Inventor · disambiguated record
Shiann-Tsong Tsai
Also filed as: TSAI SHIANN-TSONG
24 granted patents·9 pending applications·61 citations·filing 2002–2024
93Inventor score
Top patents by PatentIndex Score
33 records- 0197US11227846B2Semiconductor package having improved thermal interface between semiconductor die and heat spreading structureMEDIATEK INC·Filed 2020·Granted Jan 18, 2022·7 cites·14 claims
- 0280US11302657B2Semiconductor package having improved thermal interface between semiconductor die and heat spreading structureMEDIATEK INC·Filed 2020·Granted Apr 12, 2022·1 cites·9 claims
- 0380US9842831B2Semiconductor package and fabrication method thereofMEDIATEK INC·Filed 2016·Granted Dec 12, 2017·3 cites·15 claims
- 0479US7859118B2Multi-substrate region-based package and method for fabricating the sameUTAC TAIWAN CORP·Filed 2008·Granted Dec 28, 2010·9 cites·21 claims
- 0578US11239179B2Semiconductor package and fabrication method thereofTSAI SHIANN TSONG·Filed 2020·Granted Feb 1, 2022·1 cites·31 claims
- 0675US11967570B2Semiconductor package having improved thermal interface between semiconductor die and heat spreading structureMEDIATEK INC·Filed 2022·Granted Apr 23, 2024·0 cites·12 claims
- 0775US7091623B2Multi-chip semiconductor package and fabrication method thereofULTRATERA CORP·Filed 2004·Granted Aug 15, 2006·22 cites·7 claims
- 0873US11705413B2Semiconductor package having improved thermal interface between semiconductor die and heat spreading structureMEDIATEK INC·Filed 2021·Granted Jul 18, 2023·0 cites·12 claims
- 0973US10037936B2Semiconductor package with coated bonding wires and fabrication method thereofMEDIATEK INC·Filed 2016·Granted Jul 31, 2018·2 cites·9 claims
- 1070US10847488B2Semiconductor package having multi-tier bonding wires and components directly mounted on the multi-tier bonding wiresMEDIATEK INC·Filed 2018·Granted Nov 24, 2020·1 cites·19 claims
- 1167US12266620B2Manufacturing method of flip chip package structureAMAZING COOL TECH CORP·Filed 2024·Granted Apr 1, 2025·0 cites·12 claims
- 1267US11869849B2Semiconductor package with EMI shielding structureMEDIATEK INC·Filed 2022·Granted Jan 9, 2024·0 cites·14 claims
- 1367US10276465B2Semiconductor package assemblyMEDIATEK INC·Filed 2017·Granted Apr 30, 2019·1 cites·29 claims
- 1465US11257780B2Semiconductor package having multi-tier bonding wires and components directly mounted on the multi-tier bonding wiresMEDIATEK INC·Filed 2020·Granted Feb 22, 2022·0 cites·15 claims
- 1562US11355450B2Semiconductor package with EMI shielding structureMEDIATEK INC·Filed 2020·Granted Jun 7, 2022·0 cites·13 claims
- 1661US7993970B2Semiconductor device and fabrication method thereofUTAC TAIWAN CORP·Filed 2009·Granted Aug 9, 2011·2 cites·14 claims
- 1759US11955443B2Flip chip package structure and manufacturing method thereofAMAZING COOL TECH CORP·Filed 2022·Granted Apr 9, 2024·0 cites·6 claims
- 1857US7951644B2Semiconductor device and method for fabricating the sameUNITED TEST CT INC·Filed 2009·Granted May 31, 2011·1 cites·14 claims
- 1957US6879030B2Strengthened window-type semiconductor packageULTRATERA CORP·Filed 2002·Granted Apr 12, 2005·9 cites·13 claims
- 2056US7772034B2Fabrication method of semiconductor deviceUTAC TAIWAN CORP·Filed 2008·Granted Aug 10, 2010·1 cites·6 claims
- 2153US10340259B2Method for fabricating a semiconductor packageMEDIATEK INC·Filed 2017·Granted Jul 2, 2019·0 cites·20 claims
- 2247US10685943B2Semiconductor chip package with resilient conductive paste post and fabrication method thereofMEDIATEK INC·Filed 2017·Granted Jun 16, 2020·0 cites·14 claims
- 2347US2020075364A1Glue dispensing apparatusKE HUANG CORP·Filed 2018·Application pending·0 cites
- 2446US2010163605A1Ball implantation method and system applying the methodUNITED TEST CT INC·Filed 2009·Application pending·0 cites
- 2546US2023371187A1Package substrate structureAMAZING COOL TECH CORPORATION·Filed 2023·Application pending·0 cites
- 2645US2019166078A1Social-network information connection systemSPEED 3D INC·Filed 2017·Application pending·0 cites
- 2745US2010052161A1Semiconductor wafer with adhesive protection layerUTAC TAIWAN CORP·Filed 2008·Application pending·0 cites
- 2842US10008441B2Semiconductor packageMEDIATEK INC·Filed 2016·Granted Jun 26, 2018·0 cites·29 claims
- 2942US6825064B2Multi-chip semiconductor package and fabrication method thereofULTRATERA CORP·Filed 2002·Granted Nov 30, 2004·1 cites·10 claims
- 3041US2015105889A1Cloud 3d model construction system and construction method thereofTSAI SHIANN-TSONG·Filed 2013·Application pending·0 cites
- 3137US2012220081A1Method of fabricating a semiconductor package structureTSAI SHIANN-TSONG·Filed 2011·Application pending·0 cites
- 3235US2019166301A1Mutual-operable photo-capturing systemSPEED 3D INC·Filed 2017·Application pending·0 cites
- 3329US2016240015A1Three-dimensional avatar generating system, device and method thereofSPEED 3D INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →