Inventor · disambiguated record
Shun Matsui
Also filed as: MATSUI SHUN
36 granted patents·19 pending applications·60 citations·filing 2014–2025
95Inventor score
Top patents by PatentIndex Score
55 records- 0196US10424520B1Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Sep 24, 2019·15 cites·9 claims
- 0295US9487863B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2015·Granted Nov 8, 2016·8 cites·8 claims
- 0393US9431220B1Substrate processing apparatus and substrate processing systemHITACHI INT ELECTRIC INC·Filed 2015·Granted Aug 30, 2016·10 cites·15 claims
- 0489US10934622B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2018·Granted Mar 2, 2021·5 cites·9 claims
- 0589US9171734B1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Oct 27, 2015·8 cites·19 claims
- 0689US2025054794A1Processing method, method of manufacturing semiconductor device, substrate processing apparatus and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0785US12165894B2Processing method, method of manufacturing semiconductor, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2023·Granted Dec 10, 2024·0 cites·18 claims
- 0884US10685832B1Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2019·Granted Jun 16, 2020·3 cites·8 claims
- 0984US10453720B1Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2018·Granted Oct 22, 2019·3 cites·18 claims
- 1080US12093021B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Sep 17, 2024·0 cites·17 claims
- 1180US10651068B1Method of manufacturing semiconductor device by setting process chamber to maintenance enable stateKOKUSAI ELECTRIC CORP·Filed 2019·Granted May 12, 2020·1 cites·12 claims
- 1279US11749550B2Method of manufacturing semiconductor device by setting process chamber maintenance enable stateKOKUSAI ELECTRIC CORP·Filed 2021·Granted Sep 5, 2023·0 cites·20 claims
- 1379US2025340983A1Substrate processing apparatus with cleaning of exhaust systemKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1475US9728431B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2015·Granted Aug 8, 2017·2 cites·9 claims
- 1574US11747789B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Granted Sep 5, 2023·0 cites·15 claims
- 1673US11289350B2Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Mar 29, 2022·1 cites·15 claims
- 1773US10533250B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2018·Granted Jan 14, 2020·1 cites·15 claims
- 1872US11355372B2Method of manufacturing semiconductor device by setting process chamber to maintenance enable stateKOKUSAI ELECTRIC CORP·Filed 2020·Granted Jun 7, 2022·0 cites·19 claims
- 1972US11342212B2Method of manufacturing semiconductor device by setting process chamber maintenance enable stateKOKUSAI ELECTRIC CORP·Filed 2020·Granted May 24, 2022·0 cites·20 claims
- 2070US10984991B2Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2019·Granted Apr 20, 2021·1 cites·20 claims
- 2167US9735068B2Method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2016·Granted Aug 15, 2017·1 cites·16 claims
- 2267US9402049B2Image processing apparatus and control method thereofCANON KK·Filed 2014·Granted Jul 26, 2016·1 cites·15 claims
- 2367US2022360822A1Substrate processing system, method of processing substrate, recording medium, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 2466US12392032B2Substrate processing apparatus with cleaning of exhaust systemKOKUSAI ELECTRIC CORP·Filed 2022·Granted Aug 19, 2025·0 cites·17 claims
- 2565US2022154341A1Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 2663US11314234B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Apr 26, 2022·0 cites·15 claims
- 2763US2025079231A1Substrate processing apparatus, rotation state detection method, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2862US11422528B2Substrate processing system, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Aug 23, 2022·0 cites·16 claims
- 2962US2025011931A1Substrate processing apparatus, substrate processing method, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 3061US10978361B2Substrate processing apparatus and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Apr 13, 2021·0 cites·17 claims
- 3161US2016276135A1Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2016·Application pending·0 cites
- 3260US2021292904A1Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 3360US2019218664A1Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2019·Application pending·0 cites
- 3458US12457408B2Image processing apparatus, control method, and storage mediumCANON KK·Filed 2024·Granted Oct 28, 2025·0 cites·21 claims
- 3558US2020123654A1Method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Application pending·0 cites
- 3657US11343426B2Notifying apparatus, image capturing apparatus, notifying method, and storage medium for making a notification of motion blurCANON KK·Filed 2019·Granted May 24, 2022·0 cites·30 claims
- 3756US11891697B2Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2021·Granted Feb 6, 2024·0 cites·13 claims
- 3856US10503152B2Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2018·Granted Dec 10, 2019·0 cites·12 claims
- 3955US2019221468A1Substrate Processing ApparatusKOKUSAI ELECTRIC CORP·Filed 2019·Application pending·0 cites
- 4054US2023085140A1Substrate processing apparatus, method of manufacturing semiconductor device, and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 4153US10224227B2Method of processing substrateHITACHI INT ELECTRIC INC·Filed 2018·Granted Mar 5, 2019·0 cites·19 claims
- 4252US11019254B2Image processing apparatus, control method for image processing apparatus, and storage medium having correction of effect of virtual light sourceCANON KK·Filed 2019·Granted May 25, 2021·0 cites·7 claims
- 4352US10541170B2Substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Jan 21, 2020·0 cites·20 claims
- 4450US10978310B2Method of manufacturing semiconductor device and non-transitory computer-readable recording medium capable of adjusting substrate temperatureKOKUSAI ELECTRIC CORP·Filed 2019·Granted Apr 13, 2021·0 cites·17 claims
- 4549US10930533B2Substrate processing apparatus, substrate processing system and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Feb 23, 2021·0 cites·9 claims
- 4649US2022090263A1Substrate Processing SystemKOKUSAI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 4748US10714316B2Method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2018·Granted Jul 14, 2020·0 cites·19 claims
- 4848US2016276183A1Substrate Processing ApparatusHITACHI INT ELECTRIC INC·Filed 2016·Application pending·0 cites
- 4946US2017081764A1Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2016·Application pending·0 cites
- 5046US2016056035A1Method of Manufacturing Semiconductor DeviceHITACHI INT ELECTRIC INC·Filed 2015·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →