Inventor · disambiguated record
Shoichi Kodama
Also filed as: KODAMA SHOICHI
12 granted patents·800 citations·filing 1990–2018
93Inventor score
Top patents by PatentIndex Score
12 records- 0193US5180273AApparatus for transferring semiconductor wafersTOSHIBA KK·Filed 1990·Granted Jan 19, 1993·477 cites·24 claims
- 0292US5679059APolishing aparatus and methodEBARA CORP·Filed 1995·Granted Oct 21, 1997·110 cites·83 claims
- 0382US5704827APolishing apparatus including cloth cartridge connected to turntableEBARA CORP·Filed 1995·Granted Jan 6, 1998·67 cites·20 claims
- 0479US5827110APolishing facilityTOSHIBA KK·Filed 1995·Granted Oct 27, 1998·64 cites·21 claims
- 0578US6997782B2Polishing apparatus and a method of polishing and cleaning and drying a waferTOSHIBA KK·Filed 2002·Granted Feb 14, 2006·16 cites·20 claims
- 0670US7198552B2Polishing apparatusTOSHIBA KK·Filed 2005·Granted Apr 3, 2007·2 cites·18 claims
- 0767US6500051B1Polishing apparatus and methodEBARA CORP·Filed 1997·Granted Dec 31, 2002·25 cites·57 claims
- 0865US6413154B1Polishing apparatusEBARA CORP·Filed 1999·Granted Jul 2, 2002·25 cites·19 claims
- 0957US7708618B2Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor deviceEBARA CORP·Filed 2007·Granted May 4, 2010·0 cites·6 claims
- 1052US6595220B2Apparatus for conveying a workpieceEBARA CORP·Filed 2001·Granted Jul 22, 2003·3 cites·13 claims
- 1150US10586699B2Method of assessing semiconductor substrate and method of assessing device chipDISCO CORP·Filed 2018·Granted Mar 10, 2020·0 cites·7 claims
- 1246US6221171B1Method and apparatus for conveying a workpieceEBARA CORP·Filed 1997·Granted Apr 24, 2001·11 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →