Inventor · disambiguated record
Shih-Han Huang
Also filed as: HUANG SHIH-HAN
20 granted patents·13 pending applications·31 citations·filing 2013–2025
92Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD24DELTA ELECTRONICS INC5BENQ CORP1FBD BIOLOGICS LTD1HUANG LI MIN1
Top patents by PatentIndex Score
33 records- 0196US12315843B2Hybrid bonding technology for stacking integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 27, 2025·2 cites·20 claims
- 0292US10727205B2Hybrid bonding technology for stacking integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 28, 2020·6 cites·20 claims
- 0391US9653295B1Method of manufacturing a static random access memoryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 16, 2017·9 cites·20 claims
- 0490US11410972B2Hybrid bonding technology for stacking integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 9, 2022·2 cites·20 claims
- 0590US11322481B2Hybrid bonding technology for stacking integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 3, 2022·2 cites·20 claims
- 0688US12062679B2Backside structure for image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 13, 2024·1 cites·20 claims
- 0788US2025338660A1Backside structure for image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0887US9334868B2FanDELTA ELECTRONICS INC·Filed 2013·Granted May 10, 2016·7 cites·13 claims
- 0987US2025338659A1Csi with controllable isolation structure and methods of manufacturing and using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1085US2024355784A1Hybrid bonding technology for stacking integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1182US2024363664A1Backside structure for image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1282US2024379710A1Csi with controllable isolation structure and methods of manufacturing and using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1380US10504784B2Inductor structure for integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 10, 2019·2 cites·20 claims
- 1478US2025348648A1Bonded Semiconductor Device And Method For Forming The SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1574US12218166B2CSI with controllable isolation structure and methods of manufacturing and using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 4, 2025·0 cites·20 claims
- 1673US2023363134A1Preventing gate-to-contact bridging by reducing contact dimensions in finfet sramTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1770US10714488B2Using three or more masks to define contact-line-blocking components in FinFET SRAM fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 14, 2020·0 cites·20 claims
- 1866US10535668B1Using three or more masks to define contact-line-blocking components in FinFET SRAM fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 14, 2020·0 cites·20 claims
- 1963US10453852B2Using three or more masks to define contact-line-blocking components in FinFET SRAM fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 22, 2019·0 cites·20 claims
- 2062US10804155B2Inductor structure for integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 13, 2020·0 cites·20 claims
- 2162US10790194B2Inductor structure for integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 29, 2020·0 cites·20 claims
- 2262US2022277127A1Bonded Semiconductor Device And Method For Forming The SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 2362US2024396386A1Stator assembly of water pumpDELTA ELECTRONICS INC·Filed 2023·Application pending·0 cites
- 2461US11716894B2Method for preparing perovskite solar cellUNIV NAT TAIWAN·Filed 2021·Granted Aug 1, 2023·0 cites·16 claims
- 2559US10411020B2Using three or more masks to define contact-line-blocking components in FinFET SRAM fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 10, 2019·0 cites·20 claims
- 2657US11545495B2Preventing gate-to-contact bridging by reducing contact dimensions in FinFET SRAMTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 3, 2023·0 cites·20 claims
- 2756US11792969B2Preventing gate-to-contact bridging by reducing contact dimensions in FinFET SRAMTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 17, 2023·0 cites·20 claims
- 2855US2025051441A1Cd47/4-1bb-targeting protein complex and methods of use thereofFBD BIOLOGICS LTD·Filed 2022·Application pending·0 cites
- 2954US2025297618A1Water pump housing structureDELTA ELECTRONICS INC·Filed 2024·Application pending·0 cites
- 3052US10100845B2FanDELTA ELECTRONICS INC·Filed 2014·Granted Oct 16, 2018·0 cites·19 claims
- 3147US9989072B2FanDELTA ELECTRONICS INC·Filed 2013·Granted Jun 5, 2018·0 cites·20 claims
- 3235US2019330635A1Antiviral agent and method for treating viral infectionHUANG LI MIN·Filed 2018·Application pending·0 cites
- 3334US2017178493A1Wireless pairing systemBENQ CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →