Inventor · disambiguated record
Shunji Kubo
Also filed as: KUBO SHUNJI
15 granted patents·8 pending applications·63 citations·filing 1996–2020
92Inventor score
Files withRENESAS TECH CORP7MITSUBISHI ELECTRIC CORP6RENESAS ELECTRONICS CORP6HACHISUKA ATSUSHI2KUBO SHUNJI1
Top patents by PatentIndex Score
23 records- 0188US7508022B2Semiconductor device including a TCAM having a storage element formed with a DRAMRENESAS TECH CORP·Filed 2007·Granted Mar 24, 2009·11 cites·6 claims
- 0283US7498627B2Semiconductor device including a TCAM having a storage element formed with a DRAMRENESAS TECH CORP·Filed 2007·Granted Mar 3, 2009·7 cites·6 claims
- 0380US8072074B2Semiconductor device and method of manufacturing sameHACHISUKA ATSUSHI·Filed 2010·Granted Dec 6, 2011·5 cites·4 claims
- 0475US8963199B2Semiconductor device and method for manufacturing sameKUBO SHUNJI·Filed 2012·Granted Feb 24, 2015·5 cites·14 claims
- 0567US7563668B2Semiconductor device and method of manufacturing sameRENESAS TECH CORP·Filed 2006·Granted Jul 21, 2009·2 cites·10 claims
- 0667US7235836B2Semiconductor device including a TCAM having a storage element formed with a DRAMRENESAS TECH CORP·Filed 2005·Granted Jun 26, 2007·2 cites·6 claims
- 0765US6774423B2Semiconductor device having a capacitor with increased capacitanceRENESAS TECH CORP·Filed 2003·Granted Aug 10, 2004·10 cites·3 claims
- 0864US7005694B2Semiconductor device including a TCAM having a storage element formed with a DRAMRENESAS TECH CORP·Filed 2004·Granted Feb 28, 2006·7 cites·6 claims
- 0962US7884480B2Semiconductor device and method of manufacturing sameRENESAS ELECTRONICS CORP·Filed 2008·Granted Feb 8, 2011·1 cites·4 claims
- 1057US2014252441A1Semiconductor device and method of manufacturing sameRENESAS ELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 1153US2009127607A1Semiconductor device including a tcam having a storage element formed with a dramRENESAS TECH CORP·Filed 2009·Application pending·0 cites
- 1252US7145240B2Semiconductor device having a capacitor and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Dec 5, 2006·3 cites·4 claims
- 1348US2012056302A1Semiconductor device and method of manufacturing sameHACHISUKA ATSUSHI·Filed 2011·Application pending·0 cites
- 1447US6642093B2Method for manufacturing a semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Nov 4, 2003·7 cites·4 claims
- 1546US9257551B2Semiconductor device and method for manufacturing sameRENESAS ELECTRONICS CORP·Filed 2015·Granted Feb 9, 2016·0 cites·3 claims
- 1645US11171086B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2019·Granted Nov 9, 2021·0 cites·10 claims
- 1742US9608108B2Semiconductor device and method for manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted Mar 28, 2017·0 cites·18 claims
- 1838US2021233841A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2020·Application pending·0 cites
- 1936US2004067616A1Method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2003·Application pending·0 cites
- 2036US2003215997A1Method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 2134US2003213992A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 2233US2003098495A1Semiconductor deviceFiled 2002·Application pending·0 cites
- 2332US5893759ASemiconductor device and method of fabricating the sameMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Apr 13, 1999·3 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →