Inventor · disambiguated record
Shunsuke Nakai
Also filed as: NAKAI SHUNSUKE
21 granted patents·3 pending applications·287 citations·filing 2000–2023
96Inventor score
Top patents by PatentIndex Score
24 records- 0193US7214122B2Substrate polishing apparatusEBARA CORP·Filed 2005·Granted May 8, 2007·19 cites·14 claims
- 0292US8554356B2Processing end point detection method, polishing method, and polishing apparatusSHIMIZU NOBURU·Filed 2007·Granted Oct 8, 2013·25 cites·9 claims
- 0392US7438627B2Polishing state monitoring methodEBARA CORP·Filed 2007·Granted Oct 21, 2008·17 cites·6 claims
- 0491US7645181B2Polishing state monitoring apparatus and polishing apparatusEBARA CORP·Filed 2008·Granted Jan 12, 2010·13 cites·13 claims
- 0591US7252575B2Polishing state monitoring apparatus and polishing apparatus and methodSHIMADZU CORP·Filed 2003·Granted Aug 7, 2007·44 cites·18 claims
- 0689US6785010B2Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatusEBARA CORP·Filed 2000·Granted Aug 31, 2004·35 cites·16 claims
- 0788US7072050B2Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatusEBARA CORP·Filed 2004·Granted Jul 4, 2006·29 cites·18 claims
- 0887US6657737B2Method and apparatus for measuring film thicknessEBARA CORP·Filed 2000·Granted Dec 2, 2003·40 cites·2 claims
- 0986US6758723B2Substrate polishing apparatusEBARA CORP·Filed 2002·Granted Jul 6, 2004·20 cites·8 claims
- 1079US7675634B2Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatusEBARA CORP·Filed 2008·Granted Mar 9, 2010·4 cites·16 claims
- 1179US7428064B2Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatusEBARA CORP·Filed 2006·Granted Sep 23, 2008·4 cites·12 claims
- 1278US7585204B2Substrate polishing apparatusEBARA CORP·Filed 2009·Granted Sep 8, 2009·4 cites·7 claims
- 1378US6942543B2Substrate polishing apparatusSHIMADZU CORP·Filed 2004·Granted Sep 13, 2005·12 cites·10 claims
- 1477US7241202B2Substrate polishing apparatusSHIMADZU CORP·Filed 2005·Granted Jul 10, 2007·4 cites·10 claims
- 1575US8342907B2Polishing state monitoring methodEBARA CORP·Filed 2009·Granted Jan 1, 2013·3 cites·9 claims
- 1673US7507144B2Substrate polishing apparatusEBARA CORP·Filed 2007·Granted Mar 24, 2009·3 cites·16 claims
- 1765US10207390B2Processing end point detection method, polishing method, and polishing apparatusEBARA CORP·Filed 2013·Granted Feb 19, 2019·1 cites·12 claims
- 1863US7547242B2Substrate polishing apparatusEBARA CORP·Filed 2004·Granted Jun 16, 2009·7 cites·18 claims
- 1961US2023378717A1Laser oscillator and direct diode laser processing apparatus provided with samePANASONIC IP MAN CO LTD·Filed 2023·Application pending·0 cites
- 2053US7510460B2Substrate polishing apparatusEBARA CORP·Filed 2007·Granted Mar 31, 2009·0 cites·4 claims
- 2152US7101257B2Substrate polishing apparatusSHIMADZU CORP·Filed 2003·Granted Sep 5, 2006·3 cites·4 claims
- 2243US2022166448A1Communication deviceSONY GROUP CORP·Filed 2019·Application pending·0 cites
- 2342US2004242121A1Substrate polishing apparatusFiled 2003·Application pending·0 cites
- 2441US11854638B2Nonvolatile semiconductor storage device and read voltage correction methodMEGACHIPS CORP·Filed 2022·Granted Dec 26, 2023·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →