Inventor · disambiguated record
Siqing Lu
Also filed as: LU SIQING
26 granted patents·15 pending applications·1,049 citations·filing 2000–2023
96Inventor score
Top patents by PatentIndex Score
41 records- 0198US6461435B1Showerhead with reduced contact areaAPPLIED MATERIALS INC·Filed 2000·Granted Oct 8, 2002·600 cites·22 claims
- 0296US6660126B2Lid assembly for a processing system to facilitate sequential deposition techniquesAPPLIED MATERIALS INC·Filed 2001·Granted Dec 9, 2003·128 cites·28 claims
- 0395US6734020B2Valve control system for atomic layer deposition chamberAPPLIED MATERIALS INC·Filed 2001·Granted May 11, 2004·135 cites·11 claims
- 0493US7799704B2Gas baffle and distributor for semiconductor processing chamberAPPLIED MATERIALS INC·Filed 2008·Granted Sep 21, 2010·15 cites·10 claims
- 0591USD1038049SCover ring for use in semiconductor processing chamberAPPLIED MATERIALS INC·Filed 2020·Granted Aug 6, 2024·21 cites·1 claims
- 0691US7740706B2Gas baffle and distributor for semiconductor processing chamberAPPLIED MATERIALS INC·Filed 2006·Granted Jun 22, 2010·19 cites·19 claims
- 0791US7722719B2Gas baffle and distributor for semiconductor processing chamberAPPLIED MATERIALS INC·Filed 2005·Granted May 25, 2010·22 cites·29 claims
- 0889US11996315B2Thin substrate handling via edge clampingAPPLIED MATERIALS INC·Filed 2020·Granted May 28, 2024·2 cites·20 claims
- 0989US11538697B2Substrate processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 27, 2022·2 cites·20 claims
- 1084US7789993B2Internal balanced coil for inductively coupled high density plasma processing chamberAPPLIED MATERIALS INC·Filed 2007·Granted Sep 7, 2010·8 cites·6 claims
- 1184US7572647B2Internal balanced coil for inductively coupled high density plasma processing chamberAPPLIED MATERIALS INC·Filed 2007·Granted Aug 11, 2009·10 cites·7 claims
- 1282US7651587B2Two-piece dome with separate RF coils for inductively coupled plasma reactorsAPPLIED MATERIALS INC·Filed 2005·Granted Jan 26, 2010·8 cites·15 claims
- 1381US7510624B2Self-cooling gas delivery apparatus under high vacuum for high density plasma applicationsAPPLIED MATERIALS INC·Filed 2004·Granted Mar 31, 2009·21 cites·17 claims
- 1480US9685655B2Complex showerhead coating apparatus with electrospray for lithium ion batteryAPPLIED MATERIALS INC·Filed 2014·Granted Jun 20, 2017·2 cites·19 claims
- 1579US7355394B2Apparatus and method of dynamically measuring thickness of a layer of a substrateAPPLIED MATERIALS INC·Filed 2006·Granted Apr 8, 2008·9 cites·17 claims
- 1679US7201803B2Valve control system for atomic layer deposition chamberAPPLIED MATERIALS INC·Filed 2003·Granted Apr 10, 2007·21 cites·6 claims
- 1778US7112961B2Method and apparatus for dynamically measuring the thickness of an objectAPPLIED MATERIALS INC·Filed 2003·Granted Sep 26, 2006·18 cites·45 claims
- 1871US11728198B2Electrostatic chuck and wafer etching device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 15, 2023·1 cites·18 claims
- 1968US11244839B2Plasma processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 8, 2022·1 cites·12 claims
- 2067US7811411B2Thermal management of inductively coupled plasma reactorsAPPLIED MATERIALS INC·Filed 2005·Granted Oct 12, 2010·2 cites·15 claims
- 2166US10529618B2Methods of manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 7, 2020·1 cites·17 claims
- 2263US7777483B2Method and apparatus for measuring a thickness of a layer of a waferAPPLIED MATERIALS INC·Filed 2008·Granted Aug 17, 2010·3 cites·19 claims
- 2363US2008044568A1Anti-clogging nozzle for semiconductor processingAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 2462US12106945B2Plasma processing apparatus and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 1, 2024·0 cites·20 claims
- 2561US12100579B2Deposition ring for thin substrate handling via edge clampingAPPLIED MATERIALS INC·Filed 2020·Granted Sep 24, 2024·0 cites·20 claims
- 2660US2008124944A1Gas baffle and distributor for semiconductor processing chamberAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 2756US12400833B2Methods and apparatus for processing a substrateAPPLIED MATERIALS INC·Filed 2021·Granted Aug 26, 2025·0 cites·16 claims
- 2855US2025118580A1Systems and Methods for Detecting a Substrate in a Chamber of a Substrate Processing SystemAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2954US11881375B2Common substrate and shadow ring lift apparatusAPPLIED MATERIALS INC·Filed 2021·Granted Jan 23, 2024·0 cites·20 claims
- 3053US2020176230A1Plasma processing apparatus and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 3153US2008188090A1Internal balanced coil for inductively coupled high density plasma processing chamberAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 3250US2006048707A1Anti-clogging nozzle for semiconductor processingAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
- 3347US2021151300A1Substrate processing apparatus and semiconductor device manufacturing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
- 3446US2021384012A1Substrate processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
- 3545US2009031955A1Vacuum chucking heater of axisymmetrical and uniform thermal profileAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 3645US2005218115A1Anti-clogging nozzle for semiconductor processingAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 3744US2006075967A1Magnetic-field concentration in inductively coupled plasma reactorsAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
- 3844US2006177600A1Inductive plasma system with sidewall magnetAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 3940US2002121241A1Processing chamber and method of distributing process fluids therein to facilitate sequential deposition of filmsFiled 2001·Application pending·0 cites
- 4039US2007029046A1Methods and systems for increasing substrate temperature in plasma reactorsAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 4136US2019198296A1Plasma Processing Apparatus and Method of Manufacturing Semiconductor Device Using the SameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →