Inventor · disambiguated record
Siddharth Ravichandran
Also filed as: RAVICHANDRAN SIDDHARTH
7 granted patents·10 pending applications·3 citations·filing 2019–2025
73Inventor score
Top patents by PatentIndex Score
17 records- 0176US12107328B2Electronic devices with interconnected ground structuresAPPLE INC·Filed 2022·Granted Oct 1, 2024·1 cites·20 claims
- 0275US12334455B2Semiconductor package with integrated capacitorsCHIPLETZ INC·Filed 2024·Granted Jun 17, 2025·0 cites·13 claims
- 0375US2025293133A1Through Package Vertical Interconnect and Method of Making SameCHIPLETZ INC·Filed 2025·Application pending·0 cites
- 0474US12315787B2Embedded semiconductor packages and methods thereofGEORGIA TECH RES INST·Filed 2024·Granted May 27, 2025·0 cites·20 claims
- 0573US2025273604A1Semiconductor Package with Integrated CapacitorsCHIPLETZ INC·Filed 2025·Application pending·0 cites
- 0671US10916841B2Techniques to increase antenna-to-antenna isolation suitable for enhanced MIMO performanceNVIDIA CORP·Filed 2019·Granted Feb 9, 2021·2 cites·20 claims
- 0767US2023343687A1Through Package Vertical Interconnect and Method of Making SameCHIPLETZ INC·Filed 2023·Application pending·0 cites
- 0866US12288756B2Semiconductor package with integrated capacitorsCHIPLETZ INC·Filed 2022·Granted Apr 29, 2025·0 cites·10 claims
- 0958US2025210548A1Embedded voltage regulation moduleCHIPLETZ INC·Filed 2024·Application pending·0 cites
- 1057US12027453B2Embedded semiconductor packages and methods thereofGEORGIA TECH RES INST·Filed 2020·Granted Jul 2, 2024·0 cites·31 claims
- 1153US2024120293A1Method and Apparatus for Prevention, Cessation, Detection, and Monitoring of Cracks in SubstratesCHIPLETZ INC·Filed 2023·Application pending·0 cites
- 1252US2024258041A1Low-Equivalent-Series-Resistance Capacitors with Solid-State Current Collectors Using Conductive InksCHIPLETZ INC·Filed 2024·Application pending·0 cites
- 1351US2024337799A1Co-Packaging Assembly and Method for Attaching Photonic Dies/Modules to Multi-Chip Active/Passive SubstrateCHIPLETZ INC·Filed 2023·Application pending·0 cites
- 1451US2023395305A1Inductors Embedded in Package Substrate and Board and Method and System for Manufacturing the SameCHIPLETZ INC·Filed 2023·Application pending·0 cites
- 1550US11428169B2Abradable sealing elementROLLS ROYCE PLC·Filed 2020·Granted Aug 30, 2022·0 cites·20 claims
- 1647US2023411174A1Package Assembly and Method of Attaching Multi-Height Dies/Modules to Multi-Chip Active/Passive SubstrateCHIPLETZ INC·Filed 2022·Application pending·0 cites
- 1746US2022206221A1Optical die-last wafer-level fanout package with fiber attach capabilityADVANCED MICRO DEVICES INC·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →