Inventor · disambiguated record
Shuangwu Huang
Also filed as: HUANG SHUANGWU
14 granted patents·3 pending applications·385 citations·filing 2004–2021
93Inventor score
Files withPAGAILA REZA A9STATS CHIPPAC LTD3MARIMUTHU PANDI C1NINGBO HONGWU PIPE IND CO LTD1PAGAILA REZA ARGENTY1
Top patents by PatentIndex Score
17 records- 0198US8742579B2Semiconductor device and method of providing Z-interconnect conductive pillars with inner polymer corePAGAILA REZA A·Filed 2012·Granted Jun 3, 2014·101 cites·25 claims
- 0298US8193034B2Semiconductor device and method of forming vertical interconnect structure using stud bumpsPAGAILA REZA A·Filed 2009·Granted Jun 5, 2012·72 cites·20 claims
- 0398US8133762B2Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer corePAGAILA REZA A·Filed 2009·Granted Mar 13, 2012·84 cites·22 claims
- 0496US8258010B2Making a semiconductor device having conductive through organic viasPAGAILA REZA A·Filed 2009·Granted Sep 4, 2012·41 cites·29 claims
- 0596US8017515B2Semiconductor device and method of forming compliant polymer layer between UBM and conformal dielectric layer/RDL for stress reliefSTATS CHIPPAC LTD·Filed 2008·Granted Sep 13, 2011·49 cites·24 claims
- 0689US9842775B2Semiconductor device and method of forming a thin wafer without a carrierSTATS CHIPPAC PTE LTD·Filed 2016·Granted Dec 12, 2017·5 cites·16 claims
- 0784US9236352B2Semiconductor die and method of forming noise absorbing regions between THVs in peripheral region of the diePAGAILA REZA A·Filed 2011·Granted Jan 12, 2016·6 cites·32 claims
- 0882US9640504B2Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer coreSTATS CHIPPAC LTD·Filed 2014·Granted May 2, 2017·4 cites·20 claims
- 0981US8304286B2Integrated circuit packaging system with shielded package and method of manufacture thereofPAGAILA REZA ARGENTY·Filed 2009·Granted Nov 6, 2012·9 cites·20 claims
- 1080US9263361B2Semiconductor device having a vertical interconnect structure using stud bumpsPAGAILA REZA A·Filed 2012·Granted Feb 16, 2016·4 cites·15 claims
- 1173US9443762B2Semiconductor device and method of forming a thin wafer without a carrierSTATS CHIPPAC LTD·Filed 2013·Granted Sep 13, 2016·2 cites·23 claims
- 1272US8531015B2Semiconductor device and method of forming a thin wafer without a carrierMARIMUTHU PANDI C·Filed 2009·Granted Sep 10, 2013·5 cites·28 claims
- 1368US8093151B2Semiconductor die and method of forming noise absorbing regions between THVS in peripheral region of the diePAGAILA REZA A·Filed 2009·Granted Jan 10, 2012·3 cites·32 claims
- 1452US2012280402A1Semiconductor Die and Method of Forming through Organic Vias having Varying Width in Peripheral Region of the DiePAGAILA REZA A·Filed 2012·Application pending·0 cites
- 1552US2012280403A1Semiconductor Die and Method of Forming through Organic Vias having Varying Width in Peripheral Region of the DiePAGAILA REZA A·Filed 2012·Application pending·0 cites
- 1643US2004229400A1Multichip wafer level system packages and methods of forming sameFiled 2004·Application pending·0 cites
- 1740US11761565B2Clamp ring type metal sealgas pipe jointNINGBO HONGWU PIPE IND CO LTD·Filed 2021·Granted Sep 19, 2023·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →