Inventor · disambiguated record
Shunsuke Moriya
Also filed as: MORIYA SHUNSUKE
10 granted patents·21 pending applications·10 citations·filing 2017–2025
81Inventor score
Files withNISSAN CHEMICAL CORP31
Top patents by PatentIndex Score
31 records- 0188US11732214B2Cleaning agent composition comprising an alkylamide solvent and a fluorine-containing quaternary ammonium saltNISSAN CHEMICAL CORP·Filed 2020·Granted Aug 22, 2023·2 cites·14 claims
- 0283US11926765B2Adhesive composition for peeling off by irradiation with light, layered product, and production method and peeling method for layered productNISSAN CHEMICAL CORP·Filed 2019·Granted Mar 12, 2024·3 cites·13 claims
- 0380US11183415B2Adhesive containing polydimethyl siloxaneNISSAN CHEMICAL CORP·Filed 2017·Granted Nov 23, 2021·3 cites·18 claims
- 0479US2025376645A1Method for producing processed semiconductor substrateNISSAN CHEMICAL CORP·Filed 2025·Application pending·0 cites
- 0577US11776837B2Adhesive agent composition, layered product and production method for layered product, and method for reducing thickness of semiconductor forming substrateNISSAN CHEMICAL CORP·Filed 2019·Granted Oct 3, 2023·2 cites·4 claims
- 0673US2024301263A1Adhesive composition for infrared peeling, laminate, method for producing laminate, and peeling methodNISSAN CHEMICAL CORP·Filed 2024·Application pending·0 cites
- 0772US2024376356A1Temporary adhesive containing epoxy-modified polysiloxaneNISSAN CHEMICAL CORP·Filed 2024·Application pending·0 cites
- 0864US12339586B2Photocurable resin composition containing self-crosslinkable polymerNISSAN CHEMICAL CORP·Filed 2023·Granted Jun 24, 2025·0 cites·12 claims
- 0963US2025153225A1Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and peeling compositionNISSAN CHEMICAL CORP·Filed 2025·Application pending·0 cites
- 1061US2025172869A1Wafer end protective-film forming composition for semiconductor manufacturingNISSAN CHEMICAL CORP·Filed 2023·Application pending·0 cites
- 1159US12227678B2Laminate peeling method, laminate, and laminate production methodNISSAN CHEMICAL CORP·Filed 2019·Granted Feb 18, 2025·0 cites·4 claims
- 1258US2023131533A1Method for cleaning semiconductor substrate, method for producing processed semiconductor substrate, and peeling compositionNISSAN CHEMICAL CORP·Filed 2021·Application pending·0 cites
- 1358US2023129238A1Cleaning agent composition and method for producing processed semiconductor substrateNISSAN CHEMICAL CORP·Filed 2021·Application pending·0 cites
- 1456US2022002602A1Adhesive composition for infrared peeling, laminate, method for producing laminate, and peeling methodNISSAN CHEMICAL CORP·Filed 2019·Application pending·0 cites
- 1555US12297381B2Laminate, release agent composition, and method for manufacturing processed semiconductor substrateNISSAN CHEMICAL CORP·Filed 2021·Granted May 13, 2025·0 cites·6 claims
- 1655US2025361419A1Composition for forming coating film for removing foreign matters and semiconductor substrateNISSAN CHEMICAL CORP·Filed 2023·Application pending·0 cites
- 1754US2024393693A1Silicon-containing resist underlayer film forming composition, laminate using the composition, and method for manufacturing semiconductor elementNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 1853US2025014901A1Wafer edge protective film-forming composition for semiconductor manufacturingNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 1952US2025011507A1Polycyclic aromatic hydrocarbon photocurable resin compositionNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 2051US12077686B2Temporary adhesive containing epoxy-modified polysiloxaneNISSAN CHEMICAL CORP·Filed 2018·Granted Sep 3, 2024·0 cites·8 claims
- 2150US2024182766A1Adhesive composition, laminate, method for producing laminate, and method for producing semiconductor substrateNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 2249US2024006221A1Laminate, method for manufacturing laminate, and method for manufacturting semiconductor substrateNISSAN CHEMICAL CORP·Filed 2021·Application pending·0 cites
- 2348US2024199924A1Laminate, release agent composition, and method for manufacturing processed semiconductor substrateNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 2448US2023250314A1Composition for forming a coating film for removing foreign mattersNISSAN CHEMICAL CORP·Filed 2021·Application pending·0 cites
- 2548US2024213072A1Laminate, release agent composition, and method for manufacturing processed semiconductor substrateNISSAN CHEMICAL CORP·Filed 2022·Application pending·0 cites
- 2645US2023151307A1Method for manufacturing semiconductor substrate, method for manufacturing processed semiconductor substrate, and release compositionNISSAN CHEMICAL CORP·Filed 2021·Application pending·0 cites
- 2745US2023343629A1Laminate and release agent compositionNISSAN CHEMICAL CORP·Filed 2021·Application pending·0 cites
- 2845US2023131428A1Semiconductor substrate cleaning method, processed semiconductor substrate manufacturing method, and composition for peelingNISSAN CHEMICAL CORP·Filed 2021·Application pending·0 cites
- 2944US2022411684A1Adhesive composition, laminate and method for producing same, method for peeling laminate, and method for processing semiconductor-forming substrateNISSAN CHEMICAL CORP·Filed 2020·Application pending·0 cites
- 3043US11472168B2Laminated body including novolac resin as peeling layerNISSAN CHEMICAL CORP·Filed 2018·Granted Oct 18, 2022·0 cites·17 claims
- 3141US11345837B2Temporary adhesive containing phenyl group-containing polysiloxaneNISSAN CHEMICAL CORP·Filed 2018·Granted May 31, 2022·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →