Inventor · disambiguated record
Sheng-Chan Li
Also filed as: LI SHENG · LI SHENG-CHAN
61 granted patents·25 pending applications·125 citations·filing 2015–2025
98Inventor score
Top patents by PatentIndex Score
86 records- 0198US11715674B2Trim wall protection method for multi-wafer stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 1, 2023·4 cites·20 claims
- 0298US11610812B2Multi-wafer capping layer for metal arcing protectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 21, 2023·7 cites·20 claims
- 0398US11152276B2Trim wall protection method for multi-wafer stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 19, 2021·17 cites·20 claims
- 0497US11581254B2Three dimensional MIM capacitor having a comb structure and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 14, 2023·4 cites·20 claims
- 0596US12027554B2Composite deep trench isolation structure in an image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 2, 2024·3 cites·20 claims
- 0696US10043841B1Image sensor device and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 7, 2018·20 cites·20 claims
- 0795US10734285B2Bonding support structure (and related process) for wafer stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 4, 2020·11 cites·20 claims
- 0894US11901387B2Image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 13, 2024·2 cites·20 claims
- 0994US11735624B2Multi-lateral recessed MIM structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 22, 2023·2 cites·20 claims
- 1093US11430823B2Method for manufacturing semiconductor image sensor device having deep trench isolationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 30, 2022·2 cites·20 claims
- 1193US10319768B2Image sensor scheme for optical and electrical improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 11, 2019·6 cites·20 claims
- 1292US10825853B2Semiconductor image sensor device with deep trench isolations and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 3, 2020·3 cites·20 claims
- 1392US9728570B2Deep trench isolation fabrication for BSI image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 8, 2017·7 cites·20 claims
- 1491US9508769B1Semiconductor structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 29, 2016·8 cites·20 claims
- 1591US2025366255A1Composite etch stop layers for sensor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1690US9960200B1Selective deposition and planarization for a CMOS image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 1, 2018·7 cites·20 claims
- 1790US2025098350A1Image sensor scheme for optical and electrical improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1888US11908878B2Image sensor and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·1 cites·20 claims
- 1988US11705470B2Image sensor scheme for optical and electrical improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 18, 2023·1 cites·20 claims
- 2088US2025338658A1Stacked structure for cmos image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2187US10998364B2Image sensor scheme for optical and electrical improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 4, 2021·1 cites·20 claims
- 2287US2025366248A1Isolation structure having an air gap to reduce pixel crosstalkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2386US12302663B2Bond pad structure for bonding improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted May 13, 2025·0 cites·20 claims
- 2486US12199120B2Image sensor scheme for optical and electrical improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
- 2586US2025349597A1Image sensor with dual trench isolation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2686US2025366244A1Semiconductor isolation structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2785US12490538B2Stacked structure for CMOS image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 2, 2025·0 cites·20 claims
- 2884US12433059B2Composite etch stop layers for sensor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 30, 2025·0 cites·20 claims
- 2984US11682652B2Notched wafer and bonding support structure to improve wafer stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 20, 2023·1 cites·20 claims
- 3083US11158708B1Graphene channel silicon carbide power semiconductor transistorUNIV SOUTHEAST·Filed 2018·Granted Oct 26, 2021·4 cites·6 claims
- 3183US10526703B2Film formation apparatus for forming semiconductor structure having shower head with plural hole patterns and with corresponding different plural hole densitiesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 7, 2020·3 cites·20 claims
- 3283US9859323B1Complementary metal-oxide-semiconductor (CMOS) image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·4 cites·20 claims
- 3383US2025366252A1Bond pad structure for bonding improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3483US2024395843A1Image sensor and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3583US2024379727A1Method of Forming Semiconductor DeviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3682US12113090B2Bond pad structure for bonding improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 8, 2024·0 cites·20 claims
- 3782US10475847B2Semiconductor device having stress-neutralized film stack and method of fabricating sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 12, 2019·2 cites·20 claims
- 3881US12211741B2Multi-wafer capping layer for metal arcing protectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
- 3981US10325949B2Image Sensor DeviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 18, 2019·2 cites·20 claims
- 4081US2025105056A1Multi-wafer capping layer for metal arcing protectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4180US12125763B2Trim wall protection method for multi-wafer stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 4280US11041242B2Gas shower head with plural hole patterns and with corresponding different plural hole densities and film formation methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 22, 2021·1 cites·20 claims
- 4379US12451391B2Image sensor with dual trench isolation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 21, 2025·0 cites·20 claims
- 4479US12142628B2Method of forming semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 12, 2024·0 cites·20 claims
- 4579US11749760B2Composite etch stop layers for sensor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 5, 2023·0 cites·20 claims
- 4679US2024363469A1Trim wall protection method for multi-wafer stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4779US2023395631A1Image sensor and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4878US12154927B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 26, 2024·0 cites·20 claims
- 4978US12046550B2Three dimensional MIM capacitor having a comb structure and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 23, 2024·0 cites·20 claims
- 5078US2025351605A1Image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
Showing the top 50 of 86 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →