupling fluid meniscus and methods, apparatus, and systems for implementing the sameLAM RES CORP·Filed 2005·Granted Oct 12, 2010·10 cites·16 claims
- 0485US7584761B1Wafer edge surface treatment with liquid meniscusLAM RES CORP·Filed 2005·Granted Sep 8, 2009·10 cites·8 claims
- 0582US7294580B2Method for plasma stripping using periodic modulation of gas chemistry and hydrocarbon additionLAM RES CORP·Filed 2004·Granted Nov 13, 2007·29 cites·20 claims
- 0679US7597765B2Post etch wafer surface cleaning with liquid meniscusLAM RES CORP·Filed 2006·Granted Oct 6, 2009·7 cites·15 claims
- 0775US8021512B2Method of preventing premature dryingLAM RES CORP·Filed 2007·Granted Sep 20, 2011·4 cites·18 claims
- 0872US7568488B2Enhanced wafer cleaning methodLAM RES CORP·Filed 2007·Granted Aug 4, 2009·3 cites·6 claims
- 0961US7967916B2Method of preventing pattern collapse during rinsing and dryingLAM RES CORP·Filed 2008·Granted Jun 28, 2011·1 cites·14 claims
- 1059US12205793B2Method and apparatus for anisotropic pattern etching and treatmentLAM RES CORP·Filed 2021·Granted Jan 21, 2025·0 cites·19 claims
- 1158US9236279B2Method of dielectric film treatmentYUN SEOKMIN·Filed 2008·Granted Jan 12, 2016·1 cites·17 claims
- 1253US2023245865A1Movable disk with aperture for etch controlLAM RES CORP·Filed 2022·Application pending·0 cites
- 1353US2024355597A1Ion beam etch system and methodLAM RES CORP·Filed 2022·Application pending·0 cites
- 1452US2014170780A1Method of Low-K Dielectric Film RepairLAM RES CORP·Filed 2014·Application pending·0 cites
- 1551US2010015731A1Method of low-k dielectric film repairLAM RES CORP·Filed 2007·Application pending·0 cites
- 1651US2023268192A1In-situ hydrocarbon-based layer for non-conformal passivation of partially etched structuresLAM RES CORP·Filed 2022·Application pending·0 cites
- 1749US2009211596A1Method of post etch polymer residue removalLAM RES CORP·Filed 2007·Application pending·0 cites
- 1848US2019148109A1Method and Apparatus for Anisotropic Pattern Etching and TreatmentLAM RES CORP·Filed 2017·Application pending·0 cites
- 1944US2022102624A1Ion beam etching with gas treatment and pulsingLAM RES CORP·Filed 2020·Application pending·0 cites
- 2043US2012115332A1Method of Post Etch Polymer Residue RemovalYUN SEOKMIN·Filed 2012·Application pending·0 cites
- 2140US8828145B2Method of particle contaminant removalSABBA YIZHAK·Filed 2009·Granted Sep 9, 2014·0 cites·10 claims
- 2240US2010319726A1Substrate preparation using megasonic coupling fluid meniscusBOYD JOHN M·Filed 2010·Application pending·0 cites
- 2339US8277675B2Method of damaged low-k dielectric film layer removalYUN SEOKMIN·Filed 2006·Granted Oct 2, 2012·0 cites·17 claims
- 2437US8277570B2Method of preventing premature dryingYUN SEOKMIN·Filed 2011·Granted Oct 2, 2012·0 cites·13 claims
- 2528US2012103371A1Method and apparatus for drying a semiconductor waferYUN SEOKMIN·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →