Inventor · disambiguated record
Shantinath Ghongadi
Also filed as: GHONGADI JR SHANTINATH · GHONGADI SHANTINATH
41 granted patents·11 pending applications·278 citations·filing 2007–2024
97Inventor score
Top patents by PatentIndex Score
52 records- 0198US8262871B1Plating method and apparatus with multiple internally irrigated chambersMAYER STEVEN T·Filed 2009·Granted Sep 11, 2012·55 cites·21 claims
- 0297US8377268B2Electroplating cup assemblyNOVELLUS SYSTEMS INC·Filed 2011·Granted Feb 19, 2013·19 cites·23 claims
- 0397US7985325B2Closed contact electroplating cup assemblyNOVELLUS SYSTEMS INC·Filed 2007·Granted Jul 26, 2011·36 cites·24 claims
- 0497US7935231B2Rapidly cleanable electroplating cup assemblyNOVELLUS SYSTEMS INC·Filed 2007·Granted May 3, 2011·36 cites·24 claims
- 0594US11401623B2Controlling plating electrolyte concentration on an electrochemical plating apparatusLAM RES CORP·Filed 2021·Granted Aug 2, 2022·3 cites·26 claims
- 0694US9988734B2Lipseals and contact elements for semiconductor electroplating apparatusesNOVELLUS SYSTEMS INC·Filed 2015·Granted Jun 5, 2018·6 cites·22 claims
- 0793US11859300B2Controlling plating electrolyte concentration on an electrochemical plating apparatusLAM RES CORP·Filed 2022·Granted Jan 2, 2024·2 cites·18 claims
- 0893US8398831B2Rapidly cleanable electroplating cup sealGHONGADI SHANTINATH·Filed 2011·Granted Mar 19, 2013·18 cites·27 claims
- 0992US9816194B2Control of electrolyte flow dynamics for uniform electroplatingLAM RES CORP·Filed 2015·Granted Nov 14, 2017·8 cites·14 claims
- 1092US8172992B2Wafer electroplating apparatus for reducing edge defectsPRABHAKAR VINAY·Filed 2009·Granted May 8, 2012·21 cites·26 claims
- 1191US9735035B1Methods and apparatuses for estimating on-wafer oxide layer reduction effectiveness via color sensingLAM RES CORP·Filed 2016·Granted Aug 15, 2017·7 cites·15 claims
- 1291US9677190B2Membrane design for reducing defects in electroplating systemsLAM RES CORP·Filed 2014·Granted Jun 13, 2017·7 cites·23 claims
- 1390US9587322B2Wetting wave front control for reduced air entrapment during wafer entry into electroplating bathNOVELLUS SYSTEMS INC·Filed 2015·Granted Mar 7, 2017·6 cites·16 claims
- 1489US9685353B2Apparatus and method for edge bevel removal of copper from silicon wafersNOVELLUS SYSTEMS INC·Filed 2013·Granted Jun 20, 2017·8 cites·22 claims
- 1589US9028666B2Wetting wave front control for reduced air entrapment during wafer entry into electroplating bathRANJAN MANISH·Filed 2012·Granted May 12, 2015·14 cites·28 claims
- 1687US11512408B2Lipseals and contact elements for semiconductor electroplating apparatusesNOVELLUS SYSTEMS INC·Filed 2018·Granted Nov 29, 2022·1 cites·17 claims
- 1787US10927475B2Controlling plating electrolyte concentration on an electrochemical plating apparatusLAM RES CORP·Filed 2018·Granted Feb 23, 2021·4 cites·16 claims
- 1887US10011917B2Control of current density in an electroplating apparatusLAM RES CORP·Filed 2015·Granted Jul 3, 2018·5 cites·11 claims
- 1985US12157950B2Lipseals and contact elements for semiconductor electroplating apparatusesNOVELLUS SYSTEMS INC·Filed 2022·Granted Dec 3, 2024·0 cites·20 claims
- 2085US10214828B2Control of current density in an electroplating apparatusLAM RES CORP·Filed 2018·Granted Feb 26, 2019·3 cites·8 claims
- 2185US10214829B2Control of current density in an electroplating apparatusLAM RES CORP·Filed 2018·Granted Feb 26, 2019·3 cites·16 claims
- 2284US9028657B2Front referenced anodeFENG JINGBIN·Filed 2010·Granted May 12, 2015·5 cites·13 claims
- 2381US12392049B2Controlling plating electrolyte concentration on an electrochemical plating apparatusLAM RES CORP·Filed 2023·Granted Aug 19, 2025·0 cites·19 claims
- 2481US10443146B2Monitoring surface oxide on seed layers during electroplatingLAM RES CORP·Filed 2017·Granted Oct 15, 2019·1 cites·14 claims
- 2580US9340893B2Front referenced anodeNOVELLUS SYSTEMS INC·Filed 2015·Granted May 17, 2016·2 cites·14 claims
- 2680US2025130555A1In-situ sensor-fusion with artificial intelligenceLAM RES CORP·Filed 2024·Application pending·0 cites
- 2778US9816196B2Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyteNOVELLUS SYSTEMS INC·Filed 2013·Granted Nov 14, 2017·1 cites·19 claims
- 2878US8540857B1Plating method and apparatus with multiple internally irrigated chambersMAYER STEVEN·Filed 2012·Granted Sep 24, 2013·1 cites·22 claims
- 2978US2025122639A1Electrochemical deposition system including optical probesLAM RES CORP·Filed 2024·Application pending·0 cites
- 3075US9816193B2Configuration and method of operation of an electrodeposition system for improved process stability and performanceGANESAN KOUSIK·Filed 2011·Granted Nov 14, 2017·1 cites·16 claims
- 3174US10689774B2Control of current density in an electroplating apparatusLAM RES CORP·Filed 2019·Granted Jun 23, 2020·1 cites·13 claims
- 3272US10968531B2Wetting wave front control for reduced air entrapment during wafer entry into electroplating bathNOVELLUS SYSTEMS INC·Filed 2017·Granted Apr 6, 2021·1 cites·17 claims
- 3372US9512538B2Plating cup with contoured cup bottomHE ZHIAN·Filed 2012·Granted Dec 6, 2016·1 cites·16 claims
- 3472US2025003908A1Systems and methods for in-situ measurement of sheet resistance on substratesLAM RES CORP·Filed 2024·Application pending·0 cites
- 3571US11208732B2Monitoring surface oxide on seed layers during electroplatingLAM RES CORP·Filed 2019·Granted Dec 28, 2021·0 cites·8 claims
- 3671US10497592B2Methods and apparatuses for estimating on-wafer oxide layer reduction effectiveness via color sensingLAM RES CORP·Filed 2017·Granted Dec 3, 2019·1 cites·18 claims
- 3771US10351968B2Front referenced anodeNOVELLUS SYSTEMS INC·Filed 2016·Granted Jul 16, 2019·1 cites·24 claims
- 3867US12189369B2In-situ sensor-fusion with artificial intelligenceLAM RES CORP·Filed 2020·Granted Jan 7, 2025·0 cites·20 claims
- 3967US10745817B2Configuration and method of operation of an electrodeposition system for improved process stability and performanceNOVELLUS SYSTEMS INC·Filed 2017·Granted Aug 18, 2020·0 cites·19 claims
- 4063US2018030611A1Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyteNOVELLUS SYSTEMS INC·Filed 2017·Application pending·0 cites
- 4162US10053792B2Plating cup with contoured cup bottomNOVELLUS SYSTEMS INC·Filed 2016·Granted Aug 21, 2018·0 cites·6 claims
- 4261US12180607B2Electrochemical deposition system including optical probesLAM RES CORP·Filed 2020·Granted Dec 31, 2024·0 cites·19 claims
- 4361US12105039B2Systems and methods for in-situ measurement of sheet resistance on substratesLAM RES CORP·Filed 2020·Granted Oct 1, 2024·0 cites·19 claims
- 4457US2012181170A1Wafer electroplating apparatus for reducing edge defectsPRABHAKAR VINAY·Filed 2012·Application pending·0 cites
- 4557US2025187845A1Machine vision inspection of wafer processing toolLAM RES CORP·Filed 2022·Application pending·0 cites
- 4656US2023313408A1Plating-deplating waveform based contact cleaning for a substrate electroplating systemLAM RES CORP·Filed 2021·Application pending·0 cites
- 4755US11225727B2Control of current density in an electroplating apparatusLAM RES CORP·Filed 2020·Granted Jan 18, 2022·0 cites·8 claims
- 4850US2024213089A1Integrated atmospheric plasma treatment station in processing toolLAM RES CORP·Filed 2022·Application pending·0 cites
- 4948US2014001050A1Electroplating apparatuses and methods employing liquid particle counter modulesNOVELLUS SYSTEMS INC·Filed 2013·Application pending·0 cites
- 5046US2024055282A1Systems and techniques for optical measurement of thin filmsLAM RES CORP·Filed 2022·Application pending·0 cites
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →