Inventor · disambiguated record
Shinya Soneda
Also filed as: SONEDA SHINYA
33 granted patents·16 pending applications·14 citations·filing 2015–2025
93Inventor score
Files withMITSUBISHI ELECTRIC CORP49
Top patents by PatentIndex Score
49 records- 0188US11276773B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Mar 15, 2022·2 cites·9 claims
- 0282US9972675B1Power semiconductor device and method thereforMITSUBISHI ELECTRIC CORP·Filed 2017·Granted May 15, 2018·3 cites·5 claims
- 0382US9799648B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Oct 24, 2017·4 cites·9 claims
- 0480US11610882B2Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Mar 21, 2023·1 cites·5 claims
- 0577US9472548B2Reverse conducting semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Oct 18, 2016·3 cites·6 claims
- 0676US11094691B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Aug 17, 2021·1 cites·12 claims
- 0774US12342606B2Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Granted Jun 24, 2025·0 cites·6 claims
- 0873US2024355814A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0962US2025240992A1Semiconductor device, and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1061US10957691B2Semiconductor device, semiconductor device manufacturing method, and power conversion apparatusMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Mar 23, 2021·0 cites·3 claims
- 1160US2025151299A1Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1259US12341503B2Semiconductor device and method for controlling the sameMITSUBISHI ELECTRIC CORP·Filed 2023·Granted Jun 24, 2025·0 cites·6 claims
- 1359US12068310B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Aug 20, 2024·0 cites·7 claims
- 1458US10600779B2Semiconductor device, semiconductor device manufacturing method, and power conversion apparatusMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Mar 24, 2020·0 cites·5 claims
- 1557US2024313095A1Rc-igbtMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 1657US2024203830A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1755US12300569B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Granted May 13, 2025·0 cites·14 claims
- 1855US12243795B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Granted Mar 4, 2025·0 cites·16 claims
- 1955US2024047454A1Semiconductor device and method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 2054US12328933B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Granted Jun 10, 2025·0 cites·14 claims
- 2154US2018308838A1Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Application pending·0 cites
- 2254US2025142852A1Semiconductor apparatusMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 2353US12328887B2Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Jun 10, 2025·0 cites·48 claims
- 2453US12142605B2Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2022·Granted Nov 12, 2024·0 cites·14 claims
- 2553US11621321B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Apr 4, 2023·0 cites·49 claims
- 2653US11239329B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Feb 1, 2022·0 cites·23 claims
- 2752US11256171B2Film resist and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Feb 22, 2022·0 cites·13 claims
- 2852US2023131163A1Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 2952US2024379831A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 3051US12402337B2Semiconductor device and method for controlling semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Granted Aug 26, 2025·0 cites·18 claims
- 3151US11799023B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Oct 24, 2023·0 cites·15 claims
- 3251US10186571B2Power semiconductor device and method thereforMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jan 22, 2019·0 cites·1 claims
- 3351US2025212488A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 3451US2022302289A1Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 3550US12020935B2Method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Jun 25, 2024·0 cites·8 claims
- 3650US2023163122A1Rc-igbtMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 3750US2023083162A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 3850US2022416064A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 3949US12154976B2Semiconductor device and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Nov 26, 2024·0 cites·24 claims
- 4048US11875990B2Semiconductor device including IGBT, boundary, and diode regionsMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Jan 16, 2024·0 cites·6 claims
- 4148US10950566B2Semiconductor device and method for manufacturing the semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Mar 16, 2021·0 cites·17 claims
- 4248US10833574B2Switching element control deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Nov 10, 2020·0 cites·5 claims
- 4347US12507427B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Dec 23, 2025·0 cites·12 claims
- 4447US11462615B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Oct 4, 2022·0 cites·11 claims
- 4547US2025366143A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 4646US12002806B2Reverse conducting semiconductor device and method for manufacturing reverse conducting semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Jun 4, 2024·0 cites·13 claims
- 4745US12159944B2RC-IGBT with lifetime control layerMITSUBISHI ELECTRIC CORP·Filed 2021·Granted Dec 3, 2024·0 cites·3 claims
- 4845US11322604B2Semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2020·Granted May 3, 2022·0 cites·9 claims
- 4941US11264245B2Method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Mar 1, 2022·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →