Inventor · disambiguated record
Shinji Wakisaka
Also filed as: WAKISAKA SHINJI
31 granted patents·8 pending applications·807 citations·filing 1992–2022
97Inventor score
Top patents by PatentIndex Score
39 records- 0197US9406637B2Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereofTERA PROBE INC·Filed 2014·Granted Aug 2, 2016·36 cites·20 claims
- 0290US7888238B2Method of manufacturing semiconductor device having semiconductor formation regions of different planar sizesCASIO COMPUTER CO LTD·Filed 2008·Granted Feb 15, 2011·18 cites·22 claims
- 0390US7427812B2Semiconductor device with increased number of external connection electrodesCASIO COMPUTER CO LTD·Filed 2005·Granted Sep 23, 2008·20 cites·18 claims
- 0489US11328998B2Semiconductor device and manufacturing method of semiconductor deviceAOI ELECTRONICS CO LTD·Filed 2020·Granted May 10, 2022·2 cites·13 claims
- 0587US6112174ARecognition dictionary system structure and changeover method of speech recognition system for car navigationHITACHI LTD·Filed 1997·Granted Aug 29, 2000·132 cites·26 claims
- 0687US5702895AMethod and kit for detecting methicillin-resistant Staphylococcus aureusWAKUNAGA SEIYAKU KK·Filed 1996·Granted Dec 30, 1997·188 cites·11 claims
- 0786USRE43380ESemiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereofWAKISAKA SHINJI·Filed 2010·Granted May 15, 2012·7 cites·47 claims
- 0886US7563640B2Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereofCASIO COMPUTER CO LTD·Filed 2007·Granted Jul 21, 2009·10 cites·11 claims
- 0986US7042081B2Semiconductor device having heat dissipation layerCASIO COMPUTER CO LTD·Filed 2004·Granted May 9, 2006·41 cites·20 claims
- 1083US7808073B2Network electronic component, semiconductor device incorporating network electronic component, and methods of manufacturing bothCASIO COMPUTER CO LTD·Filed 2005·Granted Oct 5, 2010·12 cites·12 claims
- 1183US7075181B2Semiconductor package having semiconductor constructing body and method of manufacturing the sameCASIO COMPUTER CO LTD·Filed 2004·Granted Jul 11, 2006·22 cites·32 claims
- 1282US5414448ACharacter/pattern generator and information processing systemHITACHI LTD·Filed 1992·Granted May 9, 1995·69 cites·15 claims
- 1381US6310602B1Liquid crystal display system capable of reducing and enlarging resolution of input display dataHITACHI LTD·Filed 2000·Granted Oct 30, 2001·18 cites·7 claims
- 1481US5917944ACharacter recognizing and translating system and voice recognizing and translating systemHITACHI LTD·Filed 1996·Granted Jun 29, 1999·89 cites·14 claims
- 1576US6587120B2Liquid crystal display system capable of reducing and enlarging resolution of input display dataHITACHI LTD·Filed 2001·Granted Jul 1, 2003·14 cites·6 claims
- 1674US7368813B2Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereofCASIO COMPUTER CO LTD·Filed 2004·Granted May 6, 2008·14 cites·20 claims
- 1773US7553698B2Semiconductor package having semiconductor constructing body and method of manufacturing the sameCASIO COMPUTER CO LTD·Filed 2006·Granted Jun 30, 2009·3 cites·23 claims
- 1872US6148105ACharacter recognizing and translating system and voice recognizing and translating systemHITACHI LTD·Filed 1999·Granted Nov 14, 2000·60 cites·10 claims
- 1971US8319346B2Semiconductor structure and manufacturing method of semiconductor structureWAKISAKA SHINJI·Filed 2011·Granted Nov 27, 2012·3 cites·8 claims
- 2070US8754525B2Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereofTERAMIKROS INC·Filed 2013·Granted Jun 17, 2014·2 cites·20 claims
- 2168US6118429ALiquid crystal display system capable of reducing and enlarging resolution of input display dataHITACHI LTD·Filed 1994·Granted Sep 12, 2000·25 cites·29 claims
- 2264US9105580B2Semiconductor device including semiconductor construct installed on base plate, and manufacturing method of the sameTERA PROBE INC·Filed 2014·Granted Aug 11, 2015·1 cites·17 claims
- 2361US7692282B2Semiconductor device including semiconductor element surrounded by an insulating member wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereofCASIO COMPUTER CO LTD·Filed 2007·Granted Apr 6, 2010·1 cites·21 claims
- 2459US6411929B1Speech recognition method and systemHITACHI LTD·Filed 2000·Granted Jun 25, 2002·9 cites·5 claims
- 2558US7944064B2Semiconductor device having alignment post electrode and method of manufacturing the sameCASIO COMPUTER CO LTD·Filed 2007·Granted May 17, 2011·2 cites·11 claims
- 2656US8946079B2Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereofTERA PROBE INC·Filed 2014·Granted Feb 3, 2015·0 cites·17 claims
- 2755US2025300026A1Semiconductor device and wiring boardAOI ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2853US2025112180A1Semiconductor device and method of manufacturing the sameAOI ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2951US9343428B2Semiconductor device including semiconductor construct installed on base plate, and manufacturing method of the sameTERA PROBE INC·Filed 2015·Granted May 17, 2016·0 cites·20 claims
- 3050US8525335B2Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereofWAKISAKA SHINJI·Filed 2010·Granted Sep 3, 2013·0 cites·13 claims
- 3148US2011115080A1Semiconductor device including semiconductor construct installed on base plate, and manufacturing method of the sameCASIO COMPUTER CO LTD·Filed 2010·Application pending·0 cites
- 3248US2010059895A1Semiconductor device having an interlayer insulating film wiring laminated structure section and method of fabricating the sameCASIO COMPUTER CO LTD·Filed 2009·Application pending·0 cites
- 3345US11376734B2Trajectory control deviceSMC CORP·Filed 2020·Granted Jul 5, 2022·0 cites·7 claims
- 3443US8487443B2Semiconductor structure, manufacturing method of semiconductor structure and semiconductor deviceWAKISAKA SHINJI·Filed 2011·Granted Jul 16, 2013·0 cites·14 claims
- 3539US2011133185A1Semiconductor device formation substrate and semiconductor device manufacturing methodCASIO COMPUTER CO LTD·Filed 2010·Application pending·0 cites
- 3638US2010233853A1Method for manufacturing semiconductor deviceCASIO COMPUTER CO LTD·Filed 2010·Application pending·0 cites
- 3738US2011304043A1Semiconductor device and manufacturing method of the sameWAKISAKA SHINJI·Filed 2011·Application pending·0 cites
- 3837US2004238973A1Semiconductor device having alignment post electrode and method of manufacturing the sameCASIO COMPUTER CO LTD·Filed 2004·Application pending·0 cites
- 3933US6631349B1Speech recognition method and systemHITACHI LTD·Filed 1997·Granted Oct 7, 2003·9 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →