Inventor · disambiguated record
Shintaro Kogura
Also filed as: KOGURA SHINTARO
15 granted patents·4 pending applications·45 citations·filing 2008–2025
89Inventor score
Technology areasH10P
Top patents by PatentIndex Score
19 records- 0190US11434564B2Method of manufacturing semiconductor device, substrate processing apparatus, recording medium and method of processing substrateKOKUSAI ELECTRIC CORP·Filed 2020·Granted Sep 6, 2022·2 cites·20 claims
- 0290US10081868B2Gas supply nozzle, substrate processing apparatus, and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Sep 25, 2018·6 cites·19 claims
- 0385US2025349533A1Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 0481US12406843B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Sep 2, 2025·0 cites·26 claims
- 0581US9340872B2Cleaning method, manufacturing method of semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted May 17, 2016·3 cites·16 claims
- 0680US10036092B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Jul 31, 2018·3 cites·18 claims
- 0780USD610559SReaction tubeHITACHI INT ELECTRIC INC·Filed 2008·Granted Feb 23, 2010·26 cites·1 claims
- 0876US9496134B2Substrate processing apparatus, method of manufacturing semiconductor device and semiconductor deviceSASAKI SHINYA·Filed 2011·Granted Nov 15, 2016·4 cites·10 claims
- 0973US11885016B2Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Jan 30, 2024·0 cites·23 claims
- 1071US11823886B2Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Nov 21, 2023·0 cites·21 claims
- 1169US10096463B2Method of manufacturing semiconductor device, substrate processing apparatus comprising exhaust port and multiple nozzles, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Oct 9, 2018·1 cites·15 claims
- 1268US11728159B2Method of manufacturing semiconductor device, surface treatment method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Aug 15, 2023·0 cites·26 claims
- 1358US11257669B2Method of manufacturing semiconductor device, surface treatment method, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Feb 22, 2022·0 cites·22 claims
- 1453US2018363137A1Gas supply nozzle, substrate processing apparatus, and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2018·Application pending·0 cites
- 1548US10287680B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2018·Granted May 14, 2019·0 cites·16 claims
- 1647US2010083898A1Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2009·Application pending·0 cites
- 1745US11515152B2Method of manufacturing semiconductor device, substrate processing apparatus, and method of processing substrateKOKUSAI ELECTRIC CORP·Filed 2020·Granted Nov 29, 2022·0 cites·16 claims
- 1843US10066294B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Sep 4, 2018·0 cites·15 claims
- 1937US2012280369A1Method for manufacturing semiconductor device, substrate processing apparatus, and semiconductor deviceSAITO TATSUYUKI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →