Inventor · disambiguated record
Shiann-Ming Liou
Also filed as: LIOU SHIANN · LIOU SHIANN-MING
74 granted patents·13 pending applications·690 citations·filing 1990–2023
99Inventor score
Files withMARVELL INT LTD25MARVELL WORLD TRADE LTD23LIOU SHIANN-MING9INNOGRIT TECHNOLOGIES CO LTD8LIU CHENGLIN7
Top patents by PatentIndex Score
87 records- 0198US8471376B1Integrated circuit packaging configurationsLIOU SHIANN-MING·Filed 2010·Granted Jun 25, 2013·49 cites·19 claims
- 0297US8022522B1Semiconductor packageMARVELL INT LTD·Filed 2006·Granted Sep 20, 2011·42 cites·11 claims
- 0397US7675157B2Thermal enhanced packageMARVELL WORLD TRADE LTD·Filed 2006·Granted Mar 9, 2010·55 cites·19 claims
- 0496US9768144B2Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrateMARVELL WORLD TRADE LTD·Filed 2016·Granted Sep 19, 2017·11 cites·19 claims
- 0596US7808075B1Integrated circuit devices with ESD and I/O protectionMARVELL INT LTD·Filed 2006·Granted Oct 5, 2010·47 cites·51 claims
- 0695US7883947B1Method of fabricating a device with ESD and I/O protectionMARVELL INT LTD·Filed 2010·Granted Feb 8, 2011·15 cites·20 claims
- 0794US9240372B1Semiconductor die having lead wires formed over a circuit in a shielded areaMARVELL INT LTD·Filed 2014·Granted Jan 19, 2016·13 cites·11 claims
- 0894US5434105AProcess for attaching a lead frame to a heat sink using a glob-top encapsulationNAT SEMICONDUCTOR CORP·Filed 1994·Granted Jul 18, 1995·148 cites·9 claims
- 0992US7957094B1Thermal solution for drive systems such as hard disk drives and digital versatile discsMARVELL INT LTD·Filed 2010·Granted Jun 7, 2011·8 cites·11 claims
- 1091US9209163B2Package-on-package structuresKAO HUAHUNG·Filed 2012·Granted Dec 8, 2015·13 cites·19 claims
- 1191US8673687B1Etched hybrid die packageLIU CHENGLIN·Filed 2010·Granted Mar 18, 2014·12 cites·19 claims
- 1289US11308380B1Removable non-volatile storage cardINNOGRIT TECHNOLOGIES CO LTD·Filed 2021·Granted Apr 19, 2022·3 cites·7 claims
- 1389US9666571B2Package-on-package structuresMARVELL WORLD TRADE LTD·Filed 2015·Granted May 30, 2017·6 cites·17 claims
- 1489US9275929B2Package assembly having a semiconductor substrateMARVELL WORLD TRADE LTD·Filed 2015·Granted Mar 1, 2016·6 cites·20 claims
- 1589US8581374B1Placing heat sink into packaging by strip formation assemblyCHEN CHENDER·Filed 2011·Granted Nov 12, 2013·11 cites·19 claims
- 1689US8482112B1Semiconductor packageLIOU SHIANN-MING·Filed 2011·Granted Jul 9, 2013·8 cites·16 claims
- 1787US9224677B1Semiconductor packageMARVELL INT LTD·Filed 2013·Granted Dec 29, 2015·6 cites·14 claims
- 1887US7764462B1Thermal solution for drive systems such as hard disk drives and digital versatile discsMARVELL INT LTD·Filed 2006·Granted Jul 27, 2010·9 cites·12 claims
- 1986US10128171B1Leadframe with improved half-etch layout to reduce defects caused during singulationMARVELL INT LTD·Filed 2017·Granted Nov 13, 2018·5 cites·10 claims
- 2085US8884419B1Integrated circuit packaging configurationsMARVELL INT LTD·Filed 2013·Granted Nov 11, 2014·6 cites·20 claims
- 2183US8637975B1Semiconductor device having lead wires connecting bonding pads formed on opposite sides of a core region forming a shield areaLIOU SHIANN-MING·Filed 2012·Granted Jan 28, 2014·5 cites·10 claims
- 2283US8030098B1Pre-formed conductive bumps on bonding padsMARVELL INT LTD·Filed 2008·Granted Oct 4, 2011·9 cites·16 claims
- 2382US8912664B1Leadless multi-chip module structureMARVELL INT LTD·Filed 2014·Granted Dec 16, 2014·4 cites·15 claims
- 2482US8218261B1Thermal solution for drive systems such as hard disk drives and digital versatile discsLIU CHENGLIN·Filed 2011·Granted Jul 10, 2012·3 cites·10 claims
- 2581US8358013B1Leadless multi-chip module structureMARVELL INT LTD·Filed 2008·Granted Jan 22, 2013·7 cites·13 claims
- 2681US8319353B1Pre-formed conductive bumps on bonding padsLIOU SHIANN-MING·Filed 2011·Granted Nov 27, 2012·5 cites·21 claims
- 2780US9666510B2Dual row quad flat no-lead semiconductor packageMARVELL WORLD TRADE LTD·Filed 2016·Granted May 30, 2017·3 cites·19 claims
- 2880US8860193B2Pad configurations for an electronic package assemblySUTARDJA SEHAT·Filed 2011·Granted Oct 14, 2014·4 cites·15 claims
- 2980US8686547B1Stack die structure for stress reduction and facilitation of electromagnetic shieldingKAO HUAHUNG·Filed 2011·Granted Apr 1, 2014·7 cites·20 claims
- 3079US8355221B1Thermal solution for drive systems such as hard disk drives and digital versatile discsMARVELL INT LTD·Filed 2012·Granted Jan 15, 2013·2 cites·12 claims
- 3179US6770982B1Semiconductor device power distribution system and methodMARVELL INT LTD·Filed 2002·Granted Aug 3, 2004·22 cites·32 claims
- 3278US7999395B1Pillar structure on bump padMARVELL INT LTD·Filed 2010·Granted Aug 16, 2011·4 cites·13 claims
- 3377US9355951B2Interconnect layouts for electronic assembliesKAO HUAHUNG·Filed 2010·Granted May 31, 2016·5 cites·3 claims
- 3477US8999755B1Etched hybrid die packageMARVELL INT LTD·Filed 2014·Granted Apr 7, 2015·3 cites·18 claims
- 3577US7700475B1Pillar structure on bump padMARVELL INT LTD·Filed 2007·Granted Apr 20, 2010·10 cites·15 claims
- 3675US7911053B2Semiconductor packaging with internal wiring busMARVELL WORLD TRADE LTD·Filed 2008·Granted Mar 22, 2011·5 cites·15 claims
- 3774US9257410B2Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrateWU ALBERT·Filed 2011·Granted Feb 9, 2016·2 cites·26 claims
- 3874US8518742B1Semiconductor packaging with internal wiring busLIU CHENGLIN·Filed 2011·Granted Aug 27, 2013·3 cites·10 claims
- 3974US7560309B1Drop-in heat sink and exposed die-back for molded flip die packageMARVELL INT LTD·Filed 2005·Granted Jul 14, 2009·6 cites·14 claims
- 4073US9070679B2Semiconductor package with a semiconductor die embedded within substratesWU ALBERT·Filed 2010·Granted Jun 30, 2015·3 cites·11 claims
- 4173US8848313B1Thermal solution for drive systems such as hard disk drives and digital versatile discsMARVELL INT LTD·Filed 2013·Granted Sep 30, 2014·1 cites·12 claims
- 4273US7969022B1Die-to-die wire-bondingMARVELL INT LTD·Filed 2008·Granted Jun 28, 2011·5 cites·7 claims
- 4372US5650667AProcess of forming conductive bumps on the electrodes of semiconductor chips using lapping and the bumps thereby createdNAT SEMICONDUCTOR CORP·Filed 1995·Granted Jul 22, 1997·39 cites·21 claims
- 4471US9064860B1Method for forming one or more vias through a semiconductor substrate and forming a redistribution layer on the semiconductor substrateMARVELL INT LTD·Filed 2014·Granted Jun 23, 2015·2 cites·11 claims
- 4570US9288909B2Ball grid array package substrate with through holes and method of forming sameMARVELL WORLD TRADE LTD·Filed 2013·Granted Mar 15, 2016·2 cites·15 claims
- 4669US8754506B1Through via semiconductor die with backside redistribution layerLIOU SHIANN-MING·Filed 2009·Granted Jun 17, 2014·3 cites·7 claims
- 4769US8673689B2Single layer BGA substrate processLIOU SHIANN-MING·Filed 2012·Granted Mar 18, 2014·2 cites·13 claims
- 4868US9425139B2Dual row quad flat no-lead semiconductor packageMARVELL WORLD TRADE LTD·Filed 2013·Granted Aug 23, 2016·2 cites·18 claims
- 4967US8258616B1Semiconductor dice having a shielded area created under bond wires connecting pairs of bonding padsLIOU SHIANN-MING·Filed 2004·Granted Sep 4, 2012·10 cites·23 claims
- 5066US8357568B2Thermal enhanced packageMARVELL INT TECHNOLOGY LTD·Filed 2009·Granted Jan 22, 2013·2 cites·20 claims
Showing the top 50 of 87 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →