Inventor · disambiguated record
Somilkumar J. Rathi
Also filed as: RATHI SOMILKUMAR J
50 granted patents·4 pending applications·34 citations·filing 2018–2024
97Inventor score
Top patents by PatentIndex Score
54 records- 0198US11955512B1Dual hydrogen barrier layer for trench capacitors integrated with low density film for logic structures and methods of fabricationKEPLER COMPUTING INC·Filed 2021·Granted Apr 9, 2024·3 cites·18 claims
- 0297US12289894B1Method of fabricating transistors and stacked planar capacitors for memory and logic applicationsKEPLER COMPUTING INC·Filed 2022·Granted Apr 29, 2025·3 cites·20 claims
- 0397US11871584B1Multi-level hydrogen barrier layers for memory applicationsKEPLER COMPUTING INC·Filed 2021·Granted Jan 9, 2024·2 cites·20 claims
- 0497US11839088B1Integrated via and bridge electrodes for memory array applications and methods of fabricationKEPLER COMPUTING INC·Filed 2021·Granted Dec 5, 2023·2 cites·20 claims
- 0597US11765908B1Memory device fabrication through wafer bondingKEPLER COMPUTING INC·Filed 2023·Granted Sep 19, 2023·4 cites·19 claims
- 0695US11741428B1Iterative monetization of process development of non-linear polar material and devicesKEPLER COMPUTING INC·Filed 2022·Granted Aug 29, 2023·2 cites·19 claims
- 0792US12165918B2Conformal titanium nitride-based thin films and methods of forming sameEUGENUS INC·Filed 2022·Granted Dec 10, 2024·2 cites·19 claims
- 0889US11832537B2Titanium silicon nitride barrier layerEUGENUS INC·Filed 2019·Granted Nov 28, 2023·3 cites·24 claims
- 0989US11482413B2Conformal and smooth titanium nitride layers and methods of forming the sameEUGENUS INC·Filed 2019·Granted Oct 25, 2022·5 cites·23 claims
- 1085US11587784B2Smooth titanium nitride layers and methods of forming the sameEUGENUS INC·Filed 2019·Granted Feb 21, 2023·3 cites·15 claims
- 1182US12274071B1Capacitor integrated with a transistor for logic and memory applicationsKEPLER COMPUTING INC·Filed 2023·Granted Apr 8, 2025·0 cites·22 claims
- 1282US11361992B2Conformal titanium nitride-based thin films and methods of forming sameEUGENUS INC·Filed 2019·Granted Jun 14, 2022·3 cites·32 claims
- 1381US12446231B1Method of integrating a capacitor including a non-linear polar material with a transistor through wafer bondingKEPLER COMPUTING INC·Filed 2023·Granted Oct 14, 2025·0 cites·22 claims
- 1481US12408569B2Titanium silicon nitride barrier layerEUGENUS INC·Filed 2023·Granted Sep 2, 2025·0 cites·19 claims
- 1580US12369326B1Capacitor devices with shared electrode and methods of fabricationKEPLER COMPUTING INC·Filed 2022·Granted Jul 22, 2025·0 cites·20 claims
- 1680US12034086B1Trench capacitors with continuous dielectric layer and methods of fabricationKEPLER COMPUTING INC·Filed 2021·Granted Jul 9, 2024·0 cites·18 claims
- 1780US12029043B1Planar and trench capacitors with hydrogen barrier dielectric for logic and memory applications and methods of fabricationKEPLER COMPUTING INC·Filed 2021·Granted Jul 2, 2024·0 cites·19 claims
- 1880US12022662B1Planar and trench capacitors for logic and memory applications and methods of fabricationKEPLER COMPUTING INC·Filed 2021·Granted Jun 25, 2024·0 cites·19 claims
- 1980US12016185B1Planar and trench capacitors for logic and memory applicationsKEPLER COMPUTING INC·Filed 2021·Granted Jun 18, 2024·0 cites·20 claims
- 2080US11996438B1Pocket flow for trench capacitors integrated with planar capacitors on a same substrate and method of fabricationKEPLER COMPUTING INC·Filed 2021·Granted May 28, 2024·0 cites·20 claims
- 2180US11985832B1Planar and trench capacitors with hydrogen barrier dielectric for logic and memory applicationsKEPLER COMPUTING INC·Filed 2021·Granted May 14, 2024·0 cites·20 claims
- 2280US11961877B1Dual hydrogen barrier layer for trench capacitors integrated with low density film for logic structuresKEPLER COMPUTING INC·Filed 2021·Granted Apr 16, 2024·0 cites·16 claims
- 2379US12439606B1Gate coupled non-linear polar material based capacitors for memory and logicKEPLER COMPUTING INC·Filed 2022·Granted Oct 7, 2025·0 cites·18 claims
- 2479US12376312B1Methods of fabricating planar capacitors on a shared plate electrodeKEPLER COMPUTING INC·Filed 2022·Granted Jul 29, 2025·0 cites·21 claims
- 2579US12349365B2Drain coupled non-linear polar material based capacitors for memory and logicKEPLER COMPUTING INC·Filed 2022·Granted Jul 1, 2025·0 cites·20 claims
- 2679US12336184B1Methods of fabricating trench capacitors on a shared plate electrodeKEPLER COMPUTING INC·Filed 2022·Granted Jun 17, 2025·0 cites·20 claims
- 2779US12328878B1Integration of 2T-NC for memory and logic applicationsKEPLER COMPUTING INC·Filed 2022·Granted Jun 10, 2025·0 cites·20 claims
- 2879US12324163B1Planar capacitors with shared electrode and methods of fabricationKEPLER COMPUTING INC·Filed 2022·Granted Jun 3, 2025·0 cites·20 claims
- 2979US12262541B1Trench capacitors with shared electrodeKEPLER COMPUTING INC·Filed 2022·Granted Mar 25, 2025·0 cites·20 claims
- 3079US12010854B1Multi-level hydrogen barrier layers for memory applications and methods of fabricationKEPLER COMPUTING INC·Filed 2021·Granted Jun 11, 2024·0 cites·20 claims
- 3179US11869843B1Integrated trench and via electrode for memory device applications and methods of fabricationKEPLER COMPUTING INC·Filed 2021·Granted Jan 9, 2024·0 cites·20 claims
- 3279US11869928B2Dual hydrogen barrier layer for memory devicesKEPLER COMPUTING INC·Filed 2021·Granted Jan 9, 2024·0 cites·20 claims
- 3379US11862517B1Integrated trench and via electrode for memory device applicationsKEPLER COMPUTING INC·Filed 2021·Granted Jan 2, 2024·0 cites·20 claims
- 3479US11844225B1Dual hydrogen barrier layer for memory devices integrated with low density film for logic structures and methods of fabricationKEPLER COMPUTING INC·Filed 2021·Granted Dec 12, 2023·0 cites·20 claims
- 3579US11844203B1Conductive and insulative hydrogen barrier layer for memory devicesKEPLER COMPUTING INC·Filed 2021·Granted Dec 12, 2023·0 cites·20 claims
- 3679US11839070B1High density dual encapsulation materials for capacitors and methods of fabricationKEPLER COMPUTING INC·Filed 2021·Granted Dec 5, 2023·0 cites·20 claims
- 3777US12094923B2Rapid thermal annealing (RTA) methodologies for integration of perovskite-material based memory devicesKEPLER COMPUTING INC·Filed 2022·Granted Sep 17, 2024·0 cites·13 claims
- 3877US11942365B2Multi-region diffusion barrier containing titanium, silicon and nitrogenEUGENUS INC·Filed 2018·Granted Mar 26, 2024·2 cites·30 claims
- 3977US11908704B2Method of fabricating a perovskite-material based planar capacitor using rapid thermal annealing (RTA) methodologiesKEPLER COMPUTING INC·Filed 2022·Granted Feb 20, 2024·0 cites·20 claims
- 4076US12464730B2Method of forming capacitors through wafer bondingKEPLER COMPUTING INC·Filed 2023·Granted Nov 4, 2025·0 cites·21 claims
- 4176US12147941B2Iterative monetization of precursor in process development of non-linear polar material and devicesKEPLER COMPUTING INC·Filed 2023·Granted Nov 19, 2024·0 cites·17 claims
- 4276US11894417B2Method of fabricating a perovskite-material based trench capacitor using rapid thermal annealing (RTA) methodologiesKEPLER COMPUTING INC·Filed 2022·Granted Feb 6, 2024·0 cites·20 claims
- 4376US11769790B2Rapid thermal annealing (RTA) methodologies for integration of perovskite-material based trench capacitorsKEPLER COMPUTING INC·Filed 2022·Granted Sep 26, 2023·0 cites·21 claims
- 4475US12324162B1Stacked capacitors with shared electrodes and methods of fabricationKEPLER COMPUTING INC·Filed 2022·Granted Jun 3, 2025·0 cites·20 claims
- 4575US2024347397A1Method of memory device fabrication through iterative multilayer stack developmentKEPLER COMPUTING INC·Filed 2024·Application pending·0 cites
- 4673US12302905B1Field-deployable antimicrobial product assemblies for air and water purification and methods of fabrication of the sameKAVACH NANOTECHNOLOGIES INC·Filed 2024·Granted May 20, 2025·0 cites·20 claims
- 4772US12444603B2Smooth titanium nitride layers and methods of forming the sameEUGENUS INC·Filed 2023·Granted Oct 14, 2025·0 cites·19 claims
- 4872US12308226B2Conformal and smooth titanium nitride layers and methods of forming the sameEUGENUS INC·Filed 2022·Granted May 20, 2025·0 cites·20 claims
- 4970US2025087534A1Multi-region diffusion barrier containing titanium, silicon and nitrogenEUGENUS INC·Filed 2024·Application pending·0 cites
- 5070US2024274651A1Method of forming stacked capacitors through wafer bondingKEPLER COMPUTING INC·Filed 2023·Application pending·0 cites
Showing the top 50 of 54 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →