Inventor · disambiguated record
Soomoon Park
Also filed as: PARK SOOMOON
9 granted patents·3 pending applications·42 citations·filing 2008–2025
84Inventor score
Top patents by PatentIndex Score
12 records- 0189US8115293B2Integrated circuit packaging system with interconnect and method of manufacture thereofMOON DONGSOO·Filed 2009·Granted Feb 14, 2012·26 cites·20 claims
- 0279US8785251B2Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor dieSTATS CHIPPAC LTD·Filed 2013·Granted Jul 22, 2014·4 cites·25 claims
- 0377US8569895B2Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor diePARK SOOMOON·Filed 2012·Granted Oct 29, 2013·4 cites·18 claims
- 0467US7682872B2Integrated circuit package system with underfillSTATS CHIPPAC LTD·Filed 2008·Granted Mar 23, 2010·4 cites·18 claims
- 0566US8143096B2Integrated circuit package system flip chipPARK SOOMOON·Filed 2008·Granted Mar 27, 2012·4 cites·20 claims
- 0665US12196969B2Display deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 14, 2025·0 cites·12 claims
- 0750US12072535B2Display deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 27, 2024·0 cites·17 claims
- 0846US8193036B2Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor diePARK SOOMOON·Filed 2010·Granted Jun 5, 2012·0 cites·20 claims
- 0946US2025343156A1Semiconductor package and semiconductor package manufacturing methodSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1045US2010244212A1Integrated circuit packaging system with post type interconnector and method of manufacture thereofHA JONG-WOO·Filed 2009·Application pending·0 cites
- 1140US2010237500A1Semiconductor Substrate and Method of Forming Conformal Solder Wet-Enhancement Layer on Bump-on-Lead SiteSTATS CHIPPAC LTD·Filed 2009·Application pending·0 cites
- 1239US8692365B2Integrated circuit packaging system with thermal dispersal structures and method of manufacture thereofMOON DONGSOO·Filed 2011·Granted Apr 8, 2014·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →