Inventor · disambiguated record
Shih-Hung Chen
Also filed as: CHEN SHIH-HUNG
169 granted patents·21 pending applications·2,485 citations·filing 2005–2025
99Inventor score
Top patents by PatentIndex Score
190 records- 0199US8503213B2Memory architecture of 3D array with alternating memory string orientation and string select structuresCHEN SHIH-HUNG·Filed 2011·Granted Aug 6, 2013·110 cites·26 claims
- 0299US8363476B2Memory device, manufacturing method and operating method of the sameMACRONIX INT CO LTD·Filed 2011·Granted Jan 29, 2013·74 cites·26 claims
- 0399US7786460B2Phase change memory device and manufacturing methodMACRONIX INT CO LTD·Filed 2007·Granted Aug 31, 2010·259 cites·23 claims
- 0499US7321130B2Thin film fuse phase change RAM and manufacturing methodMACRONIX INT CO LTD·Filed 2005·Granted Jan 22, 2008·171 cites·17 claims
- 0599US7238994B2Thin film plate phase change ram circuit and manufacturing methodMACRONIX INT CO LTD·Filed 2005·Granted Jul 3, 2007·143 cites·23 claims
- 0698US8759217B1Method for forming interlayer connectors to a stack of conductive layersCHEN SHIH-HUNG·Filed 2013·Granted Jun 24, 2014·45 cites·20 claims
- 0798US8759899B1Integration of 3D stacked IC device with peripheral circuitsLUE HANG-TING·Filed 2013·Granted Jun 24, 2014·86 cites·8 claims
- 0898US8383512B2Method for making multilayer connection structureMACRONIX INT CO LTD·Filed 2011·Granted Feb 26, 2013·58 cites·16 claims
- 0998US7688619B2Phase change memory cell and manufacturing methodMACRONIX INT CO LTD·Filed 2006·Granted Mar 30, 2010·289 cites·17 claims
- 1098US7514334B2Thin film plate phase change RAM circuit and manufacturing methodMACRONIX INT CO LTD·Filed 2007·Granted Apr 7, 2009·74 cites·5 claims
- 1197US7423300B2Single-mask phase change memory elementMACRONIX INT CO LTD·Filed 2006·Granted Sep 9, 2008·112 cites·17 claims
- 1296US9219074B2Three-dimensional semiconductor deviceMACRONIX INT CO LTD·Filed 2014·Granted Dec 22, 2015·12 cites·20 claims
- 1396US8970040B1Contact structure and forming methodMACRONIX INT CO LTD·Filed 2013·Granted Mar 3, 2015·27 cites·6 claims
- 1496US8928149B2Interlayer conductor and method for formingMACRONIX INT CO LTD·Filed 2013·Granted Jan 6, 2015·26 cites·9 claims
- 1596US8598032B2Reduced number of masks for IC device with stacked contact levelsCHEN SHIH-HUNG·Filed 2011·Granted Dec 3, 2013·27 cites·17 claims
- 1695US8138028B2Method for manufacturing a phase change memory device with pillar bottom electrodeLUNG HSIANG LAN·Filed 2007·Granted Mar 20, 2012·25 cites·27 claims
- 1795US7608503B2Side wall active pin memory and manufacturing methodMACRONIX INT CO LTD·Filed 2005·Granted Oct 27, 2009·30 cites·34 claims
- 1894US9876055B1Three-dimensional semiconductor device and method for forming the sameMACRONIX INT CO LTD·Filed 2016·Granted Jan 23, 2018·10 cites·16 claims
- 1994US9449966B2Three-dimensional semiconductor device and method of manufacturing the sameMACRONIX INT CO LTD·Filed 2015·Granted Sep 20, 2016·12 cites·20 claims
- 2094US9147672B1Three-dimensional multiple chip packages including multiple chip stacksMACRONIX INT CO LTD·Filed 2014·Granted Sep 29, 2015·16 cites·20 claims
- 2194US9070447B2Contact structure and forming methodMACRONIX INT CO LTD·Filed 2014·Granted Jun 30, 2015·15 cites·9 claims
- 2294US9047953B2Memory device structure with page buffers in a page-buffer level separate from the array levelMACRONIX INT CO LTD·Filed 2013·Granted Jun 2, 2015·10 cites·16 claims
- 2394US8944739B2Loadport bridge for semiconductor fabrication toolsCHEN SHIH-HUNG·Filed 2012·Granted Feb 3, 2015·18 cites·19 claims
- 2494US8836137B2Method for creating a 3D stacked multichip moduleCHEN SHIH-HUNG·Filed 2012·Granted Sep 16, 2014·16 cites·12 claims
- 2594US8633099B1Method for forming interlayer connectors in a three-dimensional stacked IC deviceSHIH YEN-HAO·Filed 2012·Granted Jan 21, 2014·30 cites·19 claims
- 2694US8168538B2Buried silicide structure and method for makingCHEN SHIH-HUNG·Filed 2009·Granted May 1, 2012·82 cites·13 claims
- 2794US8110822B2Thermal protect PCRAM structure and methods for makingCHEN SHIH-HUNG·Filed 2009·Granted Feb 7, 2012·27 cites·19 claims
- 2894US7932507B2Current constricting phase change memory element structureIBM·Filed 2010·Granted Apr 26, 2011·14 cites·14 claims
- 2994US7579613B2Thin film fuse phase change RAM and manufacturing methodMACRONIX INT CO LTD·Filed 2007·Granted Aug 25, 2009·29 cites·11 claims
- 3093US9679849B13D NAND array with sides having undulating shapesMACRONIX INT CO LTD·Filed 2016·Granted Jun 13, 2017·10 cites·20 claims
- 3193US9583439B1Memory device comprising memory strings penetrating through a stacking structure and electrically contacting with a metal layer and method for fabricating the sameMACRONIX INT CO LTD·Filed 2015·Granted Feb 28, 2017·9 cites·9 claims
- 3293US9418743B13D NAND memory with decoder and local word line driversMACRONIX INT CO LTD·Filed 2015·Granted Aug 16, 2016·15 cites·20 claims
- 3393US9196628B13D stacked IC device with stepped substack interlayer connectorsMACRONIX INT CO LTD·Filed 2014·Granted Nov 24, 2015·14 cites·24 claims
- 3493US7825473B2Initial-on SCR device for on-chip ESD protectionIND TECH RES INST·Filed 2005·Granted Nov 2, 2010·21 cites·13 claims
- 3593US7692907B2Circuit for electrostatic discharge (ESD) protectionIND TECH RES INST·Filed 2007·Granted Apr 6, 2010·25 cites·35 claims
- 3692US9165823B23D stacking semiconductor device and manufacturing method thereofMACRONIX INT CO LTD·Filed 2013·Granted Oct 20, 2015·14 cites·12 claims
- 3792US9142538B1Three-dimensional semiconductor deviceMACRONIX INT CO LTD·Filed 2014·Granted Sep 22, 2015·15 cites·14 claims
- 3891US9224473B1Word line repair for 3D vertical channel memoryMACRONIX INT CO LTD·Filed 2014·Granted Dec 29, 2015·10 cites·20 claims
- 3991US8704205B2Semiconductor structure with improved capacitance of bit lineCHEN SHIH-HUNG·Filed 2012·Granted Apr 22, 2014·13 cites·15 claims
- 4090US9343322B2Three dimensional stacking memory film structureMACRONIX INT CO LTD·Filed 2014·Granted May 17, 2016·9 cites·24 claims
- 4190US7804083B2Phase change memory cell including a thermal protect bottom electrode and manufacturing methodsMACRONIX INT CO LTD·Filed 2007·Granted Sep 28, 2010·19 cites·12 claims
- 4290US7635855B2I-shaped phase change memory cellMACRONIX INT CO LTD·Filed 2006·Granted Dec 22, 2009·19 cites·18 claims
- 4390US7442603B2Self-aligned structure and method for confining a melting point in a resistor random access memoryMACRONIX INT CO LTD·Filed 2006·Granted Oct 28, 2008·21 cites·24 claims
- 4489US10833015B23D NAND word line connection structureMACRONIX INT CO LTD·Filed 2020·Granted Nov 10, 2020·2 cites·10 claims
- 4589US10103164B2Three-dimensional semiconductor deviceMACRONIX INT CO LTD·Filed 2016·Granted Oct 16, 2018·6 cites·22 claims
- 4689US9437605B23D NAND array architectureMACRONIX INT CO LTD·Filed 2015·Granted Sep 6, 2016·6 cites·17 claims
- 4789US9219073B2Parallelogram cell design for high speed vertical channel 3D NAND memoryMACRONIX INT CO LTD·Filed 2014·Granted Dec 22, 2015·10 cites·17 claims
- 4889US8102001B2Initial-on SCR device for on-chip ESD protectionKER MING-DOU·Filed 2010·Granted Jan 24, 2012·8 cites·8 claims
- 4989US7929340B2Phase change memory cell and manufacturing methodMACRONIX INT CO LTD·Filed 2010·Granted Apr 19, 2011·12 cites·9 claims
- 5088US9472286B2Word line repair for 3D vertical channel memoryMACRONIX INT CO LTD·Filed 2015·Granted Oct 18, 2016·5 cites·10 claims
Showing the top 50 of 190 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →