Inventor · disambiguated record
Siang Miang Yeo
Also filed as: YEO SIANG MIANG
5 granted patents·1 pending application·14 citations·filing 2017–2023
73Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0191US10121742B2Method of forming a packaged semiconductor device using ganged conductive connective assembly and structureAMKOR TECHNOLOGY INC·Filed 2017·Granted Nov 6, 2018·10 cites·20 claims
- 0280US10896869B2Method of manufacturing a semiconductor deviceAMKOR TECHNOLOGY INC·Filed 2018·Granted Jan 19, 2021·3 cites·20 claims
- 0375US12354934B2Method of manufacturing a semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 0468US10833008B2Method of forming a packaged semiconductor device using ganged conductive connective assembly and structureAMKOR TECHNOLOGY INC·Filed 2018·Granted Nov 10, 2020·1 cites·20 claims
- 0565US11764135B2Method of manufacturing a semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Sep 19, 2023·0 cites·10 claims
- 0660US2021013142A1Method of forming a packaged semiconductor device using ganged conductive connective assembly and structureAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →