Inventor · disambiguated record
Shingo Nohara
Also filed as: NOHARA SHINGO
14 granted patents·8 pending applications·43 citations·filing 2014–2025
89Inventor score
Technology areasH10P
Top patents by PatentIndex Score
22 records- 0193US9620357B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Apr 11, 2017·8 cites·14 claims
- 0290US9349586B2Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted May 24, 2016·8 cites·18 claims
- 0388US9865451B2Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Jan 9, 2018·8 cites·16 claims
- 0487US10032626B2Method of manufacturing semiconductor device by forming a film on a substrate, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Jul 24, 2018·9 cites·15 claims
- 0583US9698007B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Granted Jul 4, 2017·3 cites·16 claims
- 0682US9793107B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Oct 17, 2017·4 cites·16 claims
- 0773US12467689B2Furnace opening structure, substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Nov 11, 2025·0 cites·20 claims
- 0871US12195848B2Method of cleaning, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Granted Jan 14, 2025·0 cites·22 claims
- 0971US9881789B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Jan 30, 2018·1 cites·10 claims
- 1069US9831082B2Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Nov 28, 2017·1 cites·16 claims
- 1167US9673043B2Method of manufacturing semiconductor device, substrate processing apparatus, substrate processing system and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Jun 6, 2017·1 cites·13 claims
- 1261US2025210346A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1359US2024425972A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1458US11618947B2Method of cleaning, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Apr 4, 2023·0 cites·19 claims
- 1558US2024312777A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1658US2024003005A1Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1757US12494363B2Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2022·Granted Dec 9, 2025·0 cites·18 claims
- 1857US2023402281A1Processing method, method of manufacturing semiconductor device, processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1954US2025305132A1Method of processing substrate, method of manufacturing semiconductor device, recording medium, substrate processing apparatus, and gas supply systemKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 2053US2019311898A1Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Application pending·0 cites
- 2150US12040179B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Jul 16, 2024·0 cites·19 claims
- 2240US2019024232A1Substrate processing apparatus and substrate retainerHITACHI INT ELECTRIC INC·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →