Inventor · disambiguated record
Shang-Ying Tsai
Also filed as: TSAI SHANG-YING
91 granted patents·6 pending applications·520 citations·filing 2008–2024
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD56TAIWAN SEMICONDUCTOR MFG21WU TING-HAU7ILLUMINA INC3HUANG HSIN-TING2
Top patents by PatentIndex Score
97 records- 0199US8377798B2Method and structure for wafer to wafer bonding in semiconductor packagingTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Feb 19, 2013·222 cites·23 claims
- 0298US9238581B2Triple-axis MEMS accelerometerTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 19, 2016·50 cites·20 claims
- 0398US9181083B2MEMS devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Nov 10, 2015·52 cites·20 claims
- 0497US9138994B2MEMS devices and methods of fabrication thereofPENG JUNG-HUEI·Filed 2010·Granted Sep 22, 2015·49 cites·20 claims
- 0595US9919914B2MEMS devices including MEMS dies and connectors theretoTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 20, 2018·9 cites·20 claims
- 0695US9656260B2Method to produce chemical pattern in micro-fluidic structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 23, 2017·7 cites·7 claims
- 0794US10486153B2Method to produce chemical pattern in micro-fluidic structureILLUMINA INC·Filed 2017·Granted Nov 26, 2019·6 cites·20 claims
- 0892US9352315B2Method to produce chemical pattern in micro-fluidic structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 31, 2016·8 cites·20 claims
- 0991US8941152B1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 27, 2015·11 cites·20 claims
- 1090US8905293B2Self-removal anti-stiction coating for bonding processLIU PING-YIN·Filed 2010·Granted Dec 9, 2014·12 cites·19 claims
- 1190US8841201B2Systems and methods for post-bonding wafer edge sealTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 23, 2014·12 cites·20 claims
- 1290US8580594B2Method of fabricating a semiconductor device having recessed bonding siteHUANG HSIN-TING·Filed 2011·Granted Nov 12, 2013·13 cites·18 claims
- 1389US10850976B2Method of making ohmic contact on low doped bulk silicon for optical alignmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 1, 2020·2 cites·20 claims
- 1488US11298697B2Method to produce chemical pattern in micro-fluidic structureILLUMINA INC·Filed 2019·Granted Apr 12, 2022·2 cites·12 claims
- 1588US9352956B2MEMS devices and methods for forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 31, 2016·5 cites·20 claims
- 1687US10710871B2MEMS devices including MEMS dies and connectors theretoTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 14, 2020·2 cites·20 claims
- 1787US10654707B2Method of stiction prevention by patterned anti-stiction layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 19, 2020·2 cites·20 claims
- 1887US8455999B2Method for reducing chip warpageWU TING-HAU·Filed 2011·Granted Jun 4, 2013·5 cites·20 claims
- 1986US10266390B2Methods of forming micro-electro-mechanical devices including a conductive feature extending through an escort ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 23, 2019·2 cites·20 claims
- 2086US10131533B1Microelectromechanical system device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 20, 2018·3 cites·20 claims
- 2185US10508023B2MEMS devices including MEMS dies and connectors theretoTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·2 cites·20 claims
- 2285US9114396B2Method of making flowcell with micro-fluid structureTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Aug 25, 2015·7 cites·20 claims
- 2385US8928162B2Sensor with energy-harvesting deviceTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jan 6, 2015·4 cites·20 claims
- 2483US12412863B2Die attached leveling control by metal stopper bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 9, 2025·0 cites·20 claims
- 2581US12358783B2Wire-bond damper for shock absorptionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 15, 2025·0 cites·20 claims
- 2681US12303888B2Method to produce chemical pattern in micro-fluidic structureILLUMINA INC·Filed 2022·Granted May 20, 2025·0 cites·17 claims
- 2780US2024270565A1Composite spring structure to reinforce mechanical robustness of a mems deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2879US8053336B2Method for reducing chip warpageTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Nov 8, 2011·5 cites·19 claims
- 2979US2024375939A1Stopper bump structures for mems deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3079US2025112081A1Vacuum wafer chuck for manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3178US12322722B2Die attached leveling control by metal stopper bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 3278US11993510B2Composite spring structure to reinforce mechanical robustness of a MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 28, 2024·0 cites·20 claims
- 3378US9355896B2Package systemsTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted May 31, 2016·2 cites·20 claims
- 3476US11530130B2Method of making ohmic contact on low doped bulk silicon for optical alignmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·0 cites·20 claims
- 3575US11485631B2Method of making ohmic contact on low doped bulk silicon for optical alignmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 1, 2022·0 cites·20 claims
- 3675US11104129B2MEMS devices and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 31, 2021·0 cites·20 claims
- 3775US9150404B2Semiconductor device with through molding viasTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 6, 2015·3 cites·20 claims
- 3874US12191185B2Vacuum wafer chuck for manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 7, 2025·0 cites·20 claims
- 3974US11713242B2MEMS device with dummy-area utilization for pressure enhancementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 1, 2023·0 cites·20 claims
- 4073US12497285B2Stopper bump structures for MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 16, 2025·0 cites·20 claims
- 4173US11117796B2MEMS devices including MEMS dies and connectors theretoTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 14, 2021·0 cites·20 claims
- 4272US11765975B2Thermocouple deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 19, 2023·0 cites·20 claims
- 4372US11542151B2MEMS apparatus with anti-stiction layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 3, 2023·0 cites·20 claims
- 4471US11987494B2Wire-bond damper for shock absorptionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 21, 2024·0 cites·20 claims
- 4571US8674495B2Package systems having a eutectic bonding material and manufacturing methods thereofSHU CHIA-PAO·Filed 2011·Granted Mar 18, 2014·2 cites·20 claims
- 4670US11420866B2Composite spring structure to reinforce mechanical robustness of a MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 23, 2022·0 cites·20 claims
- 4770US7998775B2Silicon undercut prevention in sacrificial oxide release process and resulting MEMS structuresTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Aug 16, 2011·3 cites·14 claims
- 4869US11923331B2Die attached leveling control by metal stopper bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 5, 2024·0 cites·20 claims
- 4969US10688786B2MEMS devices and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 23, 2020·0 cites·20 claims
- 5068US9269679B2Wafer level packaging techniquesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 23, 2016·2 cites·20 claims
Showing the top 50 of 97 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →